Light emitting module and illumination system including the same
A light emitting module is disclosed. The light emitting module includes a circuit board, a plurality of light emitting devices mounted on the circuit board and spaced apart from each other, molding parts wrapping the respective light emitting devices, and a reflective member disposed on the circuit board to surround the light emitting devices. The reflective member has a height greater than that of each of the molding parts. The reflective member has a plurality of openings exposing the light emitting devices, and each of the openings has a reflective side wall extending upward from the circuit board.
1. A light emitting module comprising:
a circuit board;
a plurality of light emitting devices disposed on the circuit board and spaced apart from each other;
molding parts disposed on circuit board and molded around the respective light emitting devices;
a reflective member disposed on the circuit board surrounding the light emitting devices, wherein the reflective member has a height greater than that of each of the molding parts; and
molding fixing parts disposed on the circuit board and contacting outer circumferences of the respective molding parts and fixing edges of the respective molding parts,
wherein the reflective member has a plurality of openings exposing the light emitting devices, and each of the openings has a reflective side wall extending upward from the circuit board, and
wherein the reflective side wall is spaced apart from the respective molding parts and the molding fixing parts are spaced apart from the light emitting devices, and portions of the molding parts are disposed between the light emitting devices and the molding fixing parts.
2. The light emitting module according to claim 1 , wherein the reflective member is formed of polyethylene terephthalate.
3. The light emitting module according to claim 1 , wherein the circuit board comprises:
a heat dissipation layer;
a dielectric layer disposed on one surface of the heat dissipation layer; and
a first conductive layer and a second conductive layer disposed on the dielectric layer and electrically separated from each other, and wherein each of the light emitting devices is electrically connected to the first conductive layer and the second conductive layer.
4. The light emitting module according to claim 3 , wherein the circuit board further comprises a solder resist layer disposed on the dielectric layer and at least a portion of the solder resist layer is interposed between the first conductive layer and the second conductive layer.
5. The light emitting module according to claim 1 , wherein the openings are through holes, wherein each of the through holes has the reflective side wall.
6. The light emitting module according to claim 5 , wherein the reflective member is spaced apart from the molding fixing parts.
7. The light emitting module according to claim 1 , wherein the reflective side walls are tilted with respect to the circuit board.
8. The light emitting module according to claim 7 , wherein an outer circumference of each of the molding parts contacts a lateral surface of a corresponding one of the reflective side walls.
9. The light emitting module according to claim 1 , further comprising a fixing member positioned between the circuit board and the reflective member.
10. The light emitting module according to claim 1 , further comprising reflective coating layers disposed on the respective reflective side walls.
11. The light emitting module according to claim 10 , wherein each of the reflective coating layers is formed of at least one selected from among TiO.sub.2, Ag and a reflective sheet.
12. The light emitting module according to claim 1 , wherein at least a portion of the reflective member is spaced apart from the molding parts.
13. The light emitting module according to claim 1 , wherein a portion of the reflective member has a protrusion overlapping with each of the molding parts in a vertical direction.
14. The light emitting module according to claim 1 , further comprising at least one wire electrically connecting each of the light emitting devices to a first conductive layer and a second conductive layer.
15. The light emitting module according to claim 14 , wherein each of the molding parts covers a corresponding one of the light emitting devices and the wire, and at least a portion of each of the molding parts has a curvature.
16. The light emitting module according to claim 1 , wherein each of the openings is formed in a circular or polygonal shape.
17. The light emitting module according to claim 1 , wherein the reflective member comprises a plurality of layers, and an uppermost surface of the reflective member is higher than an uppermost surface of each of the molding parts.
18. An illumination system comprising:
a bottom cover;
a reflective plate disposed on the bottom cover;
a light guide plate disposed on the reflective plate, wherein the light guide plate has an incidence surface upon which light is incident;
a light emitting module emitting light to the incidence surface;
an optical sheet disposed on the light guide plate; and
a display panel disposed on the optical sheet, wherein the light emitting module comprises:
a circuit board;
a plurality of light emitting devices mounted on the circuit board and spaced apart from each other;
molding parts disposed on the circuit board and wrapping the respective light emitting devices;
a reflective member disposed on the circuit board surrounding the light emitting devices, wherein the reflective member has a height greater than that of each of the molding parts; and
molding fixing parts disposed on the circuit board and contacting outer circumferences of the respective molding parts and fixing edges of the respective molding parts,
wherein the reflective member has a plurality of openings exposing the light emitting devices, and each of the openings has a reflective side wall extending upward from the circuit board, and
wherein the reflective side wall is spaced apart from the respective molding parts and the molding fixing parts are spaced apart from the light emitting devices, and portions of the molding parts are disposed between the light emitting devices and the molding fixing parts.
19. The illumination system according to claim 18 , wherein a distance from the incidence surface to an uppermost surface of each of the molding parts is greater than a distance from the incidence surface to an uppermost surface of a corresponding one of the reflective side walls.
20. An illumination system comprising:
a bottom cover;
a reflective plate disposed on the bottom cover;
a light guide plate disposed on the reflective plate, wherein the light guide plate has an incidence surface upon which light is incident;
a light emitting module emitting light to the incidence surface;
an optical sheet disposed on the light guide plate; and
a display panel disposed on the optical sheet, wherein the light emitting module comprises:
a circuit board;
a plurality of light emitting devices mounted on the circuit board and spaced apart from each other;
molding parts disposed on the circuit board and wrapping the respective light emitting devices; and
a reflective member disposed on the circuit board surrounding the light emitting devices, wherein the reflective member has a height greater than that of each of the molding parts, and
wherein the reflective member has a plurality of openings exposing the light emitting devices, and each of the openings has a reflective side wall extending upward from the circuit board, and wherein the uppermost surface of each of the reflective side walls contacts the incidence surface, and the uppermost surface of each of the molding parts is spaced apart from the incidence surface.