Finger sensing device including finger sensing integrated circuit die within a recess in a mounting substrate and related methods
View Patent ↗A finger sensing device may include a mounting substrate having a recess in a top surface thereof and having conductive through-vias extending from the top surface to a bottom surface. The conductive through-vias may extend laterally adjacent to the recess. The finger sensing device may also include a finger sensing integrated circuit (IC) die within the recess and may include a finger sensing area on a top surface thereof and bond pads on the top surface laterally adjacent the finger sensing area. The finger sensing device may also include a dielectric layer over the mounting substrate and the finger sensing IC die. The finger sensing device may further include a conductive pattern carried by the dielectric layer and coupling the conductive through-vias to respective ones of the bond pads.
1. A finger sensing device comprising:
a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, said conductive through-vias being laterally adjacent to the recess;
a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent said finger sensing area;
a dielectric layer over said mounting substrate and said finger sensing IC die; and
a conductive pattern carried by said dielectric layer and coupling said plurality of conductive through-vias to respective ones of said plurality of bond pads.
2. The finger sensing device according to claim 1 , wherein said mounting substrate and said finger sensing IC die have flush top surfaces.
3. The finger sensing device according to claim 1 , wherein each of said plurality of conductive through-vias comprises an upper tapered portion, a lower vertical portion, and an intermediate landing pad therebetween.
4. The finger sensing device according to claim 1 , further comprising a respective conductive via coupling each of said plurality of bond pads and an adjacent portion of said conductive pattern.
5. The finger sensing device according to claim 1 , wherein said conductive pattern defines a finger drive electrode.
6. The finger sensing device according to claim 1 , further comprising a plurality of conductors coupled to respective ones of said plurality of conductive through-vias on the bottom surface of said mounting substrate and defining a grid array pattern.
7. The finger sensing device according to claim 1 , further comprising a further dielectric layer over said conductive pattern and said dielectric layer.
8. The finger sensing device according to claim 1 , wherein said dielectric layer has a thickness less than or equal to 25 microns.
9. The finger sensing device according to claim 1 , wherein said plurality of conductive through-vias and said conductive pattern comprise copper.
10. A finger sensing device comprising:
a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, said conductive through-vias being laterally adjacent to the recess;
a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent said finger sensing area, the top surface being flush with the top surface of said mounting substrate;
a dielectric layer over said mounting substrate and said finger sensing IC die;
a conductive pattern carried by said dielectric layer and coupling said plurality of conductive through-vias to respective ones of said plurality of bond pads; and
a respective conductive via coupling each of said plurality of bond pads and an adjacent portion of said conductive pattern.
11. The finger sensing device according to claim 10 , wherein each of said plurality of conductive through-vias comprises an upper tapered portion, a lower vertical portion, and an intermediate landing pad therebetween.
12. The finger sensing device according to claim 10 , wherein said conductive pattern defines a finger drive electrode.
13. The finger sensing device according to claim 10 , further comprising a plurality of conductors coupled to respective ones of said plurality of conductive through-vias on the bottom of said mounting substrate and defining a grid array pattern.
14. The finger sensing device according to claim 10 , further comprising a further dielectric layer over said conductive pattern and said dielectric layer.
15. A method of making a finger sensing device comprising:
forming a mounting substrate having a recess in a top surface thereof and having a plurality of conductive through-vias extending from the top surface to a bottom surface, the conductive through-vias being laterally adjacent to the recess;
positioning a finger sensing integrated circuit (IC) die within the recess and comprising a finger sensing area on a top surface thereof and a plurality of bond pads on the top surface laterally adjacent the finger sensing area;
positioning a dielectric layer over the mounting substrate and the finger sensing IC die, the dielectric layer carrying a conductive pattern; and
coupling a conductive pattern to the plurality of conductive through-vias and to respective ones of the plurality of bond pads.
16. The method according to claim 15 , wherein the finger sensing IC die is positioned to have the top surface flush with the top surface of the mounting substrate.
17. The method according to claim 15 , wherein each of the plurality of conductive through-vias comprises an upper tapered portion, a lower vertical portion, and an intermediate landing pad therebetween.
18. The method according to claim 15 , further comprising forming a respective conductive via to couple each of the plurality of bond pads and an adjacent portion of the conductive pattern.
19. The method according to claim 15 , wherein the conductive pattern defines a finger drive electrode.
20. The method according to claim 15 , further comprising coupling a plurality of conductors to respective ones of the plurality of conductive through-vias on the bottom surface of the mounting substrate and defining a grid array pattern.
21. The method according to claim 15 , further comprising forming a further dielectric layer over the conductive pattern and the dielectric layer.
22. The method according to claim 15 , wherein the plurality of through-vias are formed in the mounting substrate by laser drilling.
23. The method according to claim 15 , wherein forming the conductive pattern comprises forming the conductive pattern layer by electroplating.
24. The method according to claim 15 , wherein the plurality of the conductive through-vias are electroplated.