SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE
A soft dilute copper alloy wire is composed of a soft dilute copper alloy material containing an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Cu, V, Ni, Mn, and Cr, and balance comprising Cu. An average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 μm.
1 . A soft dilute copper alloy wire, comprising
a soft dilute copper alloy material containing an additive element selected from a group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr, and balance comprising Cu,
wherein an average size of crystal grains lying from a surface of the soft dilute copper alloy wire at least to a depth of 20% of a wire diameter is not greater than 20 μm.
2 . The soft dilute copper alloy wire according to claim 1 , further containing:
higher than 2 massppm of oxygen; and
2 massppm to 12 massppm of sulfur.
3 . The soft dilute copper alloy wire according to claim 1 , wherein
a tensile strength is not less than 210 MPa;
an elongation rate is not less than 15%; and
a Vickers hardness is not more than 65 Hv.
4 . The soft dilute copper alloy wire according to claim 1 , wherein
an electrical conductivity is not lower than 98% IACS.
5 . The soft dilute copper alloy wire according to claim 1 , containing:
4 massppm to 55 massppm of Ti as the additive element; and
higher than 2 massppm and not more than 30 massppm of oxygen.
6 . A soft dilute copper alloy plate, comprising:
a soft dilute copper alloy material containing an additive element selected from a group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Mn, and Cr, and balance comprising Cu,
wherein an average size of crystal grains lying from a surface of the soft dilute copper alloy plate at least to a depth of 20% of a plate thickness is not greater than 20 μm.
7 . The soft dilute copper alloy plate according to claim 6 , further containing:
higher than 2 massppm of oxygen; and
2 massppm to 12 massppm of sulfur.
8 . The soft dilute copper alloy plate according to claim 6 , wherein
a tensile strength is not less than 210 MPa;
an elongation rate is not less than 15%; and
a Vickers hardness is not more than 65 Hv.
9 . The soft dilute copper alloy plate according to claim 6 , wherein
an electrical conductivity is not lower than 98% IACS.
10 . The soft dilute copper alloy plate according to claim 6 , containing:
4 massppm to 55 massppm of Ti as the additive element;
2 massppm to 12 massppm of sulfur; and
higher than 2 massppm and not more than 30 massppm of oxygen.
11 . A soft dilute copper alloy stranded wire, comprising
a plurality of the soft dilute copper alloy wires according to claim 1 stranded together.