Thermo-electric cooling system and method for cooling electronic devices
A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface.
1. A thermo-electric cooling (TEC) system for cooling of a device, the TEC system comprising:
at least first and second heat pumping assemblies, each heat pumping assembly having a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated, said at least first and second heat pumping assemblies being arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to an electronic device which is to be cooled by evacuating heat therefrom; and
a control unit associated at least with said second heat pumping assembly, and configured and operable for operating said second heat pumping assembly to maintain substantially constant temperature of said thermal interface and for generating an operation scheme specifying the heat pumping rates and respective durations according to which said first heat pumping assembly is operated in order to accurately adjust the temperature of said device.
2. The TEC system of claim 1 , wherein at least one of said first and second heat pumping assembly comprises one or more thermo-electric heat pumps.
3. The TEC system of claim 1 , wherein said first heat pumping assembly comprises at least one thermo-electric heat pump based on the thin film technology.
4. The TEC system of claim 1 , wherein at least one of said first and second heat pumping assemblies includes more than one heat pump, the pumps being arranged in a cascade fashion.
5. The TEC system of claim 1 , wherein the control unit is configured and operable to operate said second heat pumping assembly to provide the temperature of the heat drain of said first heat pumping assembly lower than the temperature of the heat source of said first heat pumping assembly.
6. The TEC system of claim 1 , wherein the control unit is configured and operable to operate said second heat pumping assembly to maintain said substantially constant temperature of said thermal interface, said substantially constant temperature being a relative value corresponding to a substantially constant temperature difference between the thermal interface and any one of ambient temperature and the temperature of the device being cooled.
7. The TEC system of claim 1 , wherein the control unit is configured and operable to controllably operate said first heat pumping assembly in order to control the temperature of said device.
8. The TEC system of claim 1 , wherein said operation scheme is generated based on at least one of the following parameters: the current and desired temperatures of the device, the effective thermal mass of said device, the temperature of said thermal interface and the thermal conductivity of said device.
9. A thermo-electric (TE) system for controlling operation of a THz emitter which comprises first and second lasers, the TE system comprising:
the TEC system of claim 1 for controlling the temperature condition of the first laser; and
an additional TEC system comprising two heat pumping assemblies, each having a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated, the heat pumping assemblies being arranged in a cascade relationship having at least one thermal interface between the heat source of one of the heat pumping assemblies and the heat drain of the other heat pumping assembly, the heat source of said one of the heat pumping assemblies being thermally coupled to the second laser which is to be heated by transferring heat thereto.
10. The TE system of claim 9 , wherein said control unit is configured for operating said additional TEC system to carry out the following: operating said second heat pumping assembly of the additional TEC system to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly of the additional TEC system is either desirably high or by a certain value higher than temperature of the heat source of said first heat pumping assembly.
11. The TE system of claim 9 , wherein the control unit is configured for operating either one or both of the TEC systems to provide fast sweeping of output frequency of the THz emitter within a with a desired frequency range.
12. The TEC system of claim 1 , wherein said second heat pumping assembly has a substantially larger heat pumping rate than the first pumping assembly, such that when the TEC system is in operation a negative temperature difference is obtained between the heat drain and the heat source of the first heat pumping assembly.