Face-down printing apparatus and method
View Patent ↗Film-forming apparatuses, systems, and methods are provided. The apparatus can include a substrate positioning system and a printing array that includes an inkjet printing array and/or a thermal printing array. The positioning system can be a gas-bearing plate system. The positioning system can be configured to move a substrate between a first position, away from the printing array, and a second position, above the printing array. The apparatuses, systems, and methods can be used to manufacture organic light emitting devices (OLEDs), for example, flat panel displays.
1. A film-forming apparatus comprising:
a substrate support comprising a top surface and at least one opening in the top surface;
a gas bearing system comprising a plurality of apertures in the top surface, and a plurality of gas channels extending from the first plurality of apertures into the substrate support and communicating with a manifold, the plurality of apertures surrounding the at least one opening in the top surface; and
a printing array disposed within the at least one opening and including upwardly facing printheads;
wherein the gas bearing system is configured to float a substrate above the top surface while the printing array transfers a film-forming material onto a downwardly facing surface of the substrate.
2. The film-forming apparatus of claim 1 , further comprising a conveyor configured to move a substrate between a first position not over the printing array, and a second position over the printing array.
3. The film-forming apparatus of claim 1 , further comprising a housing over the substrate support, which, with the substrate support, defines a printing chamber in which the printing array prints film-forming material onto a substrate.
4. The film-forming apparatus of claim 3 , further comprising a load-lock chamber in interruptible gaseous communication with the printing chamber.
5. The film-forming apparatus of claim 4 , wherein the substrate can be moved between the load-lock chamber and the printing chamber.
6. The film-forming apparatus of claim 4 , wherein the printing chamber, the load-lock chamber and combinations thereof are configured to provide a controlled environment.
7. The film forming apparatus of claim 6 , wherein the controlled environment comprises an inert gas atmosphere.
8. The film forming apparatus of claim 7 , wherein the inert atmosphere is substantially free of reactive gases.
9. The film forming apparatus of claim 8 , wherein the reactive gases are maintained at less than 100 ppm.
10. The film-forming apparatus of claim 1 , wherein the substrate support comprises a first region for supporting a substrate in the first position, and a second region for supporting a substrate in the second position, and the apparatus further comprises a substrate actuator configured to convey a substrate from the first position to the second position.
11. The film-forming apparatus of claim 10 , wherein the substrate support has a length and the substrate actuator comprises a linear motor disposed along the length of the substrate support.
12. The film-forming apparatus of claim 10 , wherein the substrate actuator comprises an actuator track, an actuator trolley and a substrate holder.
13. The film-forming apparatus of claim 12 , wherein the substrate holder is a vacuum chuck, a set of gripping jaws, at least one suction cup, at least one clamp and combinations thereof.
14. The film-forming apparatus of claim 1 , wherein the printing array comprises an inkjet printing array.
15. The film forming apparatus of claim 14 , wherein the inkjet printing array is configured to print an ink comprising a film-forming material in a carrier liquid.
16. The film forming apparatus of claim 15 , wherein the film forming material is an OLED material.