Image sensor and method for packaging same
View Patent ↗An image sensor includes a ceramic base with a cavity therein, the ceramic base including a sidewall forming a conductive layer embedded therein. A protrusion extends from the sidewall toward the center of the cavity. An infrared filter is mounted on the upper surface of the protrusion with a most upper surface of the infrared filter not higher than the upper surface of the ceramic base; and an image unit is mounted on the lower surface of the protrusion with a most lower surface not lower than the lower surface of the ceramic base.
1. An image sensor, comprising:
a ceramic base with a cavity therein, the ceramic base including a sidewall surrounding the cavity and forming a conductive layer embedded therein;
a protrusion extending from the sidewall toward the center of the cavity;
an electrical component positioned on the upper surface of the ceramic base;
an infrared filter mounted on the upper surface of the protrusion with a most upper surface of the infrared filter not higher than the upper surface of the ceramic base;
an image unit mounted on the lower surface of the protrusion with a most lower surface not lower than the lower surface of the ceramic base;
a sealing ring located between the image unit and the sidewall of the ceramic base for making the cavity between the image unit, the infrared filter, and the sidewall a sealing space.
2. The image sensor as described in claim 1 , wherein the electrical component comprises multi-layer ceramic capacitor, inductor, or resistance.
3. The image sensor as described in claim 1 further comprising an adhesive layer between the lower surface of the protrusion and the image unit.
4. The image sensor as described in claim 3 , wherein the adhesive layer is made from thermosonic material, anisotropic conductive film, anisotropic conductive plastic, or non-conductive paste material combined with conductive particles.
5. The image sensor as described in claim 1 further comprising a connector positioned on the upper surface of the ceramic base for electrically connecting to the image unit via the conductive layer embedded in the sidewall of the ceramic base.
6. A packaging method for packaging the image sensor as described in claim 1 , comprising the steps of:
providing an electrical component and a ceramic base with a cavity therein, the ceramic base including a sidewall surrounding the cavity and forming a conductive layer embedded therein, the sidewall defining a protrusion extending toward the center of the cavity, the electrical component being positioned on the upper surface of the ceramic base;
providing an IR filter and positioning the IR filter on the upper surface of the protrusion;
providing an image unit and an adhesive layer, and then fixing the image unit on the lower surface of the protrusion via the adhesive layer;
providing a sealing ring and positioning the sealing ring between the sidewall and the image unit for making the cavity between the infrared filter, the image unit, the sidewall a sealed space.
7. The packaging method as described in claim 6 , wherein the electrical component is mounted on the upper surface of the ceramic base by surface mounting technology.
8. The packaging method as described in claim 6 , wherein the infrared filter is positioned on the upper surface of the protrusion by UV bonding.
9. The packaging method as described in claim 6 , wherein the image unit, the adhesive layer, and the protrusion are assembled together by flip bonding.