IP Library Patent Application 13566406
Patent Application
App. No. 13/566,406

BIPOLAR PLATE ASSEMBLY FOR USE IN A FUEL CELL

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
13/566,406
Abstract

A bipolar plate assembly includes a first material and a second material. The second material has an in-plane thermal conductivity greater than the first material. The second material has a width and a thickness. A ratio of the width to the thickness of the second material is between 50 and 400.

Claims (24)

1 . A bipolar plate assembly comprising a first material and a second material, the second material having an in-plane thermal conductivity greater than the first material, the second material having a width and a thickness, a ratio of the width to the thickness of the second material being between 50 and 400.

2 . The bipolar plate assembly as set forth in claim 1 wherein the ratio of the width to the thickness of the second material is between 190 and 380.

3 . The bipolar plate assembly as set forth in claim 1 wherein the in-plane thermal conductivity of the second material is greater than 100 W/mK.

4 . The bipolar plate assembly as set forth in claim 3 wherein the in-plane thermal conductivity of the second material is greater than 300 W/mK.

5 . The bipolar plate assembly as set forth in claim 4 wherein the in-plane thermal conductivity of the second material is greater than 500 W/mK.

6 . The bipolar plate assembly as set forth in claim 1 wherein the in-plane thermal conductivity of the first material is less than 60 W/mK.

7 . The bipolar plate assembly as set forth in claim 6 wherein the in-plane thermal conductivity of the first material is less than 30 W/mK.

8 . A bipolar plate assembly having a longitudinal axis and a transverse axis, the assembly comprising:

at least one bipolar plate being formed from a first material; and

at least one insert member being formed from a second material, the second material having an in-plane thermal conductivity greater than the first material and adapted to conduct heat away from the longitudinal axis of the bipolar plate assembly.

9 . The bipolar plate assembly as set forth in claim 8 wherein the at least one bipolar plate comprises a first bipolar plate and a second bipolar plate, the at least one insert member being disposed between the first and second bipolar plates.

10 . The bipolar plate assembly as set forth in claim 9 further comprising a front face, a back face, a pair of longitudinal side faces, and a pair of lateral side faces.

11 . The bipolar plate assembly as set forth in claim 10 wherein the first bipolar plate defines the front face and the second bipolar plate defines the back face.

12 . The bipolar plate assembly as set forth in claim 11 wherein the at least one insert member defines at least a portion of one of the longitudinal side faces, the insert member being adapted to conduct heat towards the longitudinal side face defined at least in part by the at least one insert member.

13 . The bipolar plate assembly as set forth in claim 12 wherein the at least one insert member defines at least a portion of both of the longitudinal side faces, the insert member being adapted to conduct heat toward both of the longitudinal side faces.

14 . The bipolar plate assembly as set forth in claim 8 wherein the at least one bipolar plate is molded from the first material.

15 . The bipolar plate assembly as set forth in claim 8 wherein the at least one insert member is die cut from the second material.

16 . A bipolar plate assembly comprising:

at least one bipolar plate being formed from a first material, the first material having a thermal conductivity less than 60 W/mK; and

at least one insert member being formed from a second material, the second material having an in-plane thermal conductivity greater than greater than 100 W/mK.

17 . The bipolar plate assembly as set forth in claim 16 wherein the in-plane thermal conductivity of the first material is less than 30 W/mK and the in-plane thermal conductivity of the second material is greater than 300 W/mK.

18 . The bipolar plate assembly as set forth in claim 17 wherein the in-plane thermal conductivity of the first material is less than 10 W/mK and the in-plane thermal conductivity of the second material is greater than 500 W/mK.

19 . The bipolar plate assembly as set forth in claim 16 wherein the at least one bipolar plate comprises a first bipolar plate and a second bipolar plate, the at least one insert member being disposed between the first and second bipolar plates.

20 . The bipolar plate assembly as set forth in claim 19 wherein the first ands second bipolar plates cooperatively define an interior chamber, the at least one insert member being disposed within the interior chamber.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2013
From: ENERFUEL, INC.
To: VPJP, LLC
Reel/Frame 031768/0538 →
RELEASE OF SECURITY INTEREST Recorded Nov 21, 2013
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: ENERFUEL, INC.; ENER1, INC.; ENERDEL, INC.; NANOENER, INC.
Reel/Frame 031693/0964 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2012
From: PAVLIK, THOMAS; BRAUN, JAMES; GRAHAM, MATTHEW
To: ENERFUEL, INC.
Reel/Frame 028728/0315 →