Semiconductor device, method of manufacturing the semiconductor device, and electronic device
The upper end of a gate electrode is situated below the surface of a semiconductor substrate. An insulating layer is formed over the gate electrode and over the semiconductor substrate situated at the periphery thereof. The insulating layer has a first insulating film and a low oxygen permeable insulating film. The first insulating film is, for example, an NSG film and the low oxygen permeable insulating film is, for example, an SiN film. Further, a second insulating film is formed over the low oxygen permeable insulating film. The second insulating film is, for example, a BPSG film. The TDDB resistance of a vertical MOS transistor is improved by processing with an oxidative atmosphere after forming the insulating layer. Further since the insulating layer has the low oxygen permeable insulating film, fluctuation of the threshold voltage of the vertical MOS transistor can be suppressed.
1. A semiconductor device comprising:
a semiconductor substrate;
a drain layer formed to the semiconductor substrate and situated to the semiconductor substrate on the side of the rear face;
a gate insulating film formed on the inner wall of a concave portion formed to the surface of the semiconductor substrate;
a gate electrode buried in the concave portion with the upper end of the gate electrode being lower than the surface of the semiconductor substrate;
a source layer formed to the semiconductor substrate on the side of the surface;
a first insulating film formed over the gate electrode with the upper surface of the film being higher than the surface of the semiconductor substrate; and
a low oxygen permeable insulating film formed over the first insulating film and having an oxygen permeability lower than that of the first insulating film.
2. The semiconductor device according to claim 1 ,
wherein the low oxygen permeable insulating film is at least one of an SiN film, an SiC film, and an SiCN film.
3. The semiconductor device according to claim 1 ,
wherein the low oxygen permeable insulting film is the SiN film and the thickness thereof is 6 nm or more and 7 nm or less.
4. The semiconductor device according to claim 1 ,
wherein the first insulating film is at least one of an NSG (Non doped Silicate Glass) film and an SOG (Spin on Glass) film.
5. The semiconductor device according to claim 1 ,
wherein a second insulating film formed over the low oxygen permeable insulating film and having an oxygen permeability higher than that of the low oxygen permeable insulating film is provided.
6. The semiconductor device according to claim 5 ,
wherein the second insulating film is at least one of an NSG film, a BPSG film, and an SOG film.
7. The semiconductor device according to claim 1 ,
wherein the first insulating film is formed also over the gate electrode and over the semiconductor substrate situated at the periphery thereof, and the vertical difference between the surface of the first insulating film situated above the gate electrode and the surface of the first insulating film situated above the semiconductor substrate is 100 nm or less.
8. A method of manufacturing a semiconductor device comprising:
forming a concave portion to the surface of a semiconductor substrate having a drain layer on the side of the rear face;
forming a gate insulating film on the inner wall of the concave portion;
burying a gate electrode in the concave portion such that the upper end of the gate electrode is lower than the surface of the semiconductor substrate;
forming a source layer to the semiconductor substrate on the side of the surface;
forming a first insulating film with the upper surface of the film being higher than the surface of the semiconductor substrate;
forming a low oxygen permeable insulating film having an oxygen permeability lower than that of the first insulating film over the first insulating film; and
performing a treatment with an oxidative atmosphere from above the low oxygen permeable insulating film and from above the semiconductor substrate.
9. The method of manufacturing the semiconductor device according to claim 8 ,
wherein the low oxygen permeable insulating film is at least one of an SiN film, an SiC film, and an SiCN film.
10. The method of manufacturing the semiconductor device according to claim 8 ,
wherein the first insulating film is at least one of an NSG (Non doped Silicate Glass) film and an SOG (Spin on Glass) film.
11. The method of manufacturing a semiconductor device according to claim 8 ,
wherein the method comprises a step of forming a second insulating film having an oxygen permeability higher than that of the low oxygen permeable insulating film over the low oxygen permeable insulating film after the step of forming the low oxygen permeable insulating film.
12. The method of manufacturing a semiconductor device according to claim 11 ,
wherein the second insulating film is at least one of an NSG (Non doped Silicate Glass) film, a BPSG (Bon phosphorus Silicate Glass) film, and an SOG (Spin on Glass).
13. An electronic device having a semiconductor device for controlling a power supply to a load driven by electric power supplied from a power source,
wherein the semiconductor device includes:
a semiconductor substrate;
a drain layer formed to the semiconductor substrate and situated to the semiconductor substrate on the side of the rear face;
a gate insulating film formed on the inner wall of the concave portion formed in the semiconductor substrate;
a gate electrode buried in the concave portion with the upper end of the gate electrode being lower than the surface of the semiconductor substrate;
a source layer formed to the semiconductor substrate on the side of the surface;
a first insulating film formed over the gate electrode with the upper surface of the film being higher than the surface of the semiconductor substrate;
a low oxygen permeable insulating film having an oxygen permeability lower than that of the first insulating film; and
an interlayer insulating film formed over the low oxygen permeable insulating film and over the semiconductor substrate.