Head gimbal assembly having a load beam aperature over conductive heating pads that are offset from head bonding pads
View Patent ↗A novel head gimbal assembly (HGA) for use in a disk drive is disclosed. Each of a plurality of electrically conductive traces of a flexure of the HGA includes a connection region that is aligned with and connected to a corresponding one of a plurality of electrically conductive bonding pads of a head. Each of the plurality of electrically conductive traces further includes a heating pad that is offset from its connection region by an offset distance. A dielectric layer of the flexure includes a first opening over the heating pad, a support layer of the flexure includes a second opening over the heating pad, and a load beam of the HGA includes a third opening disposed over the heating pad. During assembly, light may be shined through the openings and onto the heating pad until solder located in the connection region that is offset from the heating pad melts.
1. A method to attach a head to a laminated flexure in a head gimbal assembly (HGA) for use in a disk drive, the method comprising:
positioning the head with respect to the laminated flexure so that a plurality of conductive bonding pads of the head are aligned with a plurality of electrically conductive traces of the laminated flexure;
shining light through at least one opening in a load beam of the HGA and onto a heating pad of at least one of the plurality of electrically conductive traces, until solid solder located in a connection region that is offset from the heating pad melts and joins the at least one of the plurality of electrically conductive traces to a corresponding one of the plurality of conductive bonding pads; and
allowing the solder to solidify in the connection region, to form a solid electrical connection in the connection region between the at least one of the plurality of electrically conductive traces and the corresponding one of the plurality of conductive bonding pads;
wherein the at least one of the plurality of conductive traces is not exposed to the light in the connection region, and wherein the corresponding one of the plurality of conductive bonding pads is also not exposed to the light.
2. The method of claim 1 , wherein the heating pad is heated to a temperature of at least 220° C. but no more than 400° C.
3. The method of claim 1 , wherein the light is ultraviolet light.
4. The method of claim 1 , wherein the light is laser light.
5. The method of claim 1 , wherein the solid solder is a solder bump attached to the at least one of the plurality of electrically conductive traces, in the connection region.
6. The method of claim 1 , wherein the solid solder is a solder bump attached to the corresponding one of the plurality of conductive bonding pads.
7. The method of claim 1 , wherein the light is also shone through openings in a support layer and in a dielectric layer of the laminated flexure.