Side-edge mountable parallel optical communications module, an optical communications system that incorporates the module, and a method
View Patent ↗A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth.
1. An optical communications system comprising:
a motherboard printed circuit board (PCB) having at least upper and lower surfaces that are generally parallel to one another;
at least a first edge card connector mounted on the upper surface of the motherboard PCB, the first edge card connector having at least first and second side walls that face one another and that are separated from one another by an air gap that forms a slot in the edge card connector, the edge card connector having electrical contacts disposed on at least one of the first and second side walls inside of the slot;
at least a first parallel optical communications module (POCM) comprising a first module PCB having at least first and second parallel optical communications sub-modules (POCSMs) mounted thereon and electrically interconnected with the module PCB, a lower side edge of the first module PCB having electrical contacts thereon and being disposed within the slot of the first edge card connector such that the electrical contacts disposed on the lower side edge of the first module PCB are in contact with the electrical contacts of the first edge card connector, the lower side edge of the first module PCB is parallel to the upper surface of the motherboard PCB, and a plane of the first module PCB is oriented perpendicular to the upper surface of the motherboard, wherein the first and second POCSMs are mounted at an angle between zero and 90 degrees with respect to the lower side edge of the first module PCB; and
a first metal housing that substantially surrounds the first POCM, a wall of the first metal housing having an opening formed therein through which ends of at least first and second optical fiber ribbon cables pass in an orientation stacked together and substantially perpendicular to the wall, the first and second optical fiber ribbon cables curving in an arcuate shape within the housing between an orientation substantially perpendicular to the wall and the POCSMs, the ends of the first and second optical fiber ribbon cables being oriented at the angle at which the first and second POCSMs are mounted and being connected to first and second POCSMs, respectively, the first metal housing acting as an electromagnetic interference (EMI) shield for the first POCM and protecting the first module PCB and the first and second POCSMs from an environment surrounding the POCM.
2. The optical communications system of claim 1 , further comprising:
at least a second edge card connector mounted on the upper surface of the motherboard PCB beside the first edge card connector and spaced apart from the first edge card connector, the second edge card connector having at least first and second side walls that face one another and that are separated from one another by an air gap that forms a slot in the second edge card connector, the second edge card connector having electrical contacts disposed on at least one of the first and second side walls inside of the slot of the second edge card connector;
at least a second POCM comprising a second module PCB having at least third and fourth POCSMs mounted thereon and electrically interconnected with the second module PCB, a lower side edge of the second module PCB having electrical contacts thereon and being disposed within the slot of the second edge card connector such that the electrical contacts disposed on the lower side edge of the second module PCB are in contact with the electrical contacts of the second edge card connector; and
a second metal housing that substantially surrounds the second POCM, the second metal housing having an opening formed therein through which ends of at least third and fourth optical fiber ribbon cables pass, the ends of the third and fourth optical fiber ribbon cables being connected to the third and fourth POCSMs, respectively, the second metal housing acting as an EMI shield for the second POCM and protecting the second module PCB and the third and fourth POCSMs from an environment surrounding the second POCM.
3. The optical communications system of claim 2 , further comprising:
at least first and second EMI gaskets, the first EMI gasket being disposed in between an inner side wall of the first metal housing and the first and second POCSMs, the second EMI gasket being disposed in between an inner side wall of the second metal housing and the third and fourth POCSMs, wherein the first and second EMI gaskets act as additional EMI shields for the first and second POCMs.
4. The optical communications system of claim 2 , wherein the first and second module PCBs each have first and second vertical side edges that are substantially parallel to one another, the first and second vertical side edges of the first and second module PCBs being substantially perpendicular to the lower side edges of the first and second module PCBs, respectively, and wherein the first and second POCSMs are mounted at an angle to the first and second vertical side edges of the first module PCB that is greater than zero degrees and less than ninety degrees, and wherein the third and fourth POCSMs are mounted at an angle to the first and second vertical side edges of the second module PCB that is greater than zero degrees and less than ninety degrees.
5. The optical communications system of claim 2 , wherein the first and second POCSMs are mounted at an angle to the first and second vertical side edges of the first module PCB that is between about thirty degrees and about sixty degrees, and wherein the third and fourth POCSMs are mounted at an angle to the first and second vertical side edges of the second module PCB that is between about thirty degrees and about sixty degrees.
6. The optical communications system of claim 2 , wherein the first, second, third, and fourth POCSMs each have at least a first laser diode driver integrated circuit (IC) chip and at least first, second, third, and fourth vertical cavity surface emitting laser diode (VCSEL) chips, each VCSEL chip having at least three vertical cavity surface emitting laser diodes (VCSELs) such that each POCSM has at least twelve transmit channels.
