Phosphor adhesive sheet, light emitting diode element including phosphor layer, light emitting diode device, and producing methods thereof
A phosphor adhesive sheet includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in a thickness direction of the phosphor layer. The adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties.
1. A phosphor adhesive sheet comprising:
a phosphor layer containing a phosphor and
an adhesive layer laminated on one surface in a thickness direction of the phosphor layer, wherein
the adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties.
2. The phosphor adhesive sheet according to claim 1 , wherein
the phosphor layer is formed of a ceramic of the phosphor.
3. The phosphor adhesive sheet according to claim 1 , wherein
the phosphor layer is formed of a phosphor resin composition containing the phosphor and a resin.
4. A method for producing a phosphor adhesive sheet comprising the steps of:
preparing a phosphor layer containing a phosphor,
plasticizing a silicone resin composition having both thermoplastic and thermosetting properties to be laminated on one surface in a thickness direction of the phosphor layer, and
forming an adhesive layer by cooling the silicone resin composition to be solidified.
5. A light emitting diode element including a phosphor layer comprising:
a light emitting diode element and
a phosphor adhesive sheet laminated on at least one surface in a thickness direction of the light emitting diode element, wherein
the phosphor adhesive sheet includes
a phosphor layer containing a phosphor and
an adhesive layer laminated on one surface in the thickness direction of the phosphor layer, and
the adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties.
6. A light emitting diode device comprising:
a light emitting diode package, which includes a board, a light emitting diode element mounted on the board, a reflector formed on one side in a thickness direction of the board and disposed so as to surround the light emitting diode element when projected in the thickness direction, and an encapsulating layer filled in the reflector and encapsulating the light emitting diode element; and
a phosphor adhesive sheet, which is adhered to one surface in the thickness direction of the light emitting diode package, wherein
the phosphor adhesive sheet includes
a phosphor layer containing a phosphor and
an adhesive layer laminated on one surface in the thickness direction of the phosphor layer, and
the adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties.
7. A light emitting diode device comprising:
a board,
a light emitting diode element mounted on the board, and
a phosphor adhesive sheet adhered to at least one surface in a thickness direction of the light emitting diode element, wherein
the phosphor adhesive sheet includes
a phosphor layer containing a phosphor and
an adhesive layer laminated on one surface in the thickness direction of the phosphor layer, and
the adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties.
8. A method for producing a light emitting diode device comprising the steps of:
disposing a reflector on one side in a thickness direction of a board so as to surround a light emitting diode element when projected in the thickness direction, along with mounting the light emitting diode element on the board, and thereafter, filling an encapsulating layer in the reflector so as to encapsulate the light emitting diode element to prepare a light emitting diode package;
putting a phosphor adhesive sheet, which includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in the thickness direction of the phosphor layer, on one surface in the thickness direction of the light emitting diode package such that the adhesive layer is in contact with the light emitting diode package;
temporarily fixing the phosphor layer to one surface in the thickness direction of the light emitting diode package by plasticizing the adhesive layer; and
adhering the phosphor layer to one surface in the thickness direction of the light emitting diode package by curing the adhesive layer by heating, wherein
the adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties.
9. A method for producing a light emitting diode device comprising the steps of:
putting a phosphor adhesive sheet, which includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in a thickness direction of the phosphor layer, on at least one surface in the thickness direction of a light emitting diode element such that the adhesive layer is in contact with the light emitting diode element;
temporarily fixing the phosphor layer to at least one surface in the thickness direction of the light emitting diode element by plasticizing the adhesive layer; and
adhering the phosphor layer to at least one surface in the thickness direction of the light emitting diode element by curing the adhesive layer by heating, wherein
the adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties.
10. The method for producing the light emitting diode device according to claim 9 , wherein
a step of mounting the light emitting diode element on the board is further included and
the putting step is performed after the mounting step.
11. The method for producing the light emitting diode device according to claim 9 , wherein
a step of mounting the light emitting diode element on the board is further included and
the mounting step is performed after the adhering step.
12. A method for producing a light emitting diode element including a phosphor layer comprising the steps of:
putting a phosphor adhesive sheet, which includes a phosphor layer containing a phosphor and an adhesive layer laminated on one surface in a thickness direction of the phosphor layer, on at least one surface in the thickness direction of a light emitting diode element such that the adhesive layer is in contact with the light emitting diode element;
temporarily fixing the phosphor layer to at least one surface in the thickness direction of the light emitting diode element by plasticizing the adhesive layer; and
adhering the phosphor layer to at least one surface in the thickness direction of the light emitting diode element by curing the adhesive layer by heating, wherein
the adhesive layer is formed of a silicone resin composition having both thermoplastic and thermosetting properties.