IP Library › Granted Patent US 8,853,562
Granted Patent B2
US 8,853,562 · App. 13/531,688 · Granted Oct 7, 2014

Electromagnetic shielding method and electromagnetic shielding film

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Quick Facts
Patent No.
US 8,853,562
App. No.
13/531,688
Granted
Oct 7, 2014
Kind
B2
Abstract

An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.

Claims (3)

1. A printed wiring board device having an electromagnetically shielded portion, the printed wiring board device comprising a flexible electromagnetic, shielding film to electromagnetically shield a portion of the printed wiring hoard device,

wherein the electromagnetic shielding film includes an insulating layer and a conductive metal layer which are laminated with a conductive adhesive layer provided therebetween to cover the portion, and the electromagnetic shielding film is disposed so that the insulating layer faces the printed wiring board device, the conductive metal layer having a higher melting temperature than that of the insulating layer; and

wherein the conductive layer and a ground conductor of the printed circuit board device are adapted to be bonded and electrically connected via the conductive adhesive layer by heating the electromagnetic shielding film to a heating temperature to melt and contract the insulating layer, the heating temperature being higher than the melting temperature of the insulating resin layer and lower than the melting temperature of the conductive metal layer.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 12, 2016
From: SONY CORPORATION; SONY MOBILE COMMUNICATIONS INC.
To: SNAPTRACK, INC.
Reel/Frame 039425/0093 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2016
From: SONY MOBILE COMMUNICATIONS INC.
To: SONY CORPORATION
Reel/Frame 038380/0555 →
CHANGE OF NAME Recorded Apr 12, 2016
From: SONY ERICSSON MOBILE COMMUNICATIONS JAPAN, INC.
To: SONY MOBILE COMMUNICATIONS JAPAN, INC.
Reel/Frame 038413/0811 →
CHANGE OF NAME Recorded Apr 12, 2016
From: SONY MOBILE COMMUNICATIONS JAPAN, INC.
To: SONY MOBILE COMMUNICATIONS INC.
Reel/Frame 038413/0898 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2016
From: IZAWA, KOICHI; OGURA, YUMI
To: SONY ERICSSON MOBILE COMMUNICATIONS JAPAN, INC.
Reel/Frame 037893/0331 →