IP Library Granted Patent US 9,218,093
Granted Patent B2
US 9,218,093 · App. 13/536,255 · Granted Dec 22, 2015

Touch sensor driver with selectable charge source

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Quick Facts
Patent No.
US 9,218,093
App. No.
13/536,255
Granted
Dec 22, 2015
Kind
B2
Abstract

An apparatus may include an internal charge pump within an integrated circuit package, an external pin positioned at an exterior of the integrated circuit package, and a select circuit configured to operate independently from the internal charge pump and located within the integrated circuit package, wherein the select circuit is configurable to selectively couple at least one of the internal charge pump and the external pin to a transmit (TX) sensor electrode.

Claims (31)

1. An apparatus, comprising:

an internal charge pump within an integrated circuit package;

an external pin positioned at an exterior of the integrated circuit package; and

a select circuit configured to operate independently from the internal charge pump and located within the integrated circuit package, wherein in a first configuration, the select circuit is configured to couple the internal charge pump to a transmit (TX) sensor electrode and the internal charge pump is configured to charge the TX sensor electrode, wherein in a second configuration, the select circuit is configured to simultaneously couple both of the internal charge pump and the external pin to the TX sensor electrode to conduct charge from the internal charge pump to the external pin and from the external pin to the TX sensor electrode, and wherein in a third configuration, the select circuit is configured to couple the external pin to the TX sensor electrode and disconnect the internal charge pump from the TX sensor electrode, and the external pin is configured to conduct charge from outside the integrated circuit package to inside the integrated circuit package.

2. The apparatus of claim 1 , wherein the select circuit is configurable to selectively couple only one of the internal charge pump and the external pin to a transmit sensor electrode, or both of the internal charge pump and the external pin to the TX sensor electrode.

3. The apparatus of claim 2 , wherein the charge pump is configured to charge an external capacitor connected to the external pin when the select circuit is configured to couple both of the internal charge pump and the external pin to the TX sensor electrode.

4. The apparatus of claim 3 , wherein the select circuit is configured to transfer charge from the external capacitor to the TX sensor electrode when the select circuit is configured to couple both of the charge pump and the external pin to the TX sensor electrode.

5. The apparatus of claim 1 , further comprising an external charge source coupled with the external pin, wherein the external charge source is configured to supply charge to the TX sensor electrode when the select circuit is configured to couple the external pin to the TX sensor electrode.

6. The apparatus of claim 1 , further comprising a transmit (TX) demultiplexer coupled with the select circuit, wherein the TX demultiplexer is configured to selectively connect the select circuit with one of a plurality of TX sensor electrodes.

7. The apparatus of claim 6 , wherein the TX demultiplexer is contained within the integrated circuit package.

8. The apparatus of claim 1 , further comprising one or more internal voltage sources coupled with the select circuit, wherein the select circuit is further configurable to selectively connect at least one of the one or more internal voltage sources with the TX sensor electrode.

9. The apparatus of claim 1 , wherein the select circuit is configurable based on a configuration value of the select circuit stored in a memory.

10. A mutual capacitance sensing circuit, comprising:

an array of sensor electrodes including a transmit (TX) sensor electrode;

a charge pump; and

a select circuit located within an integrated circuit package and coupled with the TX sensor electrode, wherein the select circuit is configurable according to a first configuration to enable the charge pump to charge the TX sensor electrode, configurable according to a second configuration to simultaneously couple both of the charge pump and an external pin of the integrated circuit package to the TX sensor electrode to conduct charge from the charge pump to the external pin and from the external pin to the TX sensor electrode, and configurable according to a third configuration to couple the external pin to the TX sensor electrode and disconnect the charge pump from the TX sensor electrode, wherein the external pin is configured to conduct charge from outside the integrated circuit package to inside the integrated circuit package when the select circuit is in the third configuration.

11. The mutual capacitance sensing circuit of claim 10 , wherein the charge pump and the select circuit are contained within an integrated circuit package, and wherein the external pin is positioned at an exterior surface of the integrated circuit package.

12. The mutual capacitance sensing circuit of claim 10 , wherein the charge pump is configured to charge an external capacitor connected to the external pin when the select circuit is configured to connect both of the charge pump and the external pin to the TX sensor electrode.

13. The mutual capacitance sensing circuit of claim 12 , wherein the select circuit is configured to transfer charge from the external capacitor to the TX sensor electrode when the select circuit is configured to couple both of the charge pump and the external pin to the TX sensor electrode based on the configuration of the select circuit.

14. The mutual capacitance sensing circuit of claim 10 , further comprising an external charge source coupled with the external pin, wherein the external charge source is configured to supply charge to the TX sensor electrode when the select circuit is configured to connect the external pin to the TX sensor electrode.

15. The mutual capacitance sensing circuit of claim 10 , further comprising a transmit (TX) demultiplexer coupled with the select circuit, wherein the TX demultiplexer is configured to selectively connect the select circuit with one of a plurality of TX sensor electrodes.

16. The mutual capacitance sensing circuit of claim 10 , further comprising one or more internal voltage sources coupled with the select circuit, wherein the select circuit is further configurable to selectively connect at least one of the one or more internal voltage sources with the TX sensor electrode.

17. A method, comprising:

configuring a select circuit according to one of at least three possible configurations capable of being implemented by the select circuit to:

couple an internal charge pump to a transmit (TX) sensor electrode according to a first configuration of the three possible configurations to enable the charge pump to charge the TX sensor electrode,

simultaneously couple both of the internal charge pump and an external pin to the TX sensor electrode according to a second configuration of the three possible configurations to conduct charge from the charge pump to the external pin and from the external pin to the TX sensor electrode, or

couple the external pin to the TX sensor electrode and disconnect the internal charge pump from the TX sensor electrode according to a third configuration of the three possible configurations, wherein the internal charge pump is located within a device package, wherein the select circuit is configured to operate independently from the internal charge pump, wherein the external pin is located at an exterior surface of the device package, and wherein the external pin is configured to conduct charge from outside the device package to inside the device package when the select circuit is in the third configuration; and

driving the TX sensor electrode by transferring charge from the one of the internal charge pump and the external pin to the TX sensor electrode.

18. The method of claim 17 , wherein transferring the charge further comprises transferring the charge to the TX sensor electrode from an external capacitor coupled with the external pin.

19. The method of claim 18 , further comprising charging the external capacitor using the internal charge pump.

20. The method of claim 17 , wherein transferring the charge further comprises transferring the charge to the TX sensor electrode from an external charge source coupled with the external pin.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION
To: PARADE TECHNOLOGIES, LTD.
Reel/Frame 036508/0284 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS AND TRADEMARKS Recorded Aug 4, 2015
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT FOR THE SECURED PARTIES
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036264/0114 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
PATENT SECURITY AGREEMENT Recorded Nov 14, 2013
From: CYPRESS SEMICONDUCTOR CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 031636/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2012
From: KLEIN, HANS W; GRIVNA, EDWARD L; O'KEEFFE, DANIEL
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 028462/0853 →