7. The optical communications system of claim 2 , wherein at least first and second outer side walls of the first and second metal housings have fins on them to facilitate convection cooling.
8. An optical communications system comprising:
a motherboard printed circuit board (PCB) having at least upper and lower surfaces that are generally parallel to one another;
at least a first edge card connector mounted on the upper surface of the motherboard PCB, the first edge card connector having at least first and second side walls that face one another and that are separated from one another by an air gap that forms a slot in the edge card connector, the edge card connector having electrical contacts disposed on at least one of the first and second side walls inside of the slot; and
at least a first parallel optical communications module (POCM) comprising at least a first and second parallel optical communications sub-modules (POCSMs) mounted on substantially co-planar first and second module PCBs, respectively, and electrically interconnected with the first and second module PCBs, respectively, wherein lower side edges of the first and second module PCBs having electrical contacts thereon and are disposed within the slot of the first edge card connector such that the electrical contacts disposed on the lower side edges of the first and second module PCBs are in contact with the electrical contacts of the first edge card connector, the lower side edge of the first module PCB is parallel to the upper surface of the motherboard PCB, and a plane of the first module PCB is oriented perpendicular to the upper surface of the motherboard PCB, wherein the first and second POCSMs are mounted at an angle between zero and 90 degrees with respect to the lower side edge of the first module PCB; and
a first metal housing that substantially surrounds the first POCM, the first metal housing having an opening formed therein through which ends of at least first and second optical fiber ribbon cables pass in an orientation stacked together and substantially perpendicular to the wall, the first and second optical fiber ribbon cables curving in an arcuate shape within the housing between an orientation substantially perpendicular to the wall and the POCSMs, the ends of the first and second optical fiber ribbon cables being oriented at the angle at which the first and second POCSMs are mounted and being connected to the first and second POCSMs, respectively, the first metal housing acting as an electromagnetic interference (EMI) shield for the first POCM and protecting the first and second module PCBs and the first and second POCSMs from an environment surrounding the first POCM.
9. The optical communications system of claim 8 , further comprising:
at least a second edge card connector mounted on the upper surface of the motherboard PCB beside the first edge card connector and spaced apart from the first edge card connector, the second edge card connector having at least first and second side walls that face one another and that are separated from one another by an air gap that forms a slot in the second edge card connector, the second edge card connector having electrical contacts disposed on at least one of the first and second side walls inside of the slot of the second edge card connector; and
at least a second POCM comprising at least third and fourth POCSMs mounted on third and fourth module PCBs, respectively, and electrically interconnected with the third and fourth module PCBs, respectively, wherein lower side edges of the third and fourth module PCBs have electrical contacts thereon and are disposed within the slot of the second edge card connector such that the electrical contacts disposed on the lower side edges of the third and fourth module PCBs are in contact with the electrical contacts of the second edge card connector.
10. The optical communications system of claim 8 , further comprising:
at least a first metal heat dissipation plate secured to bottom surfaces of the first and second module PCBs for dissipating heat produced by the first and second POCSMs.
11. The optical communications system of claim 8 , further comprising:
at least a second metal heat dissipation plate secured to bottom surfaces of the third and fourth module PCBs for dissipating heat produced by the third and fourth POCSMs.
12. The optical communications system of claim 9 , further comprising:
a second metal housing that substantially surrounds the second POCM, the second metal housing having an opening formed therein through which ends of at least third and fourth optical fiber ribbon cables pass, the ends of the third and fourth optical fiber ribbon cables being connected to the third and fourth POCSMs, respectively, the second metal housing acting as an electromagnetic interference (EMI) shield for the second POCM and protecting the third and fourth module PCBs and the third and fourth POCSMs from an environment surrounding the second POCM.
13. The optical communications system of claim 8 , wherein the first and second module PCBs each have first and second vertical side edges that are substantially parallel to one another, the first and second vertical side edges of the first and second module PCBs being substantially perpendicular to the lower side edges of the first and second module PCBs, respectively, and wherein the first and second POCSMs are mounted at an angle to the first and second vertical side edges of the first and second module PCBs, respectively, that is greater than zero degrees and less than ninety degrees.
14. The optical communications system of claim 13 , wherein the angle is between about thirty degrees and about sixty degrees.
15. The optical communications system of claim 9 , wherein the third and fourth module PCBs each have first and second vertical side edges that are substantially parallel to one another, the first and second vertical side edges of the third and fourth module PCBs being substantially perpendicular to the lower side edges of the third and fourth module PCBs, respectively, and wherein the third and fourth POCSMs are mounted at an angle to the first and second vertical side edges of the third and fourth module PCBs, respectively, that is greater than zero degrees and less than ninety degrees.
