ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND CONNECTING METHOD

1 . An anisotropic conductive film, comprising:

an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent; and

an insulating layer containing a binder, a monofunctional polymerizable monomer, and a curing agent,

wherein the metal-coated resin particles are resin particles each containing a resin core coated at least with Ni.

2 . The anisotropic conductive film according to claim 1 , wherein the insulating layer contains at least a phenoxy resin, a monofunctional (meth)acryl monomer, and organic peroxide.

3 . The anisotropic conductive film according to claim 1 , wherein the electric conductive layer contains at least a phenoxy resin, a (meth)acryl monomer, and organic peroxide.

4 . The anisotropic conductive film according to claim 1 , wherein the metal-coated resin particles are resin particles each containing a resin core coated with Ni, or resin particles each containing a resin core coated with Ni, whose outer surface is further coated with Au.

5 . The anisotropic conductive film according to claim 1 , wherein a material of the resin core is a styrene-divinylbenzene copolymer, or a benzoguanamine resin.

6 . The anisotropic conductive film according to claim 1 , wherein the metal-coated resin particles have the average particle diameter of 5 μm or greater.

7 . The anisotropic conductive film according to claim 1 , wherein a total amount of the Ni particles and the metal-coated resin particles in the electric conductive layer is 3.0 parts by mass to 20 parts by mass relative to 100 parts of resin solids contained in the electric conductive layer.

8 . A joined structure, comprising:

a first circuit member;

a second circuit member; and

an anisotropic conductive film,

wherein the first circuit member and the second circuit member are joined together with the anisotropic conductive film provided between the first circuit member and the second circuit member, and

wherein the anisotropic conductive film contains:

an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent; and

an insulating layer containing a binder, a monofunctional polymerizable monomer, and a curing agent,

wherein the metal-coated resin particles are resin particles each containing a resin core coated at least with Ni.

9 . The joined structure according to claim 8 , wherein the first circuit member is a printed wiring board and the second circuit member is a COF.

10 . A connecting method, comprising:

providing an anisotropic conductive film between a first circuit member and a second circuit member; and

pressurizing the first circuit member and the second circuit member with heating to cure the anisotropic conductive film, to thereby connect the first circuit member with the second circuit member, wherein the anisotropic conductive film contains:

an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent; and

an insulating layer containing a binder, a monofunctional polymerizable monomer, and a curing agent,

wherein the metal-coated resin particles are resin particles each containing a resin core coated at least with Ni.

11 . The connecting method according to claim 10 , wherein the first circuit member is a printed wiring board and the second circuit member is a COF.

12 . The connecting method according to claim 11 , wherein the providing is arranging the anisotropic conductive film so that the electric conductive layer thereof comes to the side of the printed wiring board, and the insulating layer thereof comes to the side of the COF.