IP Library Granted Patent US 9,571,060
Granted Patent B2
US 9,571,060 · App. 13/557,593 · Granted Feb 14, 2017

Transformer of the balanced-unbalanced type

Inventors: Frederic Gianesello (Saint Pierre d'Albigny, FR); Romain Pilard (Goncelin, FR); Cedric Durand (St. Martin d'Heres, FR)
Assignees: STMICROELECTRONICS (CROLLES 2) SAS; STMICROELECTRONICS SA
H03H7/42H01F27/2804H01F27/29H01F27/38H01F27/40H01L23/5227H04W88/02H01L23/5223H01L2924/0002Y10T29/4902
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Quick Facts
Patent No.
US 9,571,060
App. No.
13/557,593
Granted
Feb 14, 2017
Kind
B2
Abstract

A transformer of the balanced-unbalanced type includes a primary inductive circuit and a secondary inductive circuit housed inside an additional inductive winding connected in parallel to the terminals of the secondary circuit and inductively coupled with the primary circuit and the secondary circuit.

Claims (21)

1. A transformer of the balanced-unbalanced type comprising:

a plurality of metal levels having a primary inductive circuit and a secondary inductive circuit formed thereon, the primary inductive circuit having a first port; and

an additional inductive winding having a pair of differential ports and an innermost turn directly surrounding a portion of an outermost turn of each of the primary and secondary inductive circuits, the additional inductive winding coupled in parallel to terminals of the secondary inductive circuit, and inductively coupled with the primary inductive circuit and the secondary inductive circuit.

2. The transformer according to claim 1 , wherein the additional inductive winding is symmetrical and coplanar with the primary inductive circuit and the secondary inductive circuit.

3. The transformer according to claim 1 , wherein the additional inductive winding is formed on the plurality of metal levels in an interlaced and stacked manner.

4. The transformer according to claim 1 , further comprising a semiconductor substrate supporting the primary inductive circuit, the secondary inductive circuit and the additional inductive winding.

5. A wireless communication circuit comprising:

an antenna;

a processor; and

a transformer coupled between the antenna and the processor, and comprising

a plurality of metal levels having a primary inductive circuit and a secondary inductive circuit formed thereon, the primary inductive circuit having a first port, and

an additional inductive winding having a pair of differential ports and an innermost turn directly surrounding a portion of an outermost turn of each of the primary and secondary inductive circuits, the additional inductive winding coupled in parallel to terminals of the secondary inductive circuit, and inductively coupled with the primary inductive circuit and the secondary inductive circuit.

6. The transformer according to claim 5 , wherein the additional inductive winding is symmetrical and coplanar with the primary inductive circuit and the secondary inductive circuit.

7. The transformer according to claim 5 , further comprising capacitors respectively connected between terminals of the additional inductive winding and the terminals of the secondary inductive circuit; wherein the additional inductive winding includes a middle point configured to be coupled to a voltage source.

8. A method of making a transformer of the balanced-unbalanced type, the method comprising:

forming a primary inductive circuit and a secondary inductive circuit on a plurality of metal levels, the primary inductive circuit having a first port; and

surrounding a portion of an outermost turn of each of the primary and secondary inductive circuits directly with an innermost turn of an additional inductive winding coupled in parallel to terminals of the secondary inductive circuit, and inductively coupled with the primary inductive circuit and the secondary inductive circuit.

9. The method according to claim 8 , wherein the additional inductive winding is symmetrical and coplanar with the primary inductive circuit and the secondary inductive circuit.

10. The method according to claim 8 , wherein the additional inductive winding is formed on the plurality of metal levels in an interlaced and stacked manner.

11. The method according to claim 8 , further comprising supporting the primary inductive circuit, the secondary circuit and the additional inductive winding on a semiconductor substrate.

12. The method according to claim 8 , further comprising connecting respective capacitors between terminals of the additional inductive winding and the terminals of the secondary inductive circuit; wherein the additional inductive winding includes a middle point configured to be coupled to a voltage source.

Assignments (2)
CHANGE OF NAME Recorded Dec 8, 2023
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 065835/0159 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2012
From: GIANESELLO, FREDERIC; PILARD, ROMAIN; DURAND, CEDRIC
To: STMICROELECTRONICS (CROLLES 2) SAS; STMICROELECTRONICS SA
Reel/Frame 029286/0314 →
Priority Claims (2)
FR 11 56881 · Jul 28, 2011 · national
FR 12 55603 · Jun 15, 2012 · national
Continuity (1)
Related Publication 20130026846A1 · Jan 31, 2013