Method for electrical connection between elements of a three-dimensional integrated structure and corresponding device

1. A link device for three-dimensional integrated structure comprising:

a plurality of modules, each module having a first end face configured to be in front of a first element, and a second end face configured to be in front of a second element, the first end faces from said plurality of modules being in a first plane, the second end faces from said plurality of modules being in a second plane different from the first plane and being substantially parallel to the first plane;

each module comprising at least one substrate having a surface substantially perpendicular to respective first and second end faces, at least one metallization level on top of the surface and defining an electrically conductive pattern, and an insulating region enclosing said at least one metallization level, said at least one metallization level defining an electrically conductive via extending substantially parallel to the surface and extending vertically between the first and second elements;

said electrically conductive pattern comprising at least one first end part emerging onto the respective first end face, and at least one second end part emerging onto the respective second end face and connected to the at least one first end part.

2. The link device according to claim 1 wherein said electrically conductive pattern comprises a set of electrically conductive lines.

3. The link device according to claim 2 wherein said electrically conductive pattern comprises, on the surface of said at least one substrate, a plurality of substantially parallel metallization levels; and wherein each module comprises a plurality of insulating regions mutually separating said plurality of substantially parallel metallization levels.

4. The link device according to claim 3 wherein each metallization level comprises a set of electrically conductive lines, at least some of said set of electrically conductive lines comprising first ends emerging onto said respective first end face and second ends emerging onto said respective second end face.

5. The link device according to claim 4 wherein said electrically conductive pattern comprises at least one electrically conducting interconnection via between an electrically conductive line of one of the metallization levels and an electrically conductive line of another metallization level.

6. The link device according to claim 1 wherein said electrically conductive pattern comprises a set of electrically conductive lines, at least one of said set of electrically conductive lines emerging at two different locations on one of said respective first and second end faces, one of said at least one first end part and said at least one second end part of said electrically conductive pattern comprising two ends of the at least one line emerging at the two different locations.

7. The link device according to claim 1 wherein at least one of said substrates from said plurality of modules comprises at least one of a ferromagnetic composite, a material having a coefficient of thermal expansion different from at least one other substrate, and an active substrate.

8. The link device according to claim 1 further comprising at least one redistribution electrically conductive level contacting at least one of the at least one first and second end parts and running parallel to a corresponding end face.

9. The link device according to claim 1 further comprising a bonding material between said plurality of modules.

10. An electronic device comprising:

first and second elements; and

a link device connecting said first and second elements and comprising

a plurality of modules, each module having a first end face configured to be adjacent said first element, and a second end face configured to be adjacent said second element, the first end faces from said plurality of modules being in a first plane, the second end faces from said plurality of modules being in a second plane different from the first plane and being substantially parallel to the first plane,

each module comprising at least one substrate having a surface substantially perpendicular to respective first and second end faces, an electrically conductive pattern on the surface, and an insulating region enclosing said electrically conductive pattern, said electrically conductive pattern defining an electrically conductive via extending substantially parallel to the surface and extending vertically between the first and second elements,

said electrically conductive pattern comprising at least one first end part emerging onto the respective first end face, and at least one second end part emerging onto the respective second end face and connected to the first end part.

11. The electronic device according to claim 10 wherein said electrically conductive pattern comprises a set of electrically conductive lines.

12. The electronic device according to claim 10 wherein said electrically conductive pattern comprises, on the surface of said at least one substrate, a plurality of substantially parallel metallization levels; and wherein each module comprises a plurality of insulating regions mutually separating said plurality of substantially parallel metallization levels.

13. A link device comprising:

a plurality of modules, each module having a first end face configured to be adjacent a first element, and a second end face configured to be adjacent a second element, the first end faces from said plurality of modules being in a first plane, the second end faces from said plurality of modules being in a second plane different from the first plane and being substantially parallel to the first plane;

each module comprising at least one substrate having a surface substantially perpendicular to respective first and second end faces, an electrically conductive pattern on the surface, and an insulating region enclosing said electrically conductive pattern, said electrically conductive pattern defining an electrically conductive via extending substantially parallel to the surface and extending vertically between the first and second elements;

said electrically conductive pattern comprising at least one first end part emerging onto the respective first end face, and at least one second end part emerging onto the respective second end face and connected to the at least one first end part.

14. The link device according to claim 13 wherein said electrically conductive pattern comprises a set of electrically conductive lines.

15. The link device according to claim 14 wherein said electrically conductive pattern comprises, on the surface of said at least one substrate, a plurality of substantially parallel metallization levels; and wherein each module comprises a plurality of insulating regions mutually separating said plurality of substantially parallel metallization levels.

16. The link device according to claim 15 wherein each metallization level comprises a set of electrically conductive lines, at least some of said set of electrically conductive lines comprising first ends emerging onto said respective first end face and second ends emerging onto said respective second end face.

17. The link device according to claim 16 wherein said electrically conductive pattern comprises at least one electrically conducting interconnection via between an electrically conductive line of one of the metallization levels and an electrically conductive line of another metallization level.