Aluminum plated film and metallic member
View Patent ↗A plating film is provided with enough hardness before anodic oxidation, which is hard to be damaged during handling, and also the production method of the plating film. This problem can be solved by an aluminum plating film with aluminum concentration of 98 wt. % or lower, and with a Vickers hardness of 250 or higher. The hardness is increased by containing oxygen, carbon, sulfur, and a halogen element as impurities. The impurity concentration is controlled by adjusting the current density, the plating temperature, or the plating bath composition.
1. An aluminum plating film formed by electroplating using a plating bath which is constituted by alkylsulfone as a solvent and an anhydrous aluminum trichloride (III) (AlCl 3 ) as a solute, with a micro-Vickers hardness of 250 or higher,
wherein oxygen, carbon, sulfur and chlorine are contained as impurities, with an oxygen concentration of greater than or equal to 1.2 wt. % and less than or equal to 3.0 wt. %, a carbon concentration of greater than or equal to 0.35 wt. % and less than or equal to 0.8 wt. %, a sulfur concentration of greater than or equal to 0.20 wt. % and less than or equal to 1.0 wt. %, a chlorine concentration of greater than or equal to 0.15 wt. % and less than or equal to 1.0 wt. %, and a mean sulfur composition in the aluminum plating film is 1.35 times±30% of a chlorine composition, on a basis of a ratio of atomic concentrations, in the aluminum plating film,
wherein aluminum is the balance so that an aluminum concentration is 98 wt. % or lower, and a total concentration of the impurities is 2 wt. % or higher, and wherein the weight percentages are determined with respect to the total amounts of oxygen, carbon, sulfur, chlorine, and aluminum in the aluminum plating film.
2. A metallic member comprising:
a base material; and
the aluminum plating film according to claim 1 on said base material.
3. The aluminum plating film according to claim 1 , on which anodic oxidation has occurred.
4. An aluminum plating film formed by electroplating using a plating bath which is constituted by alkylsulfone as a solvent and an anhydrous aluminum trichloride (III) (AlCl 3 ) as a solute, with a micro-Vickers hardness of 300 or higher,
wherein oxygen, carbon, sulfur and chlorine are contained as impurities, with an oxygen concentration of greater than or equal to 1.6 wt. % and less than or equal to 3.0 wt. %, a carbon concentration of greater than or equal to 0.45 wt. % and less than or equal to 0.8 wt. %, a sulfur concentration of greater than or equal to 0.35 wt. % and less than or equal to 1.0 wt. %, a chlorine concentration of greater than or equal to 0.30 wt. % and less than or equal to 1.0 wt. %, and a mean sulfur composition in the aluminum plating film is 1.35 times±30% of a chlorine composition, on a basis of a ratio of atomic concentrations, in the aluminum plating film,
wherein aluminum is the balance so that an aluminum concentration is 97 wt. % or lower, and a total concentration of the impurities is 3 wt. % or higher, and wherein the weight percentages are determined with respect to the total amounts of oxygen, carbon, sulfur, chlorine, and aluminum in the aluminum plating film.
5. A metallic member comprising:
a base material; and
the aluminum plating film according to claim 4 on said base material.
6. The aluminum plating film according to claim 4 , on which anodic oxidation has occurred.