Substrate connection type module structure
View Patent ↗The present invention provides a substrate connection type module structure comprising a substrate with a through hole structure and a first contact pad. A chip is configured on the through hole structure of the substrate, with a second contact pad and a sensing area. The first contact pad is coupled to the second contact pad via a wire. A second substrate is electrically connected to the first substrate. The second substrate and the chip are located at the same layer. A lens holder is disposed on the substrate, and a lens is located on the top of the lens holder. A transparent material is disposed within the lens holder. The lens is substantially aligning to the transparent material and the sensing area.
1. A substrate connection type module structure, comprising:
a substrate, with a through hole structure and a first contact pad, wherein said through hole structure is located in a first portion of the substrate;
a chip disposed in said through hole structure, with a second contact pad and a sensing area, and wherein said first contact pad is electrically connected to said second contact pad via a wire;
wherein said substrate and said chip are located at the same level or layer and there is no overlapping area between said substrate and said chip; and
a lens holder disposed on said substrate, and a lens located on said lens holder, substantially aligning to said sensing area;
wherein said first portion of said substrate, said chip and said lens holder construct a cubic module structure, and a second portion of said substrate extending to outside of said cubic module structure.
2. The module structure of claim 1 , wherein said first portion and said second portion of said substrate are a printed circuit board or a flexible printed circuit board, and wherein said printed circuit board or said flexible printed circuit board has its trace formed thereon, respectively.
3. The module structure of claim 1 , wherein said lens holder is adhered to said substrate via an adhesion layer.
4. The module structure of claim 1 , further comprising a first adhesion layer formed a lower surface of said chip and said substrate, and a material layer for said first adhesion layer formed thereon.
5. The module structure of claim 4 , wherein material of said material layer comprises a heat dissipation (sink) material, non-transparent material or anti-EMI (electromagnetic interference) material, and the combination thereof.
6. The module structure of claim 4 , further comprising a second adhesion layer formed on a lower surface of said chip and on a top surface of said first adhesion layer.
7. The module structure of claim 5 , further comprising a second adhesion layer formed on a lower surface of said chip and on a top surface of said first adhesion layer.
8. The module structure of claim 5 , further comprising a transparent material disposed on said lens holder.
9. The module structure of claim 8 , wherein said first portion and said second portion of said substrate are a printed circuit board or a flexible printed circuit board, and wherein said printed circuit board or said flexible printed circuit board has its trace formed thereon, respectively.
10. The module structure of claim 8 , wherein said lens holder is adhered to said substrate via an adhesion layer.
11. The module structure of claim 8 , further comprising a passivation layer formed on said substrate and said chip.
12. The module structure of claim 1 , further comprising a transparent material disposed on said lens holder.
13. The module structure of claim 12 , wherein a first portion of said substrate, said chip and said lens holder construct a cubic module structure, and a second portion of said substrate extending to outside of said cubic module structure.
14. The module structure of claim 13 , wherein said first portion and said second portion of said substrate are a printed circuit board or a flexible printed circuit board, and wherein said printed circuit board or said flexible printed circuit board has its trace formed thereon, respectively.
15. The module structure of claim 12 , wherein said lens holder is adhered to said substrate via an adhesion layer.
16. The module structure of claim 12 , further comprising a passivation layer formed on said substrate and said chip.