Aromatic polyamide films for solvent resistant flexible substrates
Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures >300° C. The films are crosslinked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.
1. A transparent aromatic copolyamide film comprising:
(A) an aromatic copolyamide that is capable of being thermally crosslinked and having at least two repeat units of general formula (I) and (V):
wherein X represents the molar percentage of the repeat structure (I) and Y represents the molar percentage of the repeat structure (V) and wherein the copolyamide is soluble in polar organic solvents in the absence of inorganic salts and can be solution cast into a clear film with a Tg higher than 300° C.; and Ar 1 is selected from the group consisting of:
wherein p is 4, q is 3, and wherein R 1 , R 2 , R 3 , R 4 , R 5 are selected from the group comprising hydrogen; halogen; alkyl groups; substituted alkyl groups; cyano groups; thioalkyl groups; alkoxy groups; substituted alkoxy groups; aryl groups; substituted aryl groups; alkyl ester groups; substituted alkyl ester groups; and combinations thereof, wherein G 1 is selected from the group comprising a covalent bond; a CH 2 group; a C(CH 3 ) 2 group; a C(CF 3 ) 2 group; and a C(CM 3 ) 2 group, wherein M is selected from the group comprising a halogen; a CO group; an O atom; a S atom; a SO 2 group; a Si (CH 3 ) 2 group; a 9,9′-bisphenylenefluorene group; a substituted 9,9′-bisphenylenefluorene group; and an OZO group, wherein Z is selected from the group comprising a aryl group or substituted aryl group; a biphenyl group; a perfluorobiphenyl group; a 9,9′-bisphenylenefluorene group; and a substituted 9,9′-bisphenylenefluorene group,
and wherein at least one of the Ar 1 groups in at least one of the repeat unit of (I) or at least one of the repeat unit of (V) is selected from the group consisting of:
wherein Ar 2 is selected from the group consisting of:
wherein p is 4, wherein R 6 , R 7 , R 8 are selected from the group comprising hydrogen; halogens; alkyl groups; substituted alkyl groups; cyano groups; thioalkyl groups; alkoxy groups; substituted alkoxy groups; aryl groups; substituted aryl groups; alkyl ester groups; substituted alkyl ester groups; and combinations thereof, wherein G 2 is selected from the group comprising a covalent bond; a CH 2 group; a C(CH 3 ) 2 group; a C(CF 3 ) 2 group; and a C(CM 3 ) 2 group, wherein M is selected from the group comprising a halogen; a CO group; an O atom; a S atom; a SO 2 group; a Si(CH 3 ) 2 group; a 9,9′-bisphenylenefluorene group; a substituted 9,9′-bisphenylenefluorene group; and an OZO group, wherein Z is selected from the group comprising a aryl group or substituted aryl group; a perfluorobiphenyl group; a 9,9′-bisphenylenefluorene group; and a substituted 9,9′-bisphenylenefluorene group, and
wherein at least one of the Ar 2 groups in at least one of the repeat unit (I) is selected from the group consisting of:
wherein Ar 3 is selected from the group comprising:
wherein t is 0 to 3, g is 0 to 4, and s is 0 to 4, wherein R 9 , R 10 , R 11 are selected from the group comprising hydrogen; halogens; alkyl groups; substituted alkyl groups; cyano groups; thioalkyl groups; alkoxy groups; substituted alkoxy groups; aryl groups; substituted aryl groups; alkyl ester groups; substituted alkyl ester groups; and combinations thereof, wherein G 3 is selected from the group comprising a covalent bond; a CH 2 group; a C(CH 3 ) 2 group; a C(CF 3 ) 2 group; and a C(CM 3 ) 2 group, wherein M is selected from the group comprising a halogen; a CO group; an O atom; a S atom; a SO 2 group; a Si(CH 3 ) 2 group; a 9,9′-bisphenylenefluorene group; a substituted 9,9′-bisphenylenefluorene group; and an OZO group, wherein Z is selected from the group comprising a aryl group; substituted aryl group; a biphenyl group; a perfluorobiphenyl group; a 9,9′-bisphenylenefluorene group; and a substituted 9,9′-bisphenylenefluorene group; and, wherein at least one Ar 3 group in at least one of the repeat units (V) is selected from:
(B) a multifunctional epoxide selected from the group comprising the general structures (II), (III), and (IV):
wherein x>1 and R 12 is selected from the group comprising
where the cyclic structure is selected from the group comprising
wherein n and n 1 >1 and R 13 is an alkyl or aromatic group.
2. The film of claim 1 , wherein the copolyamide contains multiple repeat units with structures (I) and (V).
3. The film of claim 1 , wherein the copolyamide contains approximately 1 to approximately 10 mole % of the repeat unit containing at least one carboxyl group.
4. The film of claim 1 , wherein the amount of multifunctional epoxide is between approximately 1 and approximately 10 wt % based on the weight of the copolyamide.
5. The film of claim 1 , wherein the film thickness is greater than approximately 4 μm.
6. The film of claim 5 , wherein the film thickness is greater than approximately 4 μm and less than approximately 100 μm.
7. The film of claim 5 , wherein the film is approximately 10 μm thick and has a transmittance of >80% from 400 to 750 nm.
8. The film of claim 5 , wherein a film is approximately 10 μm thick and has a transmittance of >85% at 550 nm.
9. The film of claim 1 , wherein the film is heated under reduced pressure or under an inert atmosphere at a temperature that results in the film becoming solvent resistant.
10. The film of claim 9 , wherein heating is conducted at less than approximately 250° C. for at least approximately 1 minute.
11. The film of claim 10 , wherein heating is conducted between approximately 220° C. and approximately 250° C. for at least approximately 1 minute and less than approximately 30 minutes.
12. The film of claim 9 , wherein the film thickness is greater than approximately 4 μm.
13. The film of claim 9 , wherein the film thickness is between approximately 4 μm and approximately 100 μm.
14. The film of claim 12 , wherein the film is approximately 10 μm thick and has a transmittance of >80% from 400 to 750 nm.
15. The film of claim 14 , wherein the film is approximately 10 μm thick and has a transmittance of >85% at 550 nm.
16. The film of claim 5 , wherein the film is adhered to a substrate and wherein the film thickness is greater than approximately 4 μm.
17. The film of claim 16 , wherein the substrate is a glass film with a thickness greater than approximately 50 μm.
18. The film of claim 9 , wherein the average coefficient of thermal expansion is less than approximately 20 ppm/° C. between 25° C. and 250° C.
19. The film of claim 18 , wherein the average coefficient of thermal expansion is less than approximately 10 ppm/° C. between 25° C. and 250° C.