IP Library Patent Application 13543462
Patent Application
App. No. 13/543,462

NANOWIRE ENHANCED TRANSPARENT CONDUCTIVE OXIDE FOR THIN FILM PHOTOVOLTAIC DEVICES

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Patent No.
US None
App. No.
13/543,462
Abstract

A thin-film photovoltaic devices includes transparent conductive oxide which has embedded within it nanowires at less than 2% nominal shadowing area. The nanowires enhance the electrical conductivity of the conductive oxide.

Claims (44)

1 . A thin-film photovoltaic device comprising:

an absorber material characterized by a copper-based thin-film photovoltaic compound overlying a conductive material formed on a substrate;

a buffer material overlying the absorber material;

a window layer comprising a transparent conductive oxide material overlying the buffer material; and

conductive nanowires embedded in the window layer in a substantially random configuration with less than 2% nominal shadowing area to visible light, the nanowires having an electrical conductivity substantially higher than the transparent conductive oxide material.

2 . The structure of claim 1 wherein the absorber material comprises a CIS/CIGS/CIGSS compound including copper species, indium species, gallium species, selenium species, sulfur species, sodium species.

3 . The structure of claim 1 wherein the buffer material comprises a cadmium sulfide (CdS) layer, cadmium-free zinc oxide (ZnO) layer, zinc sulfide (ZnS) and ZnO mixed layer.

4 . The structure of claim 1 wherein the transparent conductive oxide material is characterized by a metal oxide film doped to have a sheet resistivity ranging from 10 2 to 10 4 mΩ·cm.

5 . The structure of claim 1 wherein the nanowires comprise nanostructures formed using chemical synthesis of at least one metal species selected from aluminum, copper, silver, gold, molybdenum, and tungsten.

6 . The structure of claim 1 wherein the nanowires generally have a lateral dimension between 10 nm and 100 nm and have an aspect ratio between 1:1 and 1000:1.

7 . A method for manufacturing thin-film photovoltaic devices comprising:

providing a substrate structure;

forming a barrier layer over the substrate structure;

forming a first electrode of conductive material over the barrier layer;

depositing a combination of copper, sodium, indium, and gallium on the first electrode;

forming an absorber material by heating the structure;

forming a buffer material over the absorber material;

forming a first conductive oxide over the buffer material;

disposing conductive nanowires on the first conductive oxide material; and

forming a second conductive oxide material over the nanowires.

8 . The method of claim 7 wherein the step of forming the barrier layer comprises depositing a dielectric material selected from silicon oxide, aluminum oxide, titanium nitride, silicon nitride, tantalum oxide, and zirconium oxide.

9 . The method of claim 7 wherein the step of forming the conductive material comprises depositing at least one layer of a metal and/or a metal oxide over the barrier layer, the metal being selected from molybdenum, tungsten, and zinc.

10 . The method of claim 7 wherein the absorber material comprises a CIGS/CIGSS compound material which includes copper, indium, gallium, selenium, and sulfur.

11 . The method of claim 7 wherein the step of forming a buffer material comprises performing a deposition process to apply a layer of at least one of ZnO and ZnS over the absorber material.

12 . The method of claim 7 wherein the first conductive oxide material comprises a zinc oxide film doped with boron to have sheet resistivity about 3 Ω per square and greater than 90% optical transparency for visible light.

13 . The method of claim 7 wherein the step of disposing nanowires comprises spraying conductive nanowires to form a randomly aligned matrix covering about 1% of the surface area of the first conductive oxide material.

14 . The method of claim 13 wherein the step of forming a second conductive oxide material comprises covering the nanowires to embed them within the combined layers of first and second conductive oxide material.

15 . The method of claim 13 wherein the second conductive oxide material comprises zinc oxide having substantially the same doping level of boron as the first conductive oxide material.

16 . A method for fabricating a solar cell structure comprising:

providing a substrate structure;

forming an absorber material overlying the substrate structure to form an upper surface region;

applying nanowires to the upper surface region with a coverage of at least 1%;

forming transparent conductor material over the nanowires to embed them within the transparent conductor material; and

the nanowires facilitating scattering of incident electromagnetic radiation and allowing the electromagnetic radiation to traverse the thickness of the transparent conductor material.

17 . The method of claim 16 wherein the nanowires comprise one of silver, gold, aluminum, molybdenum, or tungsten.

18 . The method of claim 16 wherein the transparent conductor is from about 1 to 3 microns thick.

19 . The method of claim 16 wherein the absorber material comprises copper, indium and gallium.

20 . The method of claim 16 wherein the step of applying comprises nanowires.

21 . The method of claim 16 wherein the step of applying nanowires and the step of forming of the transparent conductor material occur substantially simultaneously.

22 . The method of claim 16 wherein the transparent conductor material has a sheet resistivity of less than about 3 ohms/square.

23 . The method of claim 16 wherein transparent conductor material with the nanowires has a transparency of at least 90% of incident electromagnetic radiation between 350 nm and 1400 nm.

24 . The method of claim 16 wherein the nanowires comprise an aligned array, a random mesh, a cross-linked matrix, or scattered individual wires.

25 . The method of claim 16 wherein the nanowires comprise a material selected from metal, carbon, and organic material, and have a diameter of less than about 100 nm.

26 . The method of claim 16 further comprising scribing the thickness of the transparent conductor material including the nanowires to form an electrode.

Assignments (4)
CHANGE OF NAME Recorded Feb 21, 2014
From: HETF SOLAR INC.
To: STION CORPORATION
Reel/Frame 032324/0402 →
SECURITY AGREEMENT Recorded Feb 10, 2014
From: DEVELOPMENT SPECIALIST, INC., SOLELY IN ITS CAPACITY AS THE ASSIGNEE FOR THE BENEFIT OF THE CREDITORS OF CM MANUFACTURING, INC. (F/K/A STION CORPORATION), AND CM MANUFACTURING (F/K/A STION CORPORATION)
To: HETF SOLAR INC.
Reel/Frame 032209/0879 →
CHANGE OF NAME Recorded Jan 30, 2014
From: STION CORPORATION
To: CM MANUFACTURING, INC.
Reel/Frame 032144/0774 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2012
From: FARRIS, CHESTER A., III; WIETING, ROBERT D.; TANDON, ASHISH
To: STION CORPORATION
Reel/Frame 029255/0175 →