16. The optical communications system of claim 15 , wherein the angle is between about thirty degrees and about sixty degrees.
17. The optical communications system of claim 9 , wherein the first, second, third, and fourth POCSMs each have at least a first laser diode driver integrated circuit (IC) chip and at least first, second, third, and fourth vertical cavity surface emitting laser diode (VCSEL) chips, each VCSEL chip having at least three vertical cavity surface emitting laser diodes (VCSELs) such that each POCSM has at least twelve transmit channels.
18. A method for high-density mounting of parallel optical communications modules (POCMs) in an optical communications system comprising:
providing a motherboard printed circuit board (PCB) having at least upper and lower surfaces that are generally parallel to one another;
mounting at least a first edge card connector on the upper surface of the motherboard PCB, the first edge card connector having at least first and second side walls that face one another and that are separated from one another by an air gap that forms a slot in the edge card connector, the edge card connector having electrical contacts disposed on at least one of the first and second side walls inside of the slot;
providing at least a first POCM comprising a first module PCB having at least first and second parallel optical communications sub-modules (POCSMs) mounted thereon and electrically interconnected with the first module PCB, a lower side edge of the first module PCB having electrical contacts thereon; and
inserting the lower side edge of the first module PCB into the slot of the first edge card connector such that the electrical contacts disposed on the lower side edge of the first module PCB are in contact with the electrical contacts of the first edge card connector, the lower side edge of the first module PCB is parallel to the upper surface of the motherboard PCB, and a plane of the first module PCB is oriented perpendicular to the upper surface of the motherboard, wherein the first and second POCSMs are mounted at an angle between zero and 90 degrees with respect to the lower side edge of the first module PCB; and
the first POCM is substantially surrounded by a first metal housing, the first metal housing having an opening formed in a wall thereof through which ends of at least first and second optical fiber ribbon cables pass in an orientation stacked together and substantially perpendicular to the wall, the first and second optical fiber ribbon cables curving in an arcuate shape within the housing between an orientation substantially perpendicular to the wall and the POCSMs, the ends of the first and second optical fiber ribbon cables being oriented at the angle at which the first and second POCSMs are mounted and being connected to the first and second POCSMs, respectively, the first metal housing acting as an electromagnetic interference (EMI) shield for the first POCM and protecting the first module PCB and the first and second POCSMs from an environment surrounding the POCM.
19. The method of claim 18 , further comprising:
mounting at least a second edge card connector on the upper surface of the motherboard PCB beside the first edge card connector and spaced apart from the first edge card connector, the second edge card connector having at least first and second side walls that face one another and that are separated from one another by an air gap that forms a slot in the second edge card connector, the second edge card connector having electrical contacts disposed on at least one of the first and second side walls inside of the slot of the second edge card connector;
providing at least a second POCM comprising a second module PCB having at least third and fourth POCSMs mounted thereon and electrically interconnected with the second module PCB, a lower side edge of the second module PCB having electrical contacts thereon; and
inserting the lower side edge of the second module PCB within the slot of the second edge card connector such that the electrical contacts disposed on the lower side edge of the second module PCB are in contact with the electrical contacts of the second edge card connector.
20. The method of claim 19 , wherein the second POCM is substantially surrounded by a second metal housing, the second metal housing having an opening formed therein through which ends of at least third and fourth optical fiber ribbon cables pass, the ends of the third and fourth optical fiber ribbon cables being connected to the third and fourth POCSMs, respectively, the second metal housing acting as an EMI shield for the second POCM and protecting the second module PCB and the third and fourth POCSMs from an environment surrounding the second POCM.
21. The method of claim 19 , wherein the first and second module PCBs each have first and second vertical side edges that are substantially parallel to one another, the first and second vertical side edges of the first and second module PCBs being substantially perpendicular to the lower side edges of the first and second module PCBs, respectively, and wherein the first and second POCSMs are mounted at an angle to the first and second vertical side edges of the first module PCB that is greater than zero degrees and less than ninety degrees, and wherein the third and fourth POCSMs are mounted at an angle to the first and second vertical side edges of the second module PCB that is greater than zero degrees and less than ninety degrees.
22. The method of claim 21 , wherein the first and second POCSMs are mounted at an angle to the first and second vertical side edges of the first module PCB that is between about thirty degrees and about sixty degrees, and wherein the third and fourth POCSMs are mounted at an angle to the first and second vertical side edges of the second module PCB that is between about thirty degrees and about sixty degrees.
23. The method of claim 19 , wherein the first, second, third, and fourth POCSMs each have at least a first laser diode driver integrated circuit (IC) chip and at least first, second, third, and fourth vertical cavity surface emitting laser diode (VCSEL) chips, each VCSEL chip having at least three vertical cavity surface emitting laser diodes (VCSELs) such that each POCSM has at least twelve transmit channels.
