Method for manufacturing epitaxial crystal substrate, epitaxial crystal substrate and semiconductor device
View Patent ↗Disclosed is a technology of manufacturing, at low cost, an epitaxial crystal substrate provided with a high-quality and uniform epitaxial layer, said technology being useful in the case of growing the epitaxial layer composed of a semiconductor having a lattice constant different from that of the substrate. The substrate, which is composed of a first compound semiconductor, and which has a step-terrace structure on the surface, is used, and on the surface of the substrate, a composition modulation layer composed of a second compound semiconductor is grown by step-flow, while changing the composition in the same terrace. Then, the epitaxial crystal substrate is manufactured by growing, on the composition modulation layer, the epitaxial layer composed of the third compound semiconductor having the lattice constant different from that of the first compound semiconductor.
1. A method for manufacturing an epitaxial crystal substrate, comprising:
preparing a substrate of a first compound semiconductor, the substrate having a step-terrace structure on a surface of the substrate;
growing a second compound semiconductor on the surface of the substrate by a step-flow process while varying the composition of the second compound semiconductor within the same terrace such that the lattice constant of the second compound semiconductor varies stepwise to form a composition modulation layer consisting of a plurality of quantum wires having different lattice constants; and
growing an epitaxial layer of a third compound semiconductor having a lattice constant different of 0.39% or more as a lattice mismatch (Δa/a) from a lattice constant of the first compound semiconductor on the composition modulation layer, wherein the lattice mismatch is defined as
Δ a/a =( a epi −a sub )/ a sub
where a epi is the lattice constant of the epitaxial layer of the third compound semiconductor and a sub is the lattice constant of the first compound semiconductor.
2. The method for manufacturing the epitaxial crystal substrate of claim 1 , wherein the composition modulation layer and the epitaxial layer are grown by metal organic chemical vapor deposition.
3. A method for manufacturing an epitaxial crystal substrate, comprising:
preparing a substrate of a first compound semiconductor, the substrate having a step-terrace structure on a surface of the substrate;
growing a second compound semiconductor on the surface of the substrate by a step-flow process while varying the composition of the composition modulation layer within the same terrace such that the lattice constant of the second compound semiconductor decreases stepwise to form a composition modulation layer consisting of a plurality of quantum wires having different lattice constants; and
growing an epitaxial layer of a third compound semiconductor having a lattice constant different of 0.39% or more as a lattice mismatch (Δa/a) from a lattice constant of the first compound semiconductor on the composition modulation layer, wherein the lattice mismatch is defined as
Δ a/a =( a epi −a sub )/ a sub
where a epi is the lattice constant of the epitaxial layer of the third compound semiconductor and a sub is the lattice constant of the first compound semiconductor.
4. The method for manufacturing the epitaxial crystal substrate of claim 3 , wherein the substrate is an off-angle substrate having orientation that tilts depending on a lattice mismatch of the first compound semiconductor and the third compound semiconductor.
5. The method for manufacturing the epitaxial crystal substrate of claim 4 , wherein the composition modulation layer is deposited until steps in the step-terrace structure substantially disappear.
6. The method for manufacturing the epitaxial crystal substrate of claim 5 , wherein the first compound semiconductor comprises InP, the second compound semiconductor comprises In x Ga 1-x As (0≦x≦1), and the third compound semiconductor comprises InAs y P 1-y (y>0).
7. An epitaxial crystal substrate, comprising:
a substrate of a first compound semiconductor, the substrate having a step-terrace structure on a surface of the substrate;
a composition modulation layer of a second compound semiconductor grown by a step-flow process on the surface of the substrate while varying the compositions of the wires within the same terrace such that the lattice constant of the second compound semiconductor varies stepwise, the composition modulation layer having molecular layers consisting of a plurality of quantum wires having different lattice constants; and
an epitaxial layer on the composition modulation layer, the epitaxial layer consisting of a third compound semiconductor having a lattice constant different of 0.39% or more as a lattice mismatch (Δa/a) from a lattice constant of the first compound semiconductor, wherein the lattice mismatch is defined as
Δ a/a =( a epi −a sub )/ a sub
where a epi is the lattice constant of the epitaxial layer of the third compound semiconductor and a sub is the lattice constant of the first compound semiconductor.
