IP Library Granted Patent US 8,400,361
Granted Patent B2
US 8,400,361 · App. 13/538,647 · Granted Mar 19, 2013

Integrated circuit MEMS antenna structure

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Quick Facts
Patent No.
US 8,400,361
App. No.
13/538,647
Granted
Mar 19, 2013
Kind
B2
Abstract

An integrated circuit (IC) antenna structure includes a micro-electromechanical (MEM) area, a feed point, and a transmission line. The micro-electromechanical (MEM) area includes a three-dimensional shape, wherein the three dimensional-shape provides an antenna structure. The feed point is coupled to provide an outbound radio frequency (RF) signal to the antenna structure for transmission and to receive an inbound RF signal from the antenna structure. The transmission line electrically coupled to the feed point.

Claims (44)

1. An integrated circuit (IC) antenna structure comprises:

a micro-electromechanical (MEM) area having a three-dimensional shape, wherein a non-planar three-dimensional radiating element is disposed within the MEM area; and

a feed point coupled to provide an outbound radio frequency (RF) signal to the non-planar three-dimensional radiating element for transmission and to receive an inbound RF signal from the non-planar three-dimensional radiating element.

2. The IC antenna structure of claim 1 , wherein the three-dimensional radiating element comprises at least one of:

a rectangle shape, a horn shape, and a waveguide shape to produce an aperture antenna, wherein the feed point is electrically coupled to the aperture antenna.

3. The IC antenna structure of claim 1 , wherein the three-dimensional radiating element comprises:

a lens shape to produce a lens antenna, wherein the feed point is positioned at a focal point of the lens antenna.

4. The IC antenna structure of claim 1 , wherein the three-dimensional radiating element comprises at least one of:

a biconical shape, a bow tie shape, a bi-cylinder shape, and a bi-elliptical shape to produce a three-dimensional dipole antenna, wherein the feed point is electrically coupled to the three-dimensional dipole antenna.

5. The IC antenna structure of claim 1 , wherein the three-dimensional radiating element comprises at least one of:

a plane, a corner shape, and a parabolic shape to produce a reflector antenna, wherein the feed point is positioned at a focal point of the reflector antenna.

6. The IC antenna structure of claim 1 wherein the lens antenna is convex-shaped or concave-shaped.

7. The IC antenna structure of claim 1 further comprises:

a transmission line electrically coupled to the feed point.

8. The IC antenna structure of claim 7 further comprises:

an impedance matching circuit coupling the transmission line to an RF transceiver.

9. The IC antenna structure of claim 7 further comprises:

a transformer coupling the transmission line to an RF transceiver.

10. The IC antenna structure of claim 7 further comprises:

a die supporting the MEM area, the feed point, and the transmission line; and

a package substrate supporting the die.

11. The IC antenna structure of claim 7 further comprises:

a die; and

a package substrate that supports the die, the MEM area, the feed point, and the transmission line.

12. The IC antenna structure of claim 1 further comprises:

a ground plane proximal to the MEM area.

13. An integrated circuit (IC) antenna structure comprises:

a die;

a package substrate that supports the die;

a micro-electromechanical (MEM) area on the package substrate, wherein a non-planar three-dimensional radiating element is disposed within the MEM area; and

a feed point on the die, wherein the feed point provides an outbound radio frequency (RF) signal to the non-planar three-dimensional radiating element for transmission and receives an inbound RF signal from the non-planar three-dimensional radiating element.

14. The IC antenna structure of claim 13 , wherein the three-dimensional radiating element comprises at least one of:

a rectangle shape, a horn shape, and a waveguide shape to produce an aperture antenna, wherein the feed point is electrically coupled to the aperture antenna.

15. The IC antenna structure of claim 13 , wherein the three-dimensional radiating element comprises:

a lens shape to produce a lens antenna, wherein the feed point is positioned at a focal point of the lens antenna.

16. The IC antenna structure of claim 13 , wherein the three-dimensional radiating element comprises at least one of:

a biconical shape, a bow tie shape, a bi-cylinder shape, and a bi-elliptical shape to produce a three-dimensional dipole antenna, wherein the feed point is electrically coupled to the three-dimensional dipole antenna.

17. The IC antenna structure of claim 13 , wherein the three-dimensional radiating element comprises at least one of:

a plane, a corner shape, and a parabolic shape to produce a reflector antenna, wherein the feed point is positioned at a focal point of the reflector antenna.

18. The IC antenna structure of claim 13 further comprises:

a ground plane proximal to the MEM area; and

a transmission line electrically coupled to the feed point.

19. The IC antenna structure of claim 13 wherein the die supports the MEM area and the feed point.

20. The IC antenna structure of claim 13 wherein the package substrate supports the die, the MEM area and the feed point.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 09/05/2018 PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0133. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0456 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0133 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2012
From: ROFOUGARAN, AHMADREZA (REZA)
To: BROADCOM CORPORATION
Reel/Frame 028479/0784 →