IP Library Granted Patent US 9,036,384
Granted Patent B2
US 9,036,384 · App. 13/518,715 · Granted May 19, 2015

Power converter having semiconductor switching element

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,036,384
App. No.
13/518,715
Granted
May 19, 2015
Kind
B2
Abstract

Provided is a configuration in which it is possible to mount an applied voltage suppression circuit configured to prevent voltage breakdown of a semiconductor switching element, and a set voltage thereof can be inspected without damaging an IC or the like of a peripheral circuit. In a power converter having a semiconductor switching element, an applied voltage suppression circuit configured to suppress a voltage applied to the semiconductor switching element and at least one component of constituent components of a driving circuit which causes the semiconductor switching element to be turned off if the component is absent are transferred to and disposed on a slave substrate (separate unit) which is divided from and electrically connected to a master substrate including the semiconductor switching element, the driving circuit, a control circuit, and the like mounted thereon.

Claims (17)

1. A power converter having a semiconductor switching element, comprising:

a semiconductor switching element;

a driving circuit of the semiconductor switching element that includes a plurality of components;

a control circuit; and

an applied voltage suppression circuit configured to detect an applied voltage to the semiconductor switching element, and to feed back a difference signal based on difference between the applied voltage and a predetermined voltage to the driving circuit when the applied voltage is the predetermined voltage or more, thereby suppressing the applied voltage to the predetermined voltage or in the vicinity thereof,

wherein the semiconductor switching element, a first one or more components of the plurality of components of the driving circuit, and the control circuit are mounted on a first substrate,

wherein the applied voltage suppression circuit is disposed on a second substrate that is separate from the first substrate, wherein the second substrate includes electrical contacts configured to mate with corresponding electrical contacts of the first substrate when the second substrate is mounted to the first substrate, and

wherein at least one other component of the plurality of components of the driving circuit is provided on the second substrate such that removal of the at least one other component causes the semiconductor switching element to remain in an off state.

2. A power converter a having a semiconductor switching element, comprising:

a semiconductor switching element;

a driving circuit of the semiconductor switching element that includes a plurality of components;

a power control circuit;

an applied voltage suppression circuit configured to detect an applied voltage to the semiconductor switching element, and to feed back a difference signal based on difference between the applied voltage and a predetermined voltage to the driving circuit when the applied voltage is the predetermined voltage or more, thereby suppressing the applied voltage to the predetermined voltage or in the vicinity thereof;

a first substrate on which the semiconductor switching element, a first one or more components of the plurality of components of the driving circuit, and the power control circuit are mounted; and

a second substrate separate from from the first substrate that includes electrical contacts configured to mate with corresponding electrical contacts of the first substrate when the second substrate is mounted to the first substrate,

wherein the applied voltage suppression circuit is disposed on the second substrate, and

wherein at least one other component of the plurality of components of the driving circuit is provided on the second substrate such that removal of the at least one other component causes the semiconductor switching element to remain in an off state.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2012
From: SUENAGA, HARUO; SHIROKAWA, NOBUO; MORIYA, HIDEAKI; KINOSHITA, MANABU
To: PANASONIC CORPORATION
Reel/Frame 029080/0745 →