Encapsulated beam and method of forming

1. A method, comprising:

depositing a sacrificial layer over a substrate

depositing a first layer of protecting material over the sacrificial layer;

coating the first layer of protecting material with a dielectric layer;

depositing a photoresist layer over the dielectric layer;

patterning the photoresist layer;

etching the dielectric layer to form an exposed region of the first layer of protecting material;

depositing a second layer of the protecting material over the exposed region;

depositing a metallic beam material over the second layer of protecting material;

removing the photoresist layer to expose a lip of the second layer of protecting material;

encapsulating the beam material by depositing the protecting material over the beam material and the lip; and

removing at least a part of the sacrificial layer after encapsulating the beam material to release a coated beam.

2. The method of claim 1 , wherein the beam material comprises nickel, tin, platinum, silver, copper, gold, nickel tungsten alloy, nickel iron alloy, or any combinations of the foregoing.

3. The method of claim 1 , wherein the protecting material comprises gold, nickel, tin, platinum, silver, copper, or any combinations of the foregoing.

4. The method claim 1 , wherein etching the dielectric layer comprises undercutting the dielectric layer.