IP Library Granted Patent US 9,012,885
Granted Patent B2
US 9,012,885 · App. 13/518,809 · Granted Apr 21, 2015

Light-emitting semiconductor chip

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,012,885
App. No.
13/518,809
Granted
Apr 21, 2015
Kind
B2
Abstract

A semiconductor chip includes a semiconductor body with a semiconductor layer sequence. An active region intended for generating radiation is arranged between an n-conductive multilayer structure and a p-conductive semiconductor layer. A doping profile is formed in the n-conductive multilayer structure which includes at least one doping peak.

Claims (27)

1. A semiconductor chip comprising a semiconductor body with a semiconductor layer sequence, the semiconductor layer sequence comprising:

an n-conductive multilayer structure, wherein a doping profile is formed in the n-conductive multilayer structure, the doping profile comprising at least one doping peak;

a p-conductive semiconductor layer; and

an active region provided for generating radiation, the active region arranged between the n-conductive multilayer structure and the p-conductive semiconductor layer

wherein the n-conducting multilayer structure comprises a quantum structure with a plurality of quantum layers, the quantum layers being arranged between barrier layers;

wherein a doping profile is formed in the n-conductive multilayer structure, the doping profile comprising at least a first doping peak and a second doping peak;

wherein at least one of the plurality of quantum layers of the n-conductive multilayer structure is arranged between the first doping peak and the second doping peak;

wherein the n-conducting multilayer structure comprises a region that is adjacent to the first doping peak, the quantum layers and the barrier layers adjacent to the quantum layers having a low doping concentration in said region, wherein the low doping concentration is at least 1*10 16 cm −3 and at most 1*10 18 cm −3 ; and

wherein a sub-region of the quantum structure of the n-conductive multilayer structure comprises a high doping concentration by way of the second doping peak.

2. The semiconductor chip according to claim 1 , wherein a doping concentration in at least one of the first doping peak and the second doping peak is at least five times as high as a doping concentration in a region of low n-conductive doping of the n-conductive multilayer structure.

3. The semiconductor chip according to claim 2 , wherein the doping concentration in at least one of the first doping peak and the second doping peak is at least 4*10 18 cm −3 and wherein the doping concentration in the region of low n-conductive doping is at most 8*10 17 cm −3 .

4. The semiconductor chip according to claim 1 , wherein at least one of the first doping peak and the second doping peak exhibits a vertical extent of between 1nm and 30nm inclusive.

5. The semiconductor chip according to claim 4 , wherein at least one of the first doping peak and the second doping peak exhibits a vertical extent of between 5 nm and 20 nm inclusive.

6. The semiconductor chip according to claim 1 , wherein at least one of the first doping peak and the second doping peak exhibits a distance from the active region of between 2 nm and 20 nm inclusive.

7. The semiconductor chip according to claim 1 , wherein the active region comprises a plurality of quantum layers, wherein the first doping peak is arranged between the quantum layer of the n-conductive multilayer structure closest to the active region and the quantum layer of the active region closest to the n-conductive multilayer structure.

8. The semiconductor chip according to claim 7 , wherein a band gap of the quantum layer of the n-conductive multilayer structure is at least as large as a band gap of the quantum layer of the active region.

9. The semiconductor chip according to claim 1 , wherein the semiconductor body has a recess that extends through the p-conductive semiconductor layer and the active region into the n-conductive multilayer structure, wherein the recess penetrates the quantum layers of the n-conductive multilayer structure.

10. The semiconductor chip according to claim 1 , wherein the active region is based on a nitride compound semiconductor material.

11. The semiconductor chip according to claim 1 , wherein a growth substrate for the semiconductor layer sequence is removed from the semiconductor body.

12. The semiconductor chip according to claim 1 , wherein:

a doping concentration in at least one of the first doping peak and the second doping peak is at least five times as high as in a region of the n-conductive multilayer structure adjoining the respective one of the first doping peak and the second doping peak;

wherein the active region comprises a quantum structure with at least one quantum layer; and

wherein the n-conducting multilayer structure comprises a quantum structure with a plurality of quantum layers, wherein a band gap of at least one of the plurality of quantum layers of the n-conductive multilayer structure is larger than a band gap of at least one of the plurality of the quantum layer of the active region.

13. The semiconductor chip according to claim 1 , wherein the region having the low doping concentration is arranged on a side of the first doping peak that is remote from the active region.

14. The semiconductor chip according to claim 1 , wherein first doping peak is disposed between the second doping peak and the active region; and

wherein the second doping peak has a larger vertical extent than a vertical extent of the first doping peak.

15. The semiconductor chip according to claim 1 , wherein the doping peak extends over at least two adjacent quantum layers of the plurality of quantum layers and over a barrier layer disposed between the at least two adjacent quantum layers.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2012
From: PETER, MATTHIAS; MEYER, TOBIAS; WALTER, ALEXANDER; TAKI, TETSUYA; OFF, JUERGEN; BUTENDEICH, RAINER; HERTKORN, JOACHIM
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 028791/0511 →