IP Library Granted Patent US 8,716,738
Granted Patent B2
US 8,716,738 · App. 13/541,192 · Granted May 6, 2014

Semiconductor light-emitting device

Inventor: Jung Hyeok Bae (Gyeongsangnam-do, KR)
Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 8,716,738
App. No.
13/541,192
Granted
May 6, 2014
Kind
B2
Abstract

A semiconductor light-emitting device includes a light emitting structure on a substrate. The light emitting structure includes a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer. A plurality of transparent layers is disposed on the light emitting structure. A metal layer is disposed between the plurality of transparent layers. An electrode is electrically connected to the metal layer and contacts a portion of the metal layer.

Claims (36)

1. A semiconductor light-emitting device, comprising:

a substrate;

a light emitting structure on the substrate, the light emitting structure comprising a first conductive semiconductor layer on the substrate, a second conductive semiconductor layer on the first conductive semiconductor layer, and an active layer between the first conductive semiconductor layer and the second conductive semiconductor layer;

a transparent electrode layer on the second conductive semiconductor layer;

a metal layer disposed on a top surface of the transparent electrode layer;

a transparent layer disposed on a top surface of the metal layer and physically contacted with the top surface of the metal layer; and

an electrode electrically connected to the metal layer and physically contacted with a portion of the metal layer,

wherein the transparent layer has a hole and a portion of the electrode is disposed in the hole,

wherein the transparent layer has a material different from the transparent electrode layer,

wherein the transparent layer has a thickness different from a thickness of the metal layer and the transparent electrode layer, and

wherein a thickness of the transparent electrode layer is different from a thickness of the metal layer.

2. The semiconductor light-emitting device according to claim 1 , wherein the metal layer includes a different material from the electrode and has a hole corresponding to the electrode.

3. The semiconductor light-emitting device according to claim 1 , wherein the transparent electrode layer comprises a transparent conducting oxide (TCO) material.

4. The semiconductor light-emitting device according to claim 3 , wherein the electrode comprises a multi-branched pattern.

5. The semiconductor light-emitting device according to claim 4 , wherein the electrode comprises a pad.

6. The semiconductor light-emitting device according to claim 1 , wherein the electrode directly contacted with an upper surface of the metal layer.

7. The semiconductor light-emitting device according to claim 1 , wherein the transparent electrode layer comprises a thickness of 200 nm or less.

8. The semiconductor light-emitting device according to claim 7 , wherein the transparent layer comprises a thickness of 200 nm or less.

9. The semiconductor light-emitting device according to claim 1 , wherein the transparent layer comprises a metal oxide.

10. A semiconductor light-emitting device, comprising:

a substrate;

a light emitting structure on the substrate, the light emitting structure comprising a first conductive semiconductor layer on the substrate, a second conductive semiconductor layer on the first conductive semiconductor layer, and an active layer between the first conductive semiconductor layer and the second conductive semiconductor layer;

a transparent electrode layer on the second conductive semiconductor layer;

a metal layer disposed on a top surface of the transparent electrode layer;

a transparent layer disposed on a top surface of the metal layer and physically contacted with the top surface of the metal layer; and

a first electrode disposed on a top surface of the first conductive semiconductor layer; and

a second electrode physically contacted with top surface of the metal layer,

wherein the transparent layer has a hole and a portion of the electrode is disposed in the hole,

wherein the light emitting structure includes a nitride-based material,

wherein the hole has a width equal to or wider than that of the top surface of the second electrode,

wherein the transparent layer has a metal oxide material different from the transparent electrode layer, and

wherein the transparent electrode layer has a thickness different from the metal layer and the transparent layer has a thickness different from the metal layer and the transparent electrode layer.

11. The semiconductor light-emitting device according to claim 1 , wherein a lower portion of the second electrode is embedded in the transparent layer.

12. The semiconductor light-emitting device according to claim 11 , wherein the metal layer includes a different material from the second electrode and the transparent electrode layer comprises a transparent conducting oxide (TCO) material.

13. The semiconductor light-emitting device according to claim 12 , wherein the metal layer is disposed between the transparent electrode layer and the transparent layer.

14. The semiconductor light-emitting device according to claim 13 , wherein the transparent electrode layer and the transparent layer comprise a thickness of 200 nm or less.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2025
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: BOE HC SEMITEK LIMITED(HENGQIN)
Reel/Frame 070521/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
Priority Claims (1)
KR 10-2008-0114616 · Nov 18, 2008 · national
Continuity (2)
Continuation 12619955 · Nov 17, 2009
Related Publication 20120267677A1 · Oct 25, 2012