IP Library Granted Patent US 8,529,019
Granted Patent B2
US 8,529,019 · App. 13/562,869 · Granted Sep 10, 2013

Pattern film formation method and organic EL device manufacturing method

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Quick Facts
Patent No.
US 8,529,019
App. No.
13/562,869
Granted
Sep 10, 2013
Kind
B2
Abstract

A pattern film formation method includes: discharging liquid from at least one first discharge head toward a first pattern film formation region on a substrate; and discharging liquid from a plurality of second discharge heads toward a second pattern film formation region that is narrower than the first pattern film formation region. A number of the second discharge heads is greater than a number of the at least one first discharge head.

Claims (26)

1. A pattern film formation method comprising:

discharging liquid from at least one first discharge head toward a first pattern film formation region on a substrate; and

discharging liquid from a plurality of second discharge heads toward a second pattern film formation region that is narrower than the first pattern film formation region,

a number of the second discharge heads being greater than a number of the at least one first discharge head.

2. The pattern film formation method according to claim 1 , further comprising

moving one of the substrate and the at least one first discharge head relative to the other of the substrate and the at least one first discharge head in a first direction, and

moving one of the substrate and the second discharge heads relative to the other of the substrate and the second discharge heads in a second direction.

3. The pattern film formation method according to claim 2 , wherein

the second direction is a direction along which the second discharge heads are aligned.

4. The pattern film formation method according to claim 2 , wherein

the number of the second discharge heads is equal to or greater than a nth multiple of the number of the at least one first discharge head when a length of the second pattern film formation region with respect to the second direction is 1/n of a length of the first pattern film formation region with respect to the first direction.

5. The pattern film formation method according to claim 3 , wherein

the number of the second discharge heads is equal to or greater than a nth multiple of the number of the at least one first discharge head when a length of the second pattern film formation region with respect to the second direction is 1/n of a length of the first pattern film formation region with respect to the first direction.

6. An organic EL device manufacturing method comprising:

discharging liquid having a first color from at least one first discharge head toward a first pattern film formation region on a substrate; and

discharging liquid having a second color from a plurality of second discharge heads toward a second pattern film formation region that is narrower than the first pattern film formation region,

a number of the second discharge heads being greater than a number of the at least one first discharge head.

7. The organic EL device manufacturing method according to claim 6 , further comprising

moving one of the substrate and the at least one first discharge head relative to the other of the substrate and the at least one first discharge head in a first direction, and

moving one of the substrate and the second discharge heads relative to the other of the substrate and the second discharge heads in a second direction.

8. The organic EL device manufacturing method according to claim 7 , wherein

the second direction is a direction along which the second discharge heads are aligned.

9. The organic EL device manufacturing method according to claim 7 , wherein

the number of the second discharge heads is equal to or greater than a nth multiple of the number of the at least one first discharge head when a length of the second pattern film formation region with respect to the second direction is 1/n of a length of the first pattern film formation region with respect to the first direction.

10. The organic EL device manufacturing method according to claim 8 , wherein

the number of the second discharge heads is equal to or greater than a nth multiple of the number of the at least one first discharge head when a length of the second pattern film formation region with respect to the second direction is 1/n of a length of the first pattern film formation region with respect to the first direction.

Assignments (4)
SECURITY AGREEMENT Recorded Jan 23, 2020
From: KATEEVA, INC.
To: SINO XIN JI LIMITED
Reel/Frame 051682/0212 →
RELEASE OF SECURITY INTEREST Recorded Jan 22, 2020
From: EAST WEST BANK, A CALIFORNIA BANKING CORPORATION
To: KATEEVA, INC.
Reel/Frame 051664/0802 →
SECURITY INTEREST Recorded Apr 4, 2019
From: KATEEVA, INC.
To: EAST WEST BANK
Reel/Frame 048806/0639 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2018
From: SEIKO EPSON CORPORATION
To: KATEEVA, INC.
Reel/Frame 045742/0559 →