8. The epitaxial crystal substrate of claim 7 , wherein the composition modulation layer and the epitaxial layer are grown by metal organic chemical vapor deposition.
9. A semiconductor device made from the epitaxial crystal substrate of claim 7 , wherein the composition modulation layer and the epitaxial layer are grown by metal organic chemical vapor deposition.
10. An epitaxial crystal substrate, comprising:
a substrate of a first compound semiconductor, the substrate having a step-terrace structure on a surface of the substrate;
a composition modulation layer of a second compound semiconductor grown by a step-flow process on the surface of the substrate while varying the composition of the composition modulation layer within the same terrace such that the lattice constant of the second compound semiconductor decreases stepwise; and
an epitaxial layer on the composition modulation layer, the epitaxial layer consisting of a third compound semiconductor having a lattice constant different of 0.39% or more as a lattice mismatch (Δa/a) from a lattice constant of the first compound semiconductor, wherein the lattice mismatch is defined as
Δ a/a =( a epi −a sub )/ a sub
where a epi is the lattice constant of the epitaxial layer of the third compound semiconductor and a sub is the lattice constant of the first compound semiconductor.
11. A semiconductor device made from the epitaxial crystal substrate of claim 10 , wherein the substrate is an off-angle substrate having orientation that tilts depending on a lattice mismatch of the first compound semiconductor and the third compound semiconductor.
12. The epitaxial crystal substrate of claim 10 , wherein the substrate is an off-angle substrate having orientation that tilts depending on a lattice mismatch of the first compound semiconductor and the third compound semiconductor.
13. A semiconductor device made from the epitaxial crystal substrate of claim 12 , wherein the composition modulation layer is deposited until steps in the step-terrace structure substantially disappear.
14. The epitaxial crystal substrate of claim 12 , wherein the composition modulation layer is deposited until steps in the step-terrace structure substantially disappear.
15. A semiconductor device made from the epitaxial crystal substrate of claim 14 , wherein the first compound semiconductor comprises InP, the second compound semiconductor comprises In x Ga 1-x As (0≦x≦1), and the third compound semiconductor comprises InAs y P 1-y (y>0).
16. The epitaxial crystal substrate of claim 14 , wherein the first compound semiconductor comprises InP, the second compound semiconductor comprises In x Ga 1-x As (0≦x≦1), and the third compound semiconductor comprises InAs y P 1-y (y>0).
17. A semiconductor device made from an epitaxial crystal substrate, comprising:
a substrate of a first compound semiconductor, the substrate having a step-terrace structure on a surface of the substrate;
a composition modulation layer of a second compound semiconductor grown by a step-flow process on the surface of the substrate while varying the compositions of the wires within the same terrace such that the lattice constant of the second compound semiconductor varies stepwise, the composition modulation layer having molecular layers consisting of a plurality of quantum wires having different lattice constants; and
an epitaxial layer on the composition modulation layer, the epitaxial layer consisting of a third compound semiconductor having a lattice constant different of 0.39% or more as a lattice mismatch (Δa/a) from a lattice constant of the first compound semiconductor, wherein the lattice mismatch is defined as
Δ a/a =( a epi −a sub )/ a sub
where a epi is the lattice constant of the epitaxial layer of the third compound semiconductor and a sub is the lattice constant of the first compound semiconductor.
18. A semiconductor device made from an epitaxial crystal substrate, comprising:
a substrate of a first compound semiconductor, the substrate having a step-terrace structure on a surface of the substrate;
a composition modulation layer of a second compound semiconductor grown by a step-flow process on the surface of the substrate while varying the composition of the composition modulation layer within the same terrace such that the lattice constant of the second compound semiconductor decreases stepwise; and
an epitaxial layer on the composition modulation layer, the epitaxial layer consisting of a third compound semiconductor having a lattice constant different of 0.39% or more as a lattice mismatch (Δa/a) from a lattice constant of the first compound semiconductor, wherein the lattice mismatch is defined as
Δ a/a =( a epi −a sub )/ a sub
where a epi is the lattice constant of the epitaxial layer of the third compound semiconductor and a sub is the lattice constant of the first compound semiconductor.