Semiconductor apparatus
A semiconductor apparatus includes a semiconductor substrate. The semiconductor substrate includes an active region in which a semiconductor device is formed, and a peripheral region which is located between the active region and an edge surface of the semiconductor substrate. A first insulating layer including conductive particles is formed above at least a part of the peripheral region. By constructing the semiconductor apparatus in this manner, generation of a high electric field in the peripheral region can be suppressed. Therefore, voltage endurance characteristics of the semiconductor apparatus can be improved.
1. A semiconductor apparatus comprising:
a semiconductor substrate having a substantially continuous semiconductor layer extending to an edge surface of the semiconductor substrate;
a first insulating layer;
a surface electrode;
an external electrode; and
a conductive member,
wherein the semiconductor layer comprises:
an active region in which a semiconductor device is formed, and
a peripheral region which is located between the active region and the edge surface of the semiconductor substrate; and
wherein
the surface electrode is located on the active region,
the first insulating layer includes conductive particles, is formed above at least a part of the peripheral region, and has an opening above at least a part of the surface electrode, and
the conductive member is different from the conductive particles and electrically connects the surface electrode in the opening to the external electrode.
2. The semiconductor apparatus of claim 1 , further comprising a second insulating layer not including the conductive particles and interposed between the first insulating layer and the semiconductor layer.
3. The semiconductor apparatus of claim 1 , wherein the conductive member is selected from at least one of a brazing material, bonding wire or a conductive paste.
4. A semiconductor apparatus comprising:
a semiconductor substrate; and
a first insulating layer,
wherein the semiconductor substrate comprises:
an active region in which a semiconductor device is formed, and
a peripheral region which is located between the active region and an edge surface of the semiconductor substrate; and
wherein the first insulating layer includes conductive particles and is formed above at least a part of the peripheral region,
wherein the semiconductor substrate further comprises:
a p-type region formed in a range in the semiconductor substrate which is located at a border between the peripheral region and the active region and exposed at an upper surface of the semiconductor substrate,
an n-type region formed in a range in the semiconductor substrate which is exposed at the upper surface and the edge surface of the semiconductor substrate,
a p-type low concentration region, an impurity concentration of which is lower than the p-type region and the n-type region, and
a n-type low concentration region, an impurity concentration of which is lower than the p-type region and the n-type region,
wherein the p-type low concentration region and the n-type low concentration region are formed in a range in the semiconductor substrate which is located between the p-type region and the n-type region and exposed at the upper surface of the semiconductor substrate, and
the first insulating layer is formed above an entirety of the p-type low concentration region and above the n-type low concentration region.
5. A semiconductor apparatus comprising:
a semiconductor substrate;
a first insulating layer;
a surface electrode;
an external electrode; and
a solder,
where-in the semiconductor substrate comprises:
an active region in which a semiconductor device is formed, and
a peripheral region which is located between the active region and an edge surface of the semiconductor substrate; and
wherein
the surface electrode is located on the active region,
the first insulating layer includes conductive particles, is formed above at least a part of the peripheral region, and has an opening above at least a part of the surface electrode, and
the solder is different from the conductive particles and electrically connects the surface electrode in the opening to the external electrode.