IP Library Granted Patent US 8,860,878
Granted Patent B2
US 8,860,878 · App. 13/545,499 · Granted Oct 14, 2014

Camera module, and manufacturing device and method for the same

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Quick Facts
Patent No.
US 8,860,878
App. No.
13/545,499
Granted
Oct 14, 2014
Kind
B2
Abstract

A camera module includes an imaging sensor, a power feed electrode, a first conductive member, and a first sealing member. The imaging sensor includes a light-receiving surface receiving light gathered by a lens. The power feed electrode is formed to a surface including the light receiving-surface of the imaging sensor, and the power feed electrode is configured to make a power feed. The first conductive member is configured to electrically connect the power feed electrode and a drive electrode. The drive electrode is provided to a drive section configured to drive the lens in accordance with the power feed. The first sealing member is formed by sealing the first conductive member.

Claims (22)

1. A camera module, comprising:

an imaging sensor including a light-receiving surface, the light-receiving surface receiving light gathered by a lens;

a power feed electrode formed to a surface including the light receiving-surface of the imaging sensor, the power feed electrode being configured to make a power feed;

a first conductive member configured to electrically connect the power feed electrode and a drive electrode, the drive electrode being provided to a drive section configured to drive the lens in accordance with the power feed; and

a first sealing member formed by sealing the first conductive member.

2. The camera module according to claim 1 , further comprising

a transmissive member provided on the imaging sensor to cover the light-receiving surface, wherein

the first conductive member is configured to go through the transmissive member to electrically connect together the power feed electrode and the drive electrode.

3. The camera module according to claim 1 , further comprising

a second conductive member provided on a rear surface of the surface including the light-receiving surface of the imaging sensor, wherein

the power feed electrode is electrically connected also to the second conductive member by going through the imaging sensor.

4. The camera module according to claim 1 , further comprising

a through electrode formed to go through the drive section, the through electrode being connected to the drive electrode, wherein

the first conductive member connects together the power feed electrode and the drive electrode via the through electrode.

5. A manufacturing device, comprising:

a formation section configured to form a power feed electrode to a surface including a light-receiving surface of an imaging sensor for a power feed, the light-receiving surface receiving light gathered by a lens;

a connection section configured to connect, by a first conductive member, the power feed electrode and a drive electrode, the drive electrode being provided to a drive section configured to drive the lens in accordance with the power feed; and

a sealing section configured to seal the first conductive member.

6. A manufacturing method for a manufacturing device that manufactures a camera module, comprising, for execution by the manufacturing device:

forming a power feed electrode to a surface including a light-receiving surface of an imaging sensor for a power feed, the light-receiving surface receiving light gathered by a lens;

connecting, by a first conductive member, the power feed electrode and a drive electrode, the drive electrode being provided to a drive section configured to drive the lens in accordance with the power feed; and

sealing the first conductive member.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2012
From: IWAFUCHI, TOSHIAKI; FURUSAWA, TOSHIHIRO; HIGASHITSUTSUMI, YOSHIHITO
To: SONY CORPORATION
Reel/Frame 028523/0828 →