Power control for linear and class AB power amplifiers
View Patent ↗Aspects of a system for improving efficiency over power control for linear and class AB power amplifiers may include a current source circuit that enables determination of a bias current level for a PA circuit within an IC die based on an amplitude of an input modulation signal. The PA circuit may enable generation of an output signal based on a differential input signal and the input modulation signal to the current source circuit. A generated bias voltage may be applied to a transformer external to the IC die, but internal to an IC package containing the IC die and/or a circuit board containing the IC package. One or more amplifier bias voltage levels may be applied to the PA circuit wherein the amplifier bias voltage levels may be derived from the generated bias voltage level and/or the determined bias current level.
1. A method for amplifying signals in a wireless communication system, said method comprising:
determining a bias current for an amplifier within an integrated circuit (IC) die based on an input modulation signal;
generating an output signal from said amplifier based on a differential input signal to said amplifier and said input modulation signal;
applying a generated bias voltage to a transformer;
deriving at least one amplifier bias voltage from one or both of said generated bias voltage and said bias current;
applying said at least one amplifier bias voltage to said amplifier.
2. The method of claim 1 , wherein said differential input signal comprises signal phase information.
3. The method of claim 1 , wherein said input modulation signal comprises signal amplitude information.
4. The method of claim 1 , wherein a phase of said output signal from said amplifier is based on said differential input signal, and an amplitude of said output signal from said amplifier is based on said input modulation signal.
5. The method of claim 1 , further comprising inputting said input modulation signal to a current supply.
6. The method of claim 5 , wherein said current supply generates said bias current.
7. The method of claim 1 , comprising selecting said generated bias voltage from a look up table.
8. The method of claim 1 , wherein said transformer is external to said IC die.
9. The method of claim 1 , wherein said transformer is internal to an IC package containing said IC die.
10. The method of claim 1 , wherein said transformer is internal to a circuit board having an IC package containing said IC die.
11. A system for amplifying signals in a wireless communication system, the system comprising:
at least one circuit the enables determination of a bias current for an amplifier within an integrated circuit (IC) die based on an input modulation signal;
said at least one circuit the enables generation of an output signal from said amplifier based on a differential input signal to said amplifier and said input modulation signal;
wherein a generated bias voltage is applied to a transformer, wherein at least one amplifier bias voltage is derived from one or both of said generated bias voltage and said bias current, and wherein said at least one amplifier bias voltage is applied to said amplifier.
12. The system of claim 11 , wherein said differential input signal comprises signal phase information.
13. The system of claim 11 , wherein said input modulation signal comprises signal amplitude information.
14. The system of claim 11 , wherein a phase of said output signal from said amplifier is based on said differential input signal, and an amplitude of said output signal from said amplifier is based on said input modulation signal.
15. The system of claim 11 , wherein said input modulation signal is inputted to a current supply.
16. The system of claim 15 , wherein said current supply generates said bias current.
17. The system of claim 11 , wherein said generated bias voltage is selected from a look up table.
18. The system of claim 11 , wherein said transformer is external to said IC die.
19. The system of claim 11 , wherein said transformer is internal to an IC package containing said IC die.
20. The system of claim 11 , wherein said transformer is internal to a circuit board having an IC package containing said IC die.