Dual dressing system for CMP pads and associated methods

1. A method of dressing a CMP pad, comprising:

applying a deglazing dresser to a working surface of a CMP pad;

deglazing the working surface of the CMP pad with the deglazing dresser;

applying an asperity-forming dresser to the working surface of the CMP pad; and

forming asperities in the working surface of the CMP pad with the asperity-forming dresser with a plurality of superabrasive particles coupled to the asperity-forming dresser; and

wherein the superabrasive particles are arranged in a monolayer of superabrasive particles with a difference in protrusion distance between the highest protruding particle tip and the next highest protruding particle tip of the monolayer of superabrasive particles is less than or equal to about 20 microns and the difference in protrusion distance between the highest 1% of the protruding particle tips of the monolayer of superabrasive particles are within about 80 microns or less.

2. The method of claim 1 , wherein the working surface of the CMP pad is substantially completely deglazed prior to forming the asperities.

3. The method of claim 1 , wherein substantially the entire working surface of the CMP pad is substantially completely deglazed prior to forming the asperities.

4. The method of claim 1 , wherein deglazing the working surface and forming asperities in the working surface occur simultaneously at distinct and separate locations on the working surface until substantially all of the working surface has been conditioned.

5. The method of claim 1 , wherein deglazing the working surface of the CMP pad includes shaving off a thickness of the working surface of the CMP pad.

6. The method of claim 5 , wherein shaving off the thickness of the working surface of the CMP pad includes shaving off the thickness with a plurality of blade elements coupled to the deglazing dresser.

7. The method of claim 1 , further comprising applying a cleansing spray to the working surface during deglazing.

8. The method of claim 7 , wherein the cleansing spray is a water jet.

9. The method of claim 7 , further comprising applying a suction to the working surface to remove debris released from the CMP pad during deglazing.

10. The method of claim 1 , further comprising vibrating at least one of the deglazing dresser and the CMP pad relative to one another during deglazing or the asperity-forming dresser and the CMP pad relative to one another during formation of the asperities.

11. The method of claim 10 , wherein the vibrating is ultrasonic vibrating.

12. A system for dressing a CMP pad, comprising:

a deglazing dresser positioned to engage a CMP pad; and

an asperity-forming dresser positioned to engage the CMP pad, said dresser having plurality of superabrasive particles positioned to form asperities in a working surface of the CMP pad, said superabrasive particles being arranged in a monolayer of superabrasive particles with a difference in protrusion distance between the highest protruding particle tip and the next highest protruding particle tip of the monolayer of superabrasive particles of less than or equal to about 20 microns and the difference in protrusion distance between the highest 1% of the protruding particle tips of the monolayer of superabrasive particles are within about 80 microns or less;

wherein the deglazing dresser and the asperity-forming dresser are each capable of independently dressing the CMP pad.

13. The system of claim 12 , further comprising a platen for holding and rotating the CMP pad, the platen being positioned to engage the deglazing dresser and the asperity-forming dresser.

14. The system of claim 12 , further comprising a liquid spray system positioned to spray a cleansing liquid onto the CMP pad to remove debris during deglazing.

15. The system of claim 12 , further comprising a vibration device associated with at least one of the deglazing dresser, the asperity-forming dresser, or the CMP pad.

16. The system of claim 12 , wherein the deglazing dresser includes a plurality of blade elements positioned to shave off a thickness of the working surface of the CMP pad.