Pressure sensing device with stepped cavity to minimize thermal noise
View Patent ↗A pressure sensing element may include a diaphragm and a stepped cavity. The pressure sensing element may include a plurality of piezoresistors, which are operable to generate an electrical signal based on an amount of deflection of the diaphragm in response to a sensed pressure of the fluid. The pressure sensing element may be mounted onto a housing substrate using an adhesive so that a portion of the adhesive is attached to walls of a first cavity and to a step surface of the stepped cavity to redistribute thermally induced stresses on the pressure sensing element. The stepped cavity may be included in a MEMS pressure sensing element to reduce or eliminate thermal noise, such as temperature coefficient of offset voltage output (TCO).
1. An apparatus, comprising:
a pressure sensing element including:
a stepped cavity formed into a base surface of the pressure sensing element, by a plurality of walls of a first cavity, a step surface, a plurality of walls of a second cavity, and a bottom surface of a diaphragm; and
a plurality of piezoresistors on a top surface of the diaphragm;
at least one substrate; and
an adhesive that connects the substrate to the base surface such that the walls of the first cavity and the step surface of the stepped cavity are adhered to at least a portion of the adhesive;
wherein the adhesive further comprises:
a base portion;
an outer fillet portion integrally formed with the base portion, the outer fillet portion adjacent the at least one outer surface when the pressure sensing element is connected to the at least one substrate; and
an inner fillet portion integrally formed with the base portion, the inner fillet portion substantially disposed in the first cavity when the pressure sensing element is connected to the at least one substrate.
2. An apparatus, comprising:
a pressure sensing element including:
a stepped cavity formed into a base surface of the pressure sensing element, by a plurality of walls of a first cavity, a step surface, a plurality of walls of a second cavity, and a bottom surface of a diaphragm; and
a plurality of piezoresistors on a top surface of the diaphragm;
at least one substrate; and
an adhesive that connects the substrate to the base surface such that the walls of the first cavity and the step surface of the stepped cavity are adhered to at least a portion of the adhesive;
wherein the portion of the adhesive that is attached to the walls of the first cavity and to the step surface redistributes the thermally induced stresses on the pressure sensing element to minimize pressure sensing inaccuracies caused by thermally induced stresses on the pressure sensing element.
3. The apparatus of claim 1 , wherein a depth of the first cavity is approximately one quarter to two-thirds of the thickness of the pressure sensing element.
4. The apparatus of claim 1 , wherein the depth of the first cavity is approximately one-third to one-half of the thickness of the pressure sensing element.
5. The apparatus of claim 1 , further comprising:
a cap connected to the top surface of the pressure sensing element; and
a chamber integrally formed between the cap and the top surface of the pressure sensing element such that the chamber is at least partially evacuated.
6. The apparatus of claim 5 , wherein the cap is made of a borosilicate glass.
7. The apparatus of claim 5 , wherein the cap is made of silicon.
8. The apparatus of claim 1 , wherein the plurality of piezoresistors are configured to be a picture-frame Wheatstone bridge.
9. The apparatus of claim 1 , wherein the plurality of piezoresistors are configured to be a distributed Wheatstone bridge.
10. The apparatus of claim 1 , wherein the plurality of walls of the first and second cavities are substantially perpendicular to the diaphragm.
11. The apparatus of claim 1 , wherein the step surface is substantially parallel to the diaphragm.
12. The apparatus of claim 2 , wherein a depth of the first cavity is approximately one quarter to two-thirds of the thickness of the pressure sensing element.
13. The apparatus of claim 2 , wherein the depth of the first cavity is approximately one-third to one-half of the thickness of the pressure sensing element.
14. The apparatus of claim 2 , further comprising:
a cap connected to the top surface of the pressure sensing element; and
a chamber integrally formed between the cap and the top surface of the pressure sensing element such that the chamber is at least partially evacuated.
15. The apparatus of claim 14 , wherein the cap is made of a borosilicate glass.
16. The apparatus of claim 14 , wherein the cap is made of silicon.
17. The apparatus of claim 2 , wherein the plurality of piezoresistors are configured to be a picture-frame Wheatstone bridge.
18. The apparatus of claim 2 , wherein the plurality of piezoresistors are configured to be a distributed Wheatstone bridge.
19. The apparatus of claim 2 , wherein the plurality of walls of the first and second cavities are substantially perpendicular to the diaphragm.
20. The apparatus of claim 2 , wherein the step surface is substantially parallel to the diaphragm.