Semiconductor device and method for manufacturing the same
A semiconductor device comprises a semiconductor substrate, a first transistor including a gate insulating film and a gate electrode sequentially formed on the semiconductor substrate, a sidewall, an interlayer insulating film formed on the semiconductor substrate, and a contact plug which penetrates through the interlayer insulating film and reaches the semiconductor substrate. The sidewall is formed on a side surface of the gate electrode, and includes a first insulating film and a second insulating film formed on the first insulating film and containing a metal oxide different from the first insulating film.
1. A semiconductor device comprising: a semiconductor substrate;
a peripheral circuit region including a first transistor, the first transistor including a gate insulating film and a gate electrode on the semiconductor substrate;
a memory cell region including a memory cell which includes a second transistor having a trench gate electrode, and a memory element comprising a capacitor electrically connected to the second transistor by a memory contact plug;
a first sidewall on a side surface of the gate electrode of the first transistor, the first sidewall including a first insulating film and a second insulating film on the first insulating film and containing a metal oxide different from the first insulating film, the second insulating film not being present over a top of the gate electrode of the first transistor;
an interlayer insulating film on the semiconductor substrate; and a contact plug which directly contacts the second insulating film at a top of said first sidewall and penetrates through the interlayer insulating film and reaches the semiconductor substrate, wherein
the second insulating film is not present in the second transistor of the memory cell region, and
the memory contact plug directly contacts the first insulating film which is present on a second sidewall on a side surface of the gate electrode of the second transistor.
2. The semiconductor device according to claim 1 , wherein the gate insulating film includes an insulating film which has a dielectric constant higher than a dielectric constant of silicon oxide.
3. The semiconductor device according to claim 1 , wherein the gate electrode includes a metal film.
4. The semiconductor device according to claim 1 , wherein the first insulating film contains nitrogen atom and silicon atom.
5. The semiconductor device according to claim 1 , wherein the interlayer insulating film contains oxygen atom.
6. The semiconductor device according to claim 1 , wherein the gate insulating film contains hafnium atom.
7. The semiconductor device according to claim 1 , wherein the second insulating film contains aluminum oxide.
8. The semiconductor device according to claim 1 , wherein the interlayer insulating film contains oxygen atom and silicon atom.