Hot runner manifolds interconnected in a common plane
View Patent ↗A hot runner apparatus includes a mold plate defining a pocket; a plurality of sub-manifolds; and a bridge manifold positioned in the pocket and between the sub-manifolds. The bridge manifold and the sub-manifolds are oriented in a common plane. The bridge manifold receives a melt from a melt source. Each of the sub-manifolds is coupled to the bridge manifold to receive the melt from the bridge manifold via a junction between an opening of a network of melt channels within the bridge manifold and an opening of a network of melt channels within each of the sub-manifolds. The sub-manifolds are urged against the bridge manifold to form a seal therebetween, when the bridge manifold and the sub-manifolds thermally expand urging the sub-manifolds against contact regions of a pair of opposing walls of the pocket. The respective opposing walls define a hollow region separated from the respective contact regions by a wall portion.
1. A hot runner apparatus comprising:
a mold plate defining a pocket;
a plurality of sub-manifolds; and
a bridge manifold positioned in the pocket and between the sub-manifolds, the bridge manifold and the sub-manifolds oriented in a common plane, the bridge manifold for receiving a melt from a melt source, each of the sub-manifolds coupled to the bridge manifold to receive the melt from the bridge manifold via a junction between an opening of a network of melt channels within the bridge manifold and an opening of a network of melt channels within each of the sub-manifolds, the sub-manifolds being urged against the bridge manifold to form a seal therebetween when the bridge manifold and the sub-manifolds thermally expand urging the sub-manifolds against contact regions of a pair of opposing walls of the pocket, the respective opposing walls defining a hollow region separated from the respective contact regions by a wall portion.
2. The hot runner apparatus of claim 1 , further comprising a contact pad positioned between the wall portion and the respective sub-manifold.
3. The hot runner apparatus of claim 2 , wherein the contact pad is attached to the wall portion.
4. The hot runner apparatus of claim 2 , wherein the contact pad is attached to the respective sub-manifold.
5. The hot runner apparatus of claim 2 , wherein the contact pad comprises an annular portion for abutting a surface for reducing heat transfer through the contact pad to the surface.
6. The hot runner apparatus of claim 2 , wherein the contact pad is positioned between a recess in the wall portion and the respective sub-manifold.
7. The hot runner apparatus of claim 6 , wherein the hollow region is in communication with the pocket via a cutout in the wall portion distal from a top surface of the wall portion.
8. The hot runner apparatus of claim 2 , wherein the contact pad comprises a material less thermally conductive than the respective sub-manifold and the mold plate.
9. The hot runner apparatus of claim 1 , further comprising a protrusion extending from each sub-manifold, the protrusion being urged against the wall portion during thermal expansion.
10. The hot runner apparatus of claim 1 , further comprising a protrusion extending from the wall portion, each sub-manifold being urged against the protrusion when the bridge manifold and the sub-manifolds thermally expand.
11. The hot runner apparatus of claim 1 , wherein the wall portion is at least 40 millimeters thick.
12. The hot runner apparatus of claim 1 , wherein each sub-manifold comprises a sub-manifold lateral wall facing a bridge manifold lateral wall when the respective sub-manifolds abuts the bridge manifold, the sub-manifold lateral wall and the bridge manifold lateral wall defining at least one gap between the sub-manifold and the bridge manifold.
13. The hot runner apparatus of claim 1 , wherein the mold plate comprises a manifold plate connected to a frame plate, the frame plate forming a perimeter wall of the pocket, the perimeter wall comprising the opposing walls and another pair of opposing walls.
14. The hot runner apparatus of claim 1 , wherein a horizontal cross-sectional shape of the hollow region comprises a rounded rectangle.
15. The hot runner apparatus of claim 1 , wherein the wall portion is concave relative to the hollow region.
16. The hot runner apparatus of claim 15 , further comprising a contact pad positioned between the wall portion and the respective sub-manifold.
17. The hot runner apparatus of claim 16 , wherein the contact pad is attached to the wall portion.
18. The hot runner apparatus of claim 16 , wherein the contact pad is attached to the respective sub-manifold.
19. The hot runner apparatus of claim 16 , wherein the contact pad comprises a material less thermally conductive than the respective sub-manifold and the mold plate.
20. The hot runner apparatus of claim 15 , wherein the hollow region is in communication with the pocket via a cutout in the wall portion distal from a top surface of the wall portion.