24. A method for high-density mounting of parallel optical communications modules (POCMs) in an optical communications system comprising:
providing a motherboard printed circuit board (PCB) having at least upper and lower surfaces that are generally parallel to one another;
mounting at least a first edge card connector on the upper surface of the motherboard PCB, the first edge card connector having at least first and second side walls that face one another and that are separated from one another by an air gap that forms a slot in the edge card connector, the edge card connector having electrical contacts disposed on at least one of the first and second side walls inside of the slot;
providing at least a first POCM comprising at least a first and second parallel optical communications sub-modules (POCSMs) mounted on substantially co-planar first and second module PCBs, respectively, and electrically interconnected with the first and second module PCBs, respectively, wherein lower side edges of the first and second module PCBs having electrical contacts thereon; and
inserting the lower side edges of the first and second module PCBs into the slot of the first edge card connector such that the electrical contacts disposed on the lower side edges of the first and second module PCBs are in contact with the electrical contacts of the first edge card connector and the lower side edge of the first module PCB is parallel to the upper surface of the motherboard PCB, and a plane of the first module PCB is oriented perpendicular to the upper surface of the motherboard, wherein the first and second POCSMs are mounted at an angle between zero and 90 degrees with respect to the lower side edge of the first module PCB; and
the first POCM is substantially surrounded by a first metal housing, the first metal housing having an opening formed in a wall thereof through which ends of at least first and second optical fiber ribbon cables pass in an orientation stacked together and substantially perpendicular to the wall, the first and second optical fiber ribbon cables curving in an arcuate shape within the housing between an orientation substantially perpendicular to the wall and the POCSMs, the ends of the first and second optical fiber ribbon cables being oriented at the angle at which the first and second POCSMs are mounted and being connected to the first and second POCSMs, respectively, the first metal housing acting as an electromagnetic interference (EMI) shield for the first POCM and protecting the first module PCB and the first and second POCSMs from an environment surrounding the POCM.
25. The method of claim 24 , further comprising:
mounting at least a second edge card connector on the upper surface of the motherboard PCB beside the first edge card connector and spaced apart from the first edge card connector, the second edge card connector having at least first and second side walls that face one another and that are separated from one another by an air gap that forms a slot in the second edge card connector, the second edge card connector having electrical contacts disposed on at least one of the first and second side walls inside of the slot of the second edge card connector;
providing at least a second POCM comprising at least third and fourth POCSMs mounted on third and fourth module PCBs, respectively, and electrically interconnected with the third and fourth module PCBs, respectively, wherein lower side edges of the third and fourth module PCBs have electrical contacts thereon; and
inserting the lower side edges of the third and fourth module PCBs into the slot of the second edge card connector such that the electrical contacts disposed on the lower side edges of the third and fourth module PCBs are in contact with the electrical contacts of the second edge card connector.
26. The method of claim 25 , further comprising:
securing at least a first metal heat dissipation plate to bottom surfaces of the first and second module PCBs for dissipating heat produced by the first and second POCSMs.
27. The method of claim 26 , further comprising:
securing at least a second metal heat dissipation plate to bottom surfaces of the third and fourth module PCBs for dissipating heat produced by the third and fourth POCSMs.
28. The method of claim 24 , wherein the first and second module PCBs each have first and second vertical side edges that are substantially parallel to one another, the first and second vertical side edges of the first and second module PCBs being substantially perpendicular to the lower side edges of the first and second module PCBs, respectively, and wherein the first and second POCSMs are mounted at an angle to the first and second vertical side edges of the first and second module PCBs, respectively, that is greater than zero degrees and less than ninety degrees.
29. The method of claim 28 , wherein the angle is between about thirty degrees and about sixty degrees.
30. The method of claim 25 , wherein the third and fourth module PCBs each have first and second vertical side edges that are substantially parallel to one another, the first and second vertical side edges of the third and fourth module PCBs being substantially perpendicular to the lower side edges of the third and fourth module PCBs, respectively, and wherein the third and fourth POCSMs are mounted at an angle to the first and second vertical side edges of the third and fourth module PCBs, respectively, that is greater than zero degrees and less than ninety degrees.
31. The method of claim 30 , wherein the angle is between about thirty degrees and about sixty degrees.
32. The method of claim 25 , wherein the first, second, third, and fourth POCSMs each have at least a first laser diode driver integrated circuit (IC) chip and at least first, second, third, and fourth vertical cavity surface emitting laser diode (VCSEL) chips, each VCSEL chip having at least three vertical cavity surface emitting laser diodes (VCSELs) such that each POCSM has at least twelve transmit channels.