Metal-on passivation resistor for current sensing in a chip-scale package
View Patent ↗A current sense resistor integrated with an integrated circuit die where the integrated circuit die is housed in a chip-scale semiconductor package includes a metal layer formed over a passivation layer of the integrated circuit die where the metal layer has an array of metal pillars extending therefrom. The metal pillars are to be electrically connected to a first conductive trace portion and a second conductive trace portion formed on a printed circuit board where the first conductive trace portion and the second conductive trace portion are electrically isolated from each other and physically separated by a separation of a first distance. The current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second metal trace portions, the first and second conductive trace portions forming terminals of the current sense resistor.
1. A current sense resistor integrated with an integrated circuit die, the integrated circuit die being housed in a chip-scale semiconductor package, the current sense resistor comprising:
a metal layer formed over a passivation layer of the integrated circuit die, the metal layer having an array of metal pillars extending therefrom, the metal pillars to be electrically connected to a first conductive trace portion and a second conductive trace portion formed on a printed circuit board where the first conductive trace portion and the second conductive trace portion are electrically isolated from each other and physically separated by a separation of a first distance,
wherein the current sense resistor is formed in a portion of the metal layer spanning the separation between the first and second conductive trace portions, the first and second conductive trace portions forming terminals of the current sense resistor.
2. The current sense resistor of claim 1 , wherein the separation has a distance d between the first conductive trace portion and the second conductive trace portion and a length L.
3. The current sense resistor of claim 2 , wherein the portion of the metal layer forming the current sense resistor has a length equal to or less than the length L.
4. The current sense resistor of claim 1 , wherein the metal layer comprises copper.
5. The current sense resistor of claim 1 , wherein the metal layer comprises a metal alloy.
6. The current sense resistor of claim 1 , further comprising a first contact electrode and a second contact electrode formed in the passivation layer of the integrated circuit die and electrically connected to the metal layer, the first and second contact electrodes being configured to measure a temperature of the current sense resistor.
7. The current sense resistor of claim 1 , wherein the metal layer includes a first metal pillar formed closest to the separation and to be electrically connected to the first conductive trace portion and a second metal pillar formed closest to the separation and to be electrically connected to the second conductive trace portion.
8. The current sense resistor of claim 7 , wherein the current sense resistor has a resistance value determined by the distance between the first metal pillar and the second metal pillar.
9. The current sense resistor of claim 8 , wherein the positioning of the first and second metal pillars relative to the separation is varied to vary the resistance value of the current sense resistor.
10. The current sense resistor of claim 8 , wherein the first and second metal pillars are positioned in close proximity to the separation to form a current sense resistor having a small resistance value.
11. The current sense resistor of claim 8 , wherein the first and second metal pillars are positioned away from the separation to form a current sense resistor having a large resistance value.
12. The current sense resistor of claim 1 , wherein the integrated circuit die comprises a current monitor integrated circuit die and wherein the first conductive trace portion is electrically connected to a first current sense terminal and the second conductive trace portion is electrically connected to a second current sense terminal of the current monitor integrated circuit die.