IP Library Granted Patent US 8,962,722
Granted Patent B2
US 8,962,722 · App. 13/525,192 · Granted Feb 24, 2015

Solvent-less liquid ethylene propylene diene monomer rubber compound and method of making

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Quick Facts
Patent No.
US 8,962,722
App. No.
13/525,192
Granted
Feb 24, 2015
Kind
B2
Abstract

A solvent-less liquid ethylene propylene diene rubber compound and a solvent-less liquid ethylene propylene rubber compound are provided. The compounds can include a liquid ethylene propylene diene or a liquid ethylene propylene mixed with a filler system, a plasticizer, and a cross-linking agent to form the compound. The compound can have a viscosity ranging from 150,000 centipoises to 750,000 centipoises at a temperature of 23 degrees Celsius, allowing the compound to be liquid injection moldable. The compound can contain substantially no solvent.

Claims (25)

1. A solvent-less liquid ethylene propylene diene rubber compound for use in liquid injection molding, the compound comprising:

a. 20 weight percent to 60 weight percent based on the total weight percent of the final formulation, of a liquid ethylene propylene diene rubber consisting of a terpolymer of ethylene monomer, propylene monomer, and diene monomer;

b. 1 weight percent to 15 weight percent based on the total weight percent of the final formulation, of a solid ethylene propylene diene dissolved in a plasticizing oil;

c. 5 weight percent to 30 weight percent based on the total weight percent of the final formulation, of a plasticizer;

d. 5 weight percent to 30 weight percent based on the total weight percent of the final formulation, of a filler system;

e. 0.1 weight percent to 20 weight percent of a cross-linking agent, wherein the cross-linking agent comprises a silanol;

f. 0.1 weight percent to 10 weight percent of a first curative comprising an organic peroxide;

g. 0.1 weight percent to 10 weight percent of a second curative comprising trimethylolpropane trimethacrylate;

forming the solvent-less liquid ethylene propylene diene rubber compound, wherein the solvent-less liquid ethylene propylene diene rubber compound has a viscosity ranging from 150,000 centipoises to 750,000 centipoises at a temperature of 23 degrees Celsius, wherein the solvent-less liquid ethylene propylene diene rubber compound contains substantially no solvent, and wherein the solvent-less liquid ethylene propylene diene rubber compound is liquid injection moldable, and the solvent-less liquid ethylene propylene diene rubber compound is a uniform mixture which cures for a time period ranging from 20 seconds to 60 seconds achieving 90 percent of full cure at 200 degrees Celsius.

2. The compound of claim 1 , wherein the solvent-less liquid ethylene propylene diene rubber compound is moldable to form a hydrogen permeable layer, and wherein the hydrogen permeable layer is impermeable to oxidants.

3. The compound of claim 1 , comprising 41 weight percent of the liquid ethylene propylene diene rubber.

4. The compound of claim 1 , comprising 20 weight percent of the filler system.

5. The compound of claim 1 , further comprising an additional ethylene propylene diene rubber in an amount ranging from 1 weight percent to 15 weight percent, wherein the additional ethylene propylene diene rubber is produced from a member selected from the group consisting of:

a. ethylene propylene ethylidene norbornene;

b. ethylene propylene dicyclopentadiene;

c. ethylene propylene vinylidene norbornene; and

d. combinations thereof.

6. The compound of claim 1 , wherein the plasticizing oil is: a paraffinic oil, a naphthenic oil, or an ester oil.

7. The compound of claim 1 , wherein the filler system is: zinc oxide, calcium carbonate, calcium oxide, aluminum silicate, kaolin clay, titanium dioxide, magnesium silicate, talc, precipitated silica, hydrated amorphous silica, fumed silica, a silica pretreated with a coupling agent, carbon black, or combinations thereof.

8. The compound of claim 7 , wherein the coupling agent is a mercaptan, a silane, a silanol, a silane, a polysulfidic silane, or combinations thereof.

9. The compound of claim 1 , wherein:

a. an ethylene monomer content of the ethylene propylene diene rubber ranges from 39 weight percent to 75 weight percent;

b. a propylene monomer content of the ethylene propylene diene rubber ranges from 24 weight percent to 60 weight percent; and

c. a diene monomer content of the ethylene propylene diene rubber ranges from 0.01 weight percent to 12 weight percent.

10. The compound of claim 1 , wherein the liquid ethylene propylene diene rubber has a viscosity ranging from 100 centipoises to 200,000 centipoises.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Oct 3, 2023
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: LION COPOLYMER HOLDINGS, LLC; LION COPOLYMER GEISMAR, LLC
Reel/Frame 065109/0547 →
SECURITY INTEREST Recorded Oct 31, 2017
From: LION COPOLYMER HOLDINGS, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 043996/0218 →
RELEASE OF SECURITY INTEREST Recorded Apr 16, 2014
From: BANK OF AMERICA, N.A.
To: LION COPOLYMER, LLC
Reel/Frame 032692/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Feb 17, 2014
From: LION COPOLYMER GEISMAR, LLC
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 032268/0387 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2014
From: LION COPOLYMER, LLC
To: LION COPOLYMER GEISMAR, LLC
Reel/Frame 032198/0571 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Mar 19, 2013
From: LION COPOLYMER, LLC
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 030038/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2012
From: FONTENOT, ARTHUR JOSEPH, III; KHAN, WASIF; SUMMERS, JOHN WESLEY, II
To: LION COPOLYMER, LLC
Reel/Frame 028388/0024 →