IP Library Patent Application 13526381
Patent Application
App. No. 13/526,381

POLYAMIDE-IMIDE RESIN INSULATING COATING MATERIAL, INSULATED WIRE AND COIL

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Quick Facts
Patent No.
US None
App. No.
13/526,381
Abstract

A polyamide-imide resin insulating coating material includes an polyamic acid having a thermally crosslinkable reactive group, and an amide compound having a thermally crosslinkable reactive group. The polyamic acid includes an acid synthesized using at least a diamine component, a tetracarboxylic dianhydride and a cross-linking agent as raw materials. The cross-linking agent includes an amino group or an anhydride group and a thermally crosslinkable reactive group. The amide compound includes a compound synthesized using at least a carboxylic acid compound and a diisocyanate component as raw materials. The carboxylic acid compound includes a thermally crosslinkable reactive group that is crosslinkable with the cross-linking agent contained in the polyamic acid.

Claims (20)

1 . A polyamide-imide resin insulating coating material, comprising:

an polyamic acid having a thermally crosslinkable reactive group; and

an amide compound having a thermally crosslinkable reactive group,

wherein the polyamic acid comprises an acid synthesized using at least a diamine component, a tetracarboxylic dianhydride and a cross-linking agent as raw materials.

wherein the cross-linking agent comprises an amino group or an anhydride group and a thermally crosslinkable reactive group,

wherein the amide compound comprises a compound synthesized using at least a carboxylic acid compound and a diisocyanate component as raw materials, and

wherein the carboxylic acid compound comprises a thermally crosslinkable reactive group that is crosslinkable with the cross-linking agent contained in the polyamic acid.

2 . The polyamide-imide resin insulating coating material according to claim 1 , wherein the amide compound includes an imide group in a molecule thereof.

3 . The polyamide-imide resin insulating coating material according to claim 1 , wherein the amide compound comprises a compound synthesized using at least the carboxylic acid compound, the diisocyanate component and a trimellitic anhydride.

4 . The polyamide-imide resin insulating coating material according to claim 1 , wherein the amide compound has a number average molecular weight Mn of not more than 5000.

5 . The polyamide-imide resin insulating coating material according to claim 1 , wherein a weight ratio of the amide compound to the polyamic acid is from 99:1 to 30:70.

6 . The polyamide-imide resin insulating coating material according to claim 1 , wherein the cross-linking agent comprises a compound having an unsaturated double or triple bond as a thermally crosslinkable reactive group.

7 . The polyamide-imide resin insulating coating material according to claim 1 , wherein the cross-linking agent comprises maleic anhydride.

8 . The polyamide-imide resin insulating coating material according to claim 1 , wherein the polyamic acid is terminated by an anhydride group.

9 . The polyamide-imide resin insulating coating material according to claim 1 , wherein the polyamic acid is terminated by an amino group.

10 . An insulated wire, comprising:

a conductor, and

an insulating film comprising the polyamide-imide resin insulating coating material according to claim 1 and formed on the conductor or on another film on the conductor.

11 . A coil, comprising:

the insulated wire according to claim 10 .

Assignments (2)
MERGER Recorded Feb 15, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032268/0297 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2012
From: USHIWATA, TAKAMI; HONDA, YUKI; NABESHIMA, SHUTA; KIKUCHI, HIDEYUKI
To: HITACHI CABLE, LTD.
Reel/Frame 028466/0401 →