Micro-fluidic pump
View Patent ↗A micro-fluidic pump comprises one or more channels having an array of resistive heaters, an inlet, outlet and a substrate as a heat sink and a means of cooling the device. The pump is operated with a fire-to-fire delay and/or a cycle-to-cycle delay to control the pumping rate and minimize heating of liquid inside the pump during its operation.
1. A micro-fluidic pump, comprising:
a substrate;
a plurality of resistive heaters on the substrate; and
a cover layer above and spaced from the resistive heaters defining a channel with a volume in which fluid in the channel can flow from one heater to a next heater of the resistive heaters at a rate of over 0.1 μl/min without escaping the cover layer, wherein a minimum number of the resistive heaters in the channel corresponds to a ratio of a time required to cool down one resistive heater to an initial temperature after having been activated and another time between activating two adjacent said resistive heaters.
2. The pump of claim 1 , wherein the resistive heaters have a rectangular planar shape including a heater length and heater width and the channel has a channel width such that a ratio of the channel width to the heater length is in a range from about 1.0 to about 2.0.
3. The pump of claim 1 , wherein the resistive heaters have a heater width and a spacing between two adjacent said resistive heaters is in a range from about 1.0 to about 4,0 times said heater width.
4. The pump of claim 1 , wherein the resistive heaters electrically connect to circuitry for activation.
5. The pump of claim 1 , further including a flow feature layer on the substrate defining upstanding wails under the cover layer.
6. The pump of claim 5 , wherein the walls have a height in a range from about 10 to about 100 microns.
7. The pump of claim 6 , wherein the height is about 40 microns.
8. The pump of claim 5 , wherein the resistive heaters number at least nineteen resistive heaters adjacent to one another in the channel between said upstanding walls and some of the resistive heaters are asymmetrically positioned adjacent one another.
9. A micro-fluidic pump, comprising:
a substrate;
a plurality of resistive heaters on the substrate; and
a cover layer above and spaced from the resistive heaters defining a channel with a volume in which fluid can flow sequentially from one heater to a next heater of the resistive heaters without escaping the cover layer, wherein the resistive heaters have a rectangular planar shape including a heater length and heater width and the channel has a channel width such that a ratio of the channel width to the heater length is in a range from about 1.0 to about 2.0 , wherein a minimum number of the resistive heaters in die channel corresponds to a ratio of a time required to cool down one resistive heater to an initial temperature after having been activated and another time between activating two adjacent said resistive heaters.
10. The pump of claim 9 , wherein the heater length and the channel width extend parallel to one another.
11. The pump of claim 9 , wherein a spacing between two adjacent said resistive heaters is in a range from about 1.0 to about 4,0 times said heater width.
12. A micro-fluidic pump, comprising:
a substrate;
a plurality of resistive heaters on the substrate;
a cover layer above and spaced from the resistive heaters defining a channel with a volume in which fluid can flow sequentially on the substrate from one heater to a next heater of the resistive heaters without escaping the cover layer, wherein the resistive heaters have a rectangular planar shape including a heater length and heater width and a spacing between two adjacent heaters is in a range of 1.0 to 4.0 times the heater width; and
a flow feature layer on the substrate defining upstanding walls under the cover layer, wherein a minimum number of the resistive heaters adjacent to one another in the channel between said upstanding walls equal the ratio of t cooling /t fire-to-fire delay) , rounded up to a next whole number, whereby t cooling is a time required to cool down one resistive heater to an initial temperature after having been activated and t (fire-to-fire delay) is a time between activating two adjacent said resistive heaters.
13. The pump of claim 12 , wherein the spacing between each of the resistive heaters is substantially equidistant.
14. The pump of claim 12 , wherein the spacing of all the resistive heaters is symmetrical along the channel.
15. A micro-fluidic pump, comprising;
a substrate;
a series of resistive heaters on the substrate;
a cover layer above the resistive heaters defining a channel with a volume space in which fluid in the channel can flow sequentially from one heater to a next heater of the resistive heaters without escaping the cover layer; and
a plurality of cooling fins above the cover layer to dissipate heat during use, wherein a minimum number of the resistive heaters in the channel corresponds to a ratio of a time required to cool down one resistive heater to an initial temperature after having been activated and another time between activating two adjacent said resistive heaters.
16. A micro-fluidic pump, comprising:
a substrate;
a series of resistive heaters on the substrate;
a cover layer above the resistive heaters defining channel with a volume space in which fluid in the channel can flow sequentially from one heater to a next heater of the resistive heaters without escaping the cover layer; and
a heat sink base mounted beneath the substrate to dissipate heat during use, wherein a minimum number of the resistive heaters in the channel corresponds to a ratio of a ratio of time required to cool down one resistive heater to an initial temperature after having been activated and another time between activating two adjacent said resistive heaters.
17. The pump of claim 16 , further including a liquid container.
18. The pump of claim 17 , further including a fluid inlet port to introduce the fluid in the channel to flow past the series of resistive heaters, the liquid container being mounted adjacent the fluid inlet port.
19. The pump of claim 18 , further including a fluid outlet port beneath the fluid inlet port, the liquid container holding said fluid to prime the channel through capillary action.
20. The pump of claim 16 , wherein the heat sink base is a thermally conductive material.