Mold-runner system having independently controllable shooting-pot assemblies
View Patent ↗A mold-tool system for use with a molding-system platen structure, the mold-tool system a frame assembly being connectable with the molding-system platen structure ( 107 ); and a set of shooting-pot assemblies being supported by the frame assembly, wherein control of each shooting-pot assembly of the set of shooting-pot assemblies is independent.
1. A mold-tool system for use with a molding-system platen structure, the mold-tool system comprising:
a frame assembly being connectable with the molding-system platen structure; and
a set of shooting-pot assemblies being supported by the frame assembly, wherein each shooting-pot assembly of the set of shooting-pot assemblies is controlled to actuate independently of other shooting-pot assemblies within the set of shooting-pot assemblies.
2. The mold-tool system of claim 1 , wherein:
the frame assembly includes a hot-runner frame assembly of a mold-runner system, and
the set of shooting-pot assemblies are supported by the hot-runner frame assembly.
3. The mold-tool system of claim 2 , further comprising:
a melt-distribution assembly being connected to the set of shooting-pot assemblies, the melt-distribution assembly configured to distribute a melt to the set of shooting-pot assemblies.
4. The mold-tool system of claim 3 , wherein:
the melt-distribution assembly is configured to:
(i) connect with a first-machine nozzle of a first-melt liquefier being configured to provide a first resin to the melt-distribution assembly; and
(ii) connect with a second-machine nozzle of a second-melt liquefier being configured to supply a second resin to the melt-distribution assembly.
5. The mold-tool system of claim 3 , wherein:
the melt-distribution assembly includes:
a relatively lower-pressure circuit, and
a relatively higher-pressure circuit,
the relatively lower-pressure circuit is configured to connect a machine nozzle of a melt-liquefier assembly with the set of shooting-pot assemblies,
the relatively higher-pressure circuit is configured to connect the set of shooting-pot assemblies with a mold assembly.
6. The mold-tool system of claim 5 , wherein:
the relatively lower-pressure circuit includes:
a grouping of melt-splitter assemblies, and
a collection of conduits,
the grouping of melt-splitter assemblies and the collection of conduits are configured to connect the machine nozzle of the melt-liquefier assembly with the set of shooting-pot assemblies in accordance with a hierarchy of interconnected levels.
7. The mold-tool system of claim 6 , wherein:
the collection of conduits includes flexible conduits.
8. The mold-tool system of claim 6 , wherein:
the collection of conduits includes rigid conduits.
9. The mold-tool system of claim 3 , wherein:
at least one shooting-pot assembly of the set of shooting-pot assemblies has a different volume of melt in comparison to a volume of melt in at least one other shooting-pot assembly of the set of shooting-pot assemblies.
10. The mold-tool system of claim 3 , further comprising:
a sensor assembly being connected with shooting-pot assemblies of the set of shooting-pot assemblies, the sensor assembly being configured to provide sensed signals indicating: (i) a position parameter, and (ii) a speed parameter associated with the shooting-pot assemblies;
a group of shooting-pot actuators being connected with a respective shooting-pot assembly of the set of shooting-pot assemblies; and
a computer system, including:
a processor;
a sensor-interface module connecting the processor with the sensor assembly;
a control-interface module connecting the processor with the group of shooting-pot actuators; and
a controller-usable medium connected with the processor, the controller-usable medium embodying a collection of instructions being executable by the processor, the collection of instructions being configured to direct the processor to:
monitor, via the sensor-interface module, the sensed signals associated with the sensor assembly; and
control, via the control-interface module, the group of shooting-pot actuators in response to monitoring of the sensed signals associated with the shooting-pot assemblies, so that the control of the each shooting-pot assembly of the set of shooting-pot assemblies is independent.
11. The mold-tool system of claim 10 , wherein:
the melt-distribution assembly is configured to:
(i) connect with a first-machine nozzle of a first-melt liquefier being configured to provide a first resin to the melt-distribution assembly; and
(ii) connect with a second-machine nozzle of a second-melt liquefier being configured to supply a second resin to the melt-distribution assembly.
12. The mold-tool system of claim 10 , wherein:
the melt-distribution assembly includes:
a relatively lower-pressure circuit, and
a relatively higher-pressure circuit,
the relatively lower-pressure circuit is configured to connect a machine nozzle of a melt-liquefier assembly with the set of shooting-pot assemblies,
the relatively higher-pressure circuit is configured to connect the set of shooting-pot assemblies with a mold assembly.
13. The mold-tool system of claim 12 , wherein:
the relatively lower-pressure circuit includes:
a grouping of melt-splitter assemblies, and
a collection of conduits,
the grouping of melt-splitter assemblies and the collection of conduits are configured to connect the machine nozzle of the melt-liquefier assembly with the set of shooting-pot assemblies in accordance with a hierarchy of interconnected levels.
14. The mold-tool system of claim 10 , wherein:
at least one shooting-pot assembly of the set of shooting-pot assemblies has a different volume of melt in comparison to a volume of melt in at least one other shooting-pot assembly of the set of shooting-pot assemblies.
15. The mold-tool system of claim 1 , further comprising:
a mold assembly being connectable with the set of shooting-pot assemblies.