IP Library Granted Patent US 8,980,122
Granted Patent B2
US 8,980,122 · App. 13/542,651 · Granted Mar 17, 2015

Contact release capsule useful for chemical mechanical planarization slurry

Inventor: Robin Ihnfeldt (San Diego, CA)
Assignee: General Engineering & Research, L.L.C.
C09C1/02H01L21/30625C09K3/1454C08K9/00C09K3/1436
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Quick Facts
Patent No.
US 8,980,122
App. No.
13/542,651
Granted
Mar 17, 2015
Kind
B2
Abstract

The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.

Claims (30)

1. A contact release capsule comprising a particle, a chemical payload, and an organic polymer coating, wherein:

the particle comprises a pore or pores which can be impregnated with a chemical payload,

the organic polymer coating is present on an outside surface of the particle and is configured to contain the chemical payload in the pore or pores, wherein the organic polymer coating comprises polyvinyl acetate,

the organic polymer coating is configured to be removable from the outside surface of the particle to release the chemical payload from the pore or pores by a shearing contact force with a wafer surface during a chemical mechanical planarization process, and

the particle has a porosity of equal to or greater than about 0.01 cm 3 /g.

2. The contact release capsule of claim 1 , wherein the particle comprises a material selected from the group consisting of fumed silica, colloidal silica, fumed alumina, colloidal alumina, ceria, MnO 2 , ZnO, TiO 2 , polymer and combinations thereof.

3. The contact release capsule of claim 1 , wherein the particle is spherical.

4. The contact release capsule of claim 3 , wherein the size of the particle is in the range of about 10 nm to about 1 μm.

5. The contact release capsule of claim 1 , wherein the chemical payload comprises a complexing agent selected from the group consisting of organic polymer, alkaline agent, organic amine, and combinations thereof.

6. The contact release capsule of claim 1 wherein the chemical payload is a compound selected from the group consisting of glycine ethylene-diamine-tetra-acetic-acid, alanine, phthalic acid, citric acid, oxalic acid acetic acid, tartaric acid, succinic acid, amino acid, ammonium hydroxalate, lactic acid, carboxylic acid, organic amine, and combinations thereof.

7. The contact release capsule of claim 1 , wherein the organic polymer coating further comprises a polymer selected from the group consisting of polyacrylate, polymethacrylate, polyethyleneglycol, poly-L-lysine, poly-vinyl alcohol, polysaccharide, polyethylene, polypropylene, polyisoprene, and combinations thereof.

8. The contact release capsule of claim 1 , wherein the organic polymer coating further comprises poly(N-isopropylacrylamide) or poly(N-isopropylmethacrylamide).

9. The contact release capsule of claim 1 , wherein the thickness of the organic polymer coating on the capsule is in the range of about 1 nm to about 1 μm.

10. The contact release capsule of claim 1 , wherein the capsule has a size in the range about 10 nm to about 1 μm.

11. The contact release capsule of claim 10 , wherein the size of the capsule is in the range of about 150 nm to about 350 nm.

12. The contact release capsule of claim 1 , wherein the particle comprises colloidal silica.

13. The contact release capsule of claim 1 , wherein the chemical payload comprises glycine.

14. The contact release capsule of claim 1 , wherein the particle comprises colloidal silica and the chemical payload comprises glycine.

15. The contact release capsule of claim 1 , wherein:

the particle comprises colloidal silica;

the chemical payload comprises glycine;

the particle has a size in the range of about 10 nm to about 300 nm;

the organic polymer coating has a thickness in the range of about 1 nm to about 1 μm; and

the particle has a porosity in the range about 0.01 cm 3 /g to about 0.5 cm 3 /g.

16. The contact release capsule of claim 15 , wherein the thickness of the organic polymer coating is in the range of about 2 nm to about 50 nm.

17. The contact release capsule of the claim 1 , wherein the porosity is in the range of about 0.01 cm 3 /g to about 0.6 cm 3 /g.

18. The contact release capsule of claim 1 , wherein:

the particle comprises a material selected from the group consisting of fumed silica, colloidal silica, fumed alumina, colloidal alumina, ceria, MnO 2 , ZnO, TiO 2 , polymer, and combinations thereof;

the chemical payload comprises a compound selected from the group consisting of glycine, ethylene-diamine-tetra-acetic-acid, alanine, phthalic acid, citric acid, oxalic acid, acetic acid, tartaric acid, succinic acid, amino acid, ammonium hydroxalate, lactic acid, carboxylic acid, organic amine, and combinations thereof; and

the organic polymer coating, further comprises a polymer selected from the group consisting of polyacrylate, polymethacrylate, polyethyleneglycol, poly-L-lysine, poly-vinyl alcohol, polysaccharide, polyethylene, polypropylene, polyisoprene, and combinations thereof.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2014
From: IHNFELDT, ROBIN V.
To: GENERAL ENGINEERING & RESEARCH, L.L.C.
Reel/Frame 033061/0087 →
Continuity (2)
Provisional Application 61505835 · Jul 8, 2011
Related Publication 20130280910A1 · Oct 24, 2013