OXYNITRIDE PHOSPHOR AND METHOD OF MANUFACTURING THE SAME
An oxynitride phosphor and a method of manufacturing the same are revealed. The formula of the oxynitride phosphor is Ba 3-x Si 6 O 12 N 2 : Y x (0≦x≦1). Y is praseodymium (Pr) or terbium (Tb) used as a luminescent center. The oxynitride phosphor is synthesized by solid-state reaction. The oxynitride phosphor is excited by vacuum ultraviolet light with a wavelength range of 130 nm to 300 nm or ultraviolet to visible light with a wavelength range of 300 nm to 550 nm to emit light with a wavelength range of 400 nm to 700 nm. Moreover, the full-width at half-maximum of the emission spectrum is smaller than 30 nm. Thus the oxynitride phosphor is suitable for applications of backlights, plasma display panels and ultraviolet excitation. The oxynitride phosphor has higher application value.
1 . An oxynitride phosphor having a formula Ba 2.89 Si 6 O 12 N 2 : Y x , wherein x is ranging from 0 to 1;
wherein Y is praseodymium (Pr) or terbium (Tb) used as a luminescent center; and
wherein full-width at half-maximum of a peak of emission wavelength of the oxynitride phosphor is smaller than 30 nm.
2 . The oxynitride phosphor as claimed in claim 1 , wherein the oxynitride phosphor is excited by light with a wavelength range of 300 nm to 550 nm or 130 nm to 300 nm.
3 . A method of manufacturing an oxynitride phosphor as claimed in claim 1 comprising the steps of:
providing a precursor; and
sintering the precursor by solid-state reaction for synthesis of an oxynitride phosphor.
4 . The method as claimed in claim 3 , wherein the precursor includes at least one of elements selected from barium carbonate, silicon dioxide, silicon nitride, and praseodymium oxide.
5 . The method as claimed in claim 3 , wherein the precursor includes at least one of elements selected from barium carbonate, silicon dioxide, silicon nitride, and terbium oxide.
6 . The method as claimed in claim 3 , wherein a sintering temperature is ranging from 1200 degrees Celsius to 1800 degrees Celsius
7 . The method as claimed in claim 3 , wherein sintering pressure is ranging from 0.1 MPa to 1000 MPa.