IP Library Granted Patent US 8,618,205
Granted Patent B2
US 8,618,205 · App. 13/518,448 · Granted Dec 31, 2013

Thermal storage medium composition and thermal storage medium

Inventors: Masashi Shimakage (Tokyo, JP); Takuya Sano (Tokyo, JP); Toshiyuki Hayakawa (Tokyo, JP); Susumu Komiyama (Tokyo, JP); Junji Koujina (Tokyo, JP)
Assignee: JSR Corporation
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Quick Facts
Patent No.
US 8,618,205
App. No.
13/518,448
Granted
Dec 31, 2013
Kind
B2
Abstract

Provided is a thermal storage medium composition which contains 100 parts by mass of a hydrogenated diene copolymer and 50 to 4000 parts by mass of a linear paraffin compound having 12 to 50 carbon atoms, where the hydrogenated diene copolymer is a conjugated diene copolymer that is obtained by hydrogenating a block copolymer which includes a polymer block (A) that contains structural units (a-1) derived from a first conjugated diene compound and has a vinyl bond content of not more than 20 mol %, and a polymer block (B) that contains structural units (b-1) derived from a second conjugated diene compound and has a vinyl bond content of 30 to 95 mol %, the hydrogenation ratio with respect to the double bonds derived from the conjugated diene compounds being not less than 90%.

Claims (12)

1. A thermal storage medium composition which comprises

100 parts by mass of a hydrogenated diene copolymer and

50 to 4000 parts by mass of a linear paraffin compound having 12 to 50 carbon atoms,

the hydrogenated diene copolymer being a conjugated diene copolymer that is obtained by hydrogenating a block copolymer which includes a polymer block (A) that contains structural units (a-1) derived from a first conjugated diene compound and has a vinyl bond content of not more than 20 mol %, and a polymer block (B) that contains structural units (b-1) derived from a second conjugated diene compound and has a vinyl bond content of 30 to 95 mol %, the hydrogenation ratio with respect to the double bonds derived from the conjugated diene compounds being not less than 90%.

2. The thermal storage medium composition according to claim 1 , wherein the mass ratio of the polymer block (A) to the polymer block (B) ((A)/(B)) in the block copolymer is 5/95 to 50/50.

3. The thermal storage medium composition according to claim 1 or 2 , wherein the block copolymer further includes structural units derived from an alkenyl aromatic compound at a content of not more than 30% by mass with respect to the block copolymer.

4. The thermal storage medium composition according to claims 1 or 2 , wherein the structural units (a-1) in the polymer block (A) include 95 to 100% by mass of 1,3-butadiene-derived structural units.

5. The thermal storage medium composition according to claims 1 or 2 , wherein the paraffin compound shows a melting peak at 0 to 70° C. according to differential scanning calorimetry (DSC).

6. The thermal storage medium composition according to claims 1 or 2 , further comprising a filler.

7. A thermal storage medium which is obtained by packing the thermal storage medium composition described in claims 1 or 2 into a packaging material.

8. The thermal storage medium according to claim 7 , wherein the packaging material is a laminate film comprising a heat seal layer as an innermost layer and a layer made of a polar resin with oil resistance.

9. The thermal storage medium composition according to claim 1 or 2 wherein the linear paraffin compound has 16 to 50 carbon atoms.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2023
From: JSR CORPORATION
To: ENEOS MATERIALS CORPORATION
Reel/Frame 062672/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2012
From: SHIMAKAGE, MASASHI; SANO, TAKUYA; HAYAKAWA, TOSHIYUKI; KOMIYAMA, SUSUMU; KOUJINA, JUNJI
To: JSR CORPORATION
Reel/Frame 028452/0774 →
Priority Claims (1)
JP 2009-295960 · Dec 25, 2009 · national
Continuity (1)
Related Publication 20120261607A1 · Oct 18, 2012