IP Library › Patent Application 13531165
Patent Application
App. No. 13/531,165

SEMICONDUCTOR DEVICE

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Quick Facts
Patent No.
US None
App. No.
13/531,165
Abstract

A semiconductor device includes an interposer, a semiconductor chip mounted on the interposer, a first wiring pattern formed on the interposer, the first wiring pattern including a first contact coupled to a bonding wire from the semiconductor chip and a second contact coupled to an external terminal of the interposer, and a second wiring pattern formed adjacent to the first wiring pattern on the interposer, the second wiring pattern including a third contact coupled to another bonding wire from the semiconductor chip and a fourth contact coupled to another external terminal of the interposer. The first contact is closer to the semiconductor chip than the third contact.

Claims (13)

1 . A semiconductor device, comprising:

an interposer;

a semiconductor chip mounted on the interposer;

a first wiring pattern formed on the interposer, the first wiring pattern including a first contact coupled to a bonding wire from the semiconductor chip and a second contact coupled to an external terminal of the interposer; and

a second wiring pattern formed adjacent to the first wiring pattern on the interposer, the second wiring pattern including a third contact coupled to another bonding wire from the semiconductor chip and a fourth contact coupled to another external terminal of the interposer,

wherein the first contact is closer to the semiconductor chip than the third contact.

2 . The semiconductor device according to claim 1 , wherein the first contact is closer to the semiconductor chip than the second contact, and

wherein the fourth contact is closer to the semiconductor chip than the third contact.

3 . The semiconductor device according to claim 2 , wherein, in the semiconductor device, a signal path and a return path cross each other without an electrical contact at the first and the second wiring patterns.

4 . The semiconductor device according to claim 1 , wherein the semiconductor chip includes a signal pad coupled to the bonding wire.

5 . The semiconductor device according to claim 4 , wherein the semiconductor chip further includes a ground pad coupled to the another bonding wire.

6 . The semiconductor device according to claim 5 , wherein the ground pad is placed adjacent to the signal pad on the semiconductor chip.

7 . The semiconductor device according to claim 6 , wherein the another external terminal is placed adjacent to the external terminal.