IP Library Granted Patent US 9,034,686
Granted Patent B2
US 9,034,686 · App. 13/538,352 · Granted May 19, 2015

Manufacturing methods for semiconductor devices

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Quick Facts
Patent No.
US 9,034,686
App. No.
13/538,352
Granted
May 19, 2015
Kind
B2
Abstract

Embodiments of the present invention include a method. The method includes heating a layer stack. The layer stack includes a first layer comprising cadmium and tin, a metal layer disposed over the first layer, and a window layer disposed over the metal layer. Heating the stack includes transforming at least a portion of the first layer from an amorphous phase to a crystalline phase. Heating may be performed using any of various configurations, such as, for example, heating an individual stack, or using a face-to-face configuration of multiple stacks. The stack may be used for fabricating a photovoltaic device.

Claims (41)

1. A method comprising:

heating a layer stack comprising a plurality of layers, the plurality of layers comprising

a) a first layer comprising cadmium and tin,

b) a metal layer capable of forming metal oxides and consisting essentially of metals having a higher affinity for oxygen than cadmium tin oxide, and

c) a window layer disposed over the metal layer;

wherein heating comprises transforming at least a portion of the first layer from an amorphous phase to a crystalline phase; and

wherein the plurality of layers further comprises an electrically resistive buffer layer disposed between the metal layer and the window layer.

2. The method of claim 1 , wherein the metal layer is disposed over the first layer.

3. The method of claim 1 , wherein the window layer comprises cadmium.

4. The method of claim 3 , wherein the window layer comprises cadmium sulfide.

5. The method of claim 1 , wherein the buffer layer comprises tin oxide, zinc oxide, zinc tin oxide, zinc stannate, zinc magnesium oxide, gallium oxide, aluminum oxide, or silicon oxide.

6. The method of claim 1 , wherein the crystalline phase comprises a spinel.

7. The method of claim 6 , wherein the spinel comprises cadmium, tin, and oxygen.

8. The method of claim 1 , wherein heating comprises heating the first layer to a temperature in a temperature range from about 500° C. to about 700° C.

9. The method of claim 1 , wherein heating comprises holding the first layer at said temperature range for a hold time in the range up to about 60 minutes.

10. The method of claim 1 , wherein the metal layer is selected from layers of tin, aluminum, zinc, tantalum, titanium, zirconium, vanadium, indium, nickel, or magnesium.

11. The method of claim 1 , wherein the metal layer has a thickness up to about 30 nanometers.

12. The method of claim 1 , wherein the metal layer has a thickness in a range from about 1 nanometer to about 20 nanometers.

13. The method of claim 1 , wherein the plurality of layers further comprises an absorber layer disposed over the window layer.

14. The method of claim 13 , wherein the absorber layer comprises cadmium telluride.

15. The method of claim 1 , wherein heating the layer stack comprises heating the layer stack disposed on a support.

16. The method of claim 15 , wherein the support comprises a glass.

17. The method of claim 15 , wherein the support comprises a metal or a polymer.

18. The method of claim 1 , wherein heating comprises heating the stack in the presence of a cadmium-containing material disposed external to the stack.

19. The method of claim 1 , wherein heating further comprises heating an assembly, the assembly comprising a first panel comprising a first layer stack disposed on a first support, and a second panel comprising a second layer stack disposed on a second support,

wherein the window layer of the second panel faces the window layer of the first panel.

20. A method comprising:

heating an assembly, the assembly comprising a first panel comprising a first layer stack disposed on a first support, and a second panel comprising a second layer stack disposed on a second support,

wherein each of the first layer stack and the second layer stack comprises

a) a first layer comprising cadmium and tin,

b) a metal layer disposed over the first layer, the metal layer capable of forming metal oxides and consisting essentially of metals having a higher affinity for oxygen than cadmium tin oxide, and

c) a window layer disposed over the metal layer;

wherein the window layer of the second panel faces the window layer of the first panel, and

wherein heating comprises transforming at least a portion of the first layer of either layer stack, or of both layer stacks, from an amorphous phase to a crystalline phase.

21. The method of claim 20 , wherein the window layers comprise cadmium, such that the window layer of the second layer stack provides a cadmium-containing material disposed external to the first stack and the window layer of the first layer stack provides a cadmium-containing material disposed external to the second stack.

22. A method comprising:

heating a layer stack comprising a plurality of layers, the plurality of layers comprising

a) a first layer comprising cadmium and tin,

b) a metal layer, the metal layer capable of forming metal oxides and consisting essentially of metals having a higher affinity for oxygen than cadmium tin oxide, and

c) a window layer disposed over the metal layer;

wherein heating comprises transforming at least a portion of the first layer from an amorphous phase to a crystalline phase; and wherein heating further comprises heating the stack in the presence of a cadmium-containing material disposed external to the stack, the cadmium-containing material comprising cadmium sulfide or cadmium oxide.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Feb 13, 2026
From: JPMORGAN CHASE BANK, N.A.
To: FIRST SOLAR, INC.
Reel/Frame 074858/0364 →
SECURITY INTEREST Recorded Jul 10, 2023
From: FIRST SOLAR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 064237/0462 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 15, 2021
From: JPMORGAN CHASE BANK, N.A.
To: FIRST SOLAR, INC.
Reel/Frame 058132/0566 →
PATENT SECURITY AGREEMENT Recorded Jul 12, 2017
From: FIRST SOLAR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 043177/0581 →
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER FROM '13/301162' PREVIOUSLY RECORDED ON REEL 032045 FRAME 0657. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT APPLICATION NUMBER SHOULD BE '13/601162'. Recorded Feb 10, 2014
From: FIRST SOLAR MALAYSIA SDN. BHD.
To: FIRST SOLAR, INC.
Reel/Frame 032239/0005 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2014
From: FIRST SOLAR MALAYSIA SDN. BHD.
To: FIRST SOLAR, INC.
Reel/Frame 032045/0657 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2013
From: GENERAL ELECTRIC COMPANY
To: FIRST SOLAR MALAYSIA SDN.BHD.
Reel/Frame 031581/0457 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 24, 2012
From: PENG, HONGYING; KOREVAAR, BASTIAAN ARIE; CAO, JINBO; ARAUJO, STEPHEN LORENCO; FELDMAN-PEABODY, SCOTT DANIEL; GOSSMAN, ROBERT DWAYNE
To: GENERAL ELECTRIC COMPANY
Reel/Frame 028626/0766 →