Conductive film and method for its production
View Patent ↗To provide a method for producing a conductive film with excellent transparency and conductivity by a simple method suitable for large-area production. A method for producing a conductive film comprising a step of placing a template (B), having openings in a mesh structure running from the side that is to contact a substrate (A) through to the back side, on the surface of the substrate (A), and spreading a dispersion (D) of conductive particles (P) on the surface of the substrate (A) on which the template (B) has been placed, and drying it, thereby forming a mesh-like structure (C) of the conductive particles (P) near the points of contact between the substrate (A) and the template (B), and then removing the template (B) from the substrate (A) to form a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
1. A method for producing a conductive film comprising:
placing a template (B), having openings in a mesh structure running from the side that is to contact a substrate (A) through to the back side, on the surface of the substrate (A), and
spreading a dispersion (D) of conductive particles (P) on the surface of the substrate (A) on which the template (B) has been placed, and drying it, thereby forming a mesh-like structure (C) of the conductive particles (P) near the points of contact between the substrate (A) and the template (B),
and then removing the template (B) from the substrate (A) to form a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
2. The method for producing a conductive film according to claim 1 , which comprises supplying a dispersion (D) onto the template (B) after the template (B) has been placed on the surface of the substrate (A), and spreading it on the surface of the substrate (A).
3. A method for producing a conductive film, which comprises spreading a dispersion (D) of conductive particles (P) on the surface of a substrate (A),
placing a template (B), having openings in a mesh structure running from the side that is to contact the substrate (A) through to the back side, over the dispersion (D) that has been developed on the surface of the substrate (A), and drying it, thereby forming a mesh-like structure (C) of the conductive particles (P) near the points of contact between the substrate (A) and the template (B), and then
removing the template (B) from the substrate (A) to form a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
4. The method for producing a conductive film according to any one of claims 1 to 3 , which further comprises conductive treatment after formation of the mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A).
5. The method for producing a conductive film according to claim 4 , wherein the conductive treatment is heating and sintering.
6. The method for producing a conductive film according to claim 1 or claim 3 , which comprises forming a mesh-like structure (C) of the conductive particles (P) on the surface of the substrate (A) and subjecting the mesh-like structure (C) to additional electroplating.
7. A method for producing a conductive film, which comprises forming a mesh-like structure (C) by the method according to claim 1 or claim 3 , and forming a resin layer on the surface of a substrate (A) and releasing the obtained resin layer from the substrate (A) to transfer the mesh-like structure (C) or its conductively treated product onto the surface of the resin layer.
8. A method for producing a conductive film, which comprises forming a mesh-like structure (C) by the method according to claim 1 or claim 3 , and coating a monomer composition (X) or resin composition (Y) onto the surface of a substrate (A), placing a substrate (E) thereover, and then polymerizing (X) if (X) is used, to form a resin layer, and releasing the obtained resin layer from the substrate (A) to transfer the mesh-like structure (C) or its conductively treated product onto the surface of the resin layer.
9. A conductive film produced by the method according to claim 1 or claim 3 .
10. A conductive film according to claim 9 , having a fine pattern formed by a conductor on a substrate surface, the conductive film having the following features (a) to (c):
(a) the fine pattern has a mesh structure;
(b) the line width of the fine pattern is 0.5-6 μm; and
(c) the shape of the cross-section of thin wires of the fine pattern has a segment structure that traces an ascending arc.
11. A conductive film according to claim 10 , wherein the surface resistivity of the conductive film is not greater than 100 Ω/sq.
12. A conductive film obtained by transferring a conductive film according to claim 10 onto a flexible resin film or resin sheet, the conductive film having the following features (a) to (d):
(a) the fine pattern of the conductor after transfer has a mesh structure;
(b) the line width of the fine pattern of the conductor after transfer is 0.5-6 μm;
(c) the light transmittance of the conductive film is 77% or greater; and
(d) the surface resistivity of the conductive film is not greater than 100 Ω/sq.