Signal distribution and filtering in low noise block downconverters
View Patent ↗Various embodiments implement waveguides for signal distribution or signal filtering in satellite receivers. According to some embodiments, a low noise block downconverter (LNB) is implemented using waveguides configured for signal distribution, band pass filtering, low pass filtering, high pass filtering, or band stop filtering. For some embodiments, the waveguides may be formed by the LNB chassis and the ground plane of a printed circuit board mounted to the LNB chassis.
1. An apparatus, comprising:
a chassis;
a printed circuit board comprising a ground plane and a device layer;
a first device disposed on the device layer;
a second device disposed on the device layer;
a waveguide coupling the first device and the second device, the waveguide having at least one side formed by a groove in the chassis and at least one side formed by the ground plane of the printed circuit board; and
a printed filter disposed on the device layer and coupled between the waveguide and the first device or between the waveguide and the second device such that the printed filter and the waveguide implement a composite filter.
2. The apparatus of claim 1 , wherein the groove forms at least three sides of the waveguide and the ground plane of the printed circuit board forms a fourth side.
3. The apparatus of claim 1 , wherein the waveguide is configured to implement a band pass filter, a low pass filter, a high pass filter, or a band stop filter.
4. The apparatus of claim 1 , wherein the waveguide is configured to perform signal distribution.
5. The apparatus of claim 1 , wherein the chassis comprises a cavity housing the printed circuit board.
6. The apparatus of claim 1 , wherein the printed circuit board is configured to implement a low noise block downconverter (LNB).
7. The apparatus of claim 1 , wherein the ground plane of the printed circuit board is in direct contact with the chassis.
8. The apparatus of claim 1 , wherein the printed circuit board is disposed over the groove of the chassis such that the ground plane of the printed circuit board is capacitively coupled with the chassis.
9. The apparatus of claim 1 , wherein the printed circuit board is disposed over the groove of the chassis such that the ground plane of the printed circuit board is capacitively coupled with the chassis.
10. The apparatus of claim 1 , wherein the first device is an amplifier, an antenna feed, or a mixer.
11. A method, comprising:
receiving a first signal at a first device disposed on a device layer of a printed circuit board, wherein the printed circuit board comprises a ground plane and the device layer;
transmitting a second signal, from the first device to a second device disposed on the device layer of the printed circuit board, using a waveguide having at least one side formed by a groove in a chassis housing the printed circuit board and at least one side formed by the ground plane of the printed circuit board, wherein the second signal is based on the first signal;
receiving the second signal at the second device disposed on the device layer of the printed circuit board; and
wherein a printed filter disposed on the device layer is coupled between the waveguide and the first device or between the waveguide and the second device such that the printed filter and the waveguide implement a composite filter.
12. The method of claim 11 , wherein the groove forms at least three sides of the waveguide and the ground plane of the printed circuit board forms a fourth side.
13. The method of claim 11 , wherein the waveguide is configured to implement a band pass filter, a low pass filter, a high pass filter, or a band stop filter.
14. The method of claim 11 , wherein the waveguide is configured to perform signal distribution.
15. The method of claim 11 , wherein the chassis comprises a cavity housing the printed circuit board.
16. The method of claim 11 , wherein the printed circuit board is configured to implement a low noise block downconverter (LNB).
17. The method of claim 11 , herein the ground plane of the printed circuit board is in direct contact with the chassis.
18. The method of claim 11 , wherein the printed circuit board is disposed over the groove of the chassis such that the ground plane of the printed circuit board is capacitively coupled with the chassis.
19. The method of claim 11 , wherein the first device is an amplifier, an antenna feed, or a mixer.