Plasma treatment method, plasma treatment apparatus, and semiconductor device manufacturing method

1. A plasma treatment method, comprising:

creating a plasma from a mixed gas containing carbon and nitrogen;

generating, based on the plasma, a CN active species;

treating a first surface of a semiconductor substrate with the CN active species to reduce at least one of metal contaminants or crystal defects in the semiconductor substrate;

forming a polymer layer on the semiconductor substrate based on the treatment;

determining a thickness value of the polymer layer on the semiconductor substrate;

determining a first time period based on the thickness value; and

removing the polymer layer from the semiconductor substrate, based on chemical treatment of the polymer layer for the first time period,

wherein a second surface of the semiconductor substrate is above the first surface.

2. The plasma treatment method according to claim 1 , further comprising applying a first bias power, that is in a range of 0 W to 50 W, to the semiconductor substrate.

3. The plasma treatment method according to claim 2 , wherein the first bias power is in a range of 0 W to 20 W.

4. The plasma treatment method according to claim 2 , wherein the first bias power is based on at least one of the mixed gas or the thickness value of the polymer layer.

5. The plasma treatment method according to claim 1 , wherein a maximum power for creation of the plasma ranges from 1,000 W to 2,000 W.

6. The plasma treatment method according to claim 1 , further comprising monitoring a CN emission intensity value of the CN active species.

7. The plasma treatment method according to claim 6 , further comprising O 2 cleaning based on fluctuations in the CN emission intensity value.

8. A method for manufacturing a semiconductor device, the method comprising:

creating a plasma from a mixed gas containing carbon and nitrogen;

generating, based on the plasma, a CN active species;

treating a first surface of a semiconductor substrate with the CN active species to reduce at least one of metal contaminants or crystal defects in the semiconductor substrate;

forming a polymer layer on the semiconductor substrate based on the treatment;

determining a thickness value of the polymer layer on the semiconductor substrate;

determining a first time period based on the thickness value;

removing the polymer layer from the semiconductor substrate, based on chemical treatment of the polymer layer for the first time period,

wherein a second surface of the semiconductor substrate is above the first surface; and

forming a semiconductor component on the semiconductor substrate.

9. A plasma treatment apparatus, comprising:

a plasma treatment chamber configured to:

create a plasma from a mixed gas containing carbon and nitrogen;

generate, based on the plasma, a CN active species;

treat a first surface of a semiconductor substrate with the CN active species, to reduce at least one of metal contaminants or crystal defects in the semiconductor substrate; and

form a polymer layer on the semiconductor substrate based on the treatment;

a polymer thickness measurement chamber configured to:

determine a thickness value of the polymer layer; and

determine a first time period based on the thickness value; and

an organic material removing chamber configured to:

remove the polymer layer from the semiconductor substrate, based on chemical treatment of the polymer layer for the first time period,

wherein a second surface of the semiconductor substrate is above the first surface.

10. The plasma treatment apparatus according to claim 9 , wherein the plasma treatment chamber is further configured to store instructions that indicate plasma treatment conditions for generation of the CN active species.

11. The plasma treatment apparatus according to claim 9 , wherein the plasma treatment chamber includes a CN gas detoxifying unit.

12. A plasma treatment method, comprising:

creating a plasma from a mixed gas,

wherein the mixed gas contains a carbon containing gas, a nitrogen containing gas and an inert gas,

wherein the carbon containing gas is selected from a first group consisting of CHF 3 , CH 2 F 2 , C 4 F 8 , C 5 H 8 , CO, C 2 H 5 OH, and CH 3 OH,

wherein the nitrogen containing gas is selected from a second group consisting of N 2 and NH 3 , and

wherein the inert gas is selected from a third group consisting of Ar and He;

generating, based on the plasma, a CN active species;

treating, a first surface of a semiconductor substrate with the CN active species to reduce at least one of metal contaminants or crystal defects in the semiconductor substrate, based on:

a first gas flow rate of the carbon containing gas that is 100 sccm,

a second gas flow rate of the nitrogen containing gas that is 100 sccm,

a gas flow rate of the inert gas that is 500 sccm,

a gas pressure that is 30 mTorr,

a treatment time that is 10 seconds,

a top power that is in a first range from 1,000 W to 2,000 W, and

a bias power that is in a second range from 0 W to 50 W;

forming a polymer layer on the semiconductor substrate based on the treatment;

determining a thickness value of the polymer layer on the semiconductor substrate;

determining a first time period based on the thickness value; and

removing the polymer layer from the semiconductor substrate, based on chemical treatment of the polymer layer for the first time period,

wherein a second surface of the semiconductor substrate is above the first surface.

13. The plasma treatment method according to claim 12 , wherein the bias power is based on at least one of the mixed gas or the thickness value of the polymer layer.