Audio listening system
View Patent ↗A headphone assembly is provided and includes a headband assembly comprising at least one end; an ear-cup assembly pivotably engaged to the headband assembly by an engagement structure positioned proximate to the at least one end of the headband assembly, the ear-cup assembly comprising a cap and a housing, wherein the cap and the housing are connected to form an enclosed space inside the ear-cup assembly; a transducer configured to produce sound and positioned within the enclosed space of the ear-cup assembly; and a damper rim positioned between the ear-cup assembly and the at least one end of the headband assembly, the damper rim covering the engagement structure and being engaged to the ear-cup assembly and the at least one end of the headband assembly.
1. A headphone assembly, comprising:
a headband assembly comprising at least one end;
an ear-cup assembly pivotably engaged to the headband assembly by an engagement structure positioned proximate to the at least one end of the headband assembly, the ear-cup assembly defining a transducer chamber having a fixed volume;
a transducer configured to produce sound and positioned within the fixed volume located inside of the ear-cup assembly; wherein the ear-cup assembly comprises an ear-cup housing defining a portion of the transducer chamber positioned behind the transducer; and
a damper rim positioned between the ear-cup assembly and the at least one end of the headband assembly, the damper rim covering the engagement structure and being engaged to the ear-cup assembly and the at least one end of the headband assembly.
2. The headphone assembly of claim 1 , wherein the engagement structure includes a ball-and-socket joint that pivotably connects the ear-cup assembly to the at least one end of the headband assembly.
3. The headphone assembly of claim 1 , wherein the engagement structure includes a circular assembly coupled to a circular receptacle to pivotably connect the ear-cup assembly to the at least one end of the headband assembly.
4. The headphone assembly of claim 1 , wherein the damper rim is positioned substantially parallel to the at least one end of the headband assembly.
5. The headphone assembly of claim 1 , wherein the damper rim is configured to dampen movement of the ear-cup assembly relative to the handband assembly.
6. The headphone assembly of claim 1 , wherein the damper rim is composed of rubber.
7. The headphone assembly of claim 1 , further comprising:
an outer cap removably coupled to the at least one end of the headband assembly; and
a battery compartment positioned within the at least one end of the headband assembly, the battery compartment housing batteries that provide operational power to the headphone assembly, wherein the outer cap is removable to provide access to the battery compartment.
8. A headphone assembly, comprising:
a headband assembly comprising at least one end;
an ear-cup housing being pivotably coupled to the headband assembly at a position adjacent the at least one end and defining a transducer chamber having a fixed volume;
an acoustic transducer positioned within the transducer chamber wherein a portion of the fixed-volume transducer chamber is positioned between the transducer and the at least one end of the headband assembly; and
a damper rim extending between the ear-cup housing and the headband assembly.
9. A headphone assembly according to claim 8 , further comprising an engagement structure configured to pivotably couple the ear-cup housing to the headband assembly at the position adjacent the at least one end.
10. A headphone assembly according to claim 8 , further comprising an ear-cup cap positioned opposite a portion of the ear-cup housing relative to the transducer.
11. A headphone assembly according to claim 10 , wherein the ear-cup cap comprises a grid-like surface for enabling sound from the radiator to radiate outwardly.
12. A headphone assembly according to claim 8 , wherein the damper rim is configured to dampen articulation of the ear-cup relative to the headband assembly.
13. A headphone assembly according to claim 9 , wherein the damper rim obscures the engagement structure.
14. A headphone assembly according to claim 8 , wherein the headband assembly defines a bowed shape and comprises a folding mechanism to permit the ear-cup housing and the corresponding at least one end to be rotated inwardly toward an internal region defined by the headband assembly.
15. A headphone assembly according to claim 8 , wherein the at least one end comprises a first end and wherein the headband assembly further comprises:
a second end positioned opposite the first end;
a first arm corresponding to the first end and a second arm corresponding to the second end; and
an arcuate headband positioned between and movably coupled to each of the first arm and the second arm;
wherein the ear-cup housing comprises a first ear-cup housing and the headphone assembly further comprises a second ear-cup housing, wherein the first ear-cup housing is pivotably coupled to the first arm and the second ear-cup housing is pivotably coupled to the second arm.
16. A headphone assembly according to claim 15 , wherein the first arm is slidably coupled to the arcuate headband.
17. A headphone assembly according to claim 15 , wherein the first arm is hingedly coupled to and inwardly foldable relative to the arcuate headband.
18. A headphone assembly according to claim 15 , wherein each of the first arm and the second arm is slidably and rotatably coupled to the arcuate headband.