MULTILAYER STRUCTURE, AND A METHOD FOR MAKING THE SAME

1 . A multilayer structure comprising:

at least one substrate layer comprising a polymeric material;

at least one adhesion layer, wherein said adhesion layer is derived from an adhesion promoter composition comprising:

at least one aqueous epoxy dispersion;

at least one hardening agent;

at least one toughening agent;

optionally at least one filler; and

optionally at least one leveling agent; and

at least one surface layer comprising a plating metal;

wherein said adhesion layer is disposed there between said at least one substrate layer and set at least one surface layer.

2 . The multilayer structure of claim 1 , wherein said adhesion layer has a thickness in the range of from 5 to 50 μm.

3 . The multilayer structure of claim 1 , wherein the adhesion promoter composition comprises from 20 to 65 percent by weight of the aqueous epoxy dispersion, from 20 to 50 percent by weight of said hardening agent, and from 0.5 to 10 percent by weight of said toughening agent, based on the total weight of the adhesion promoter composition.

4 . , The multilayer structure of claim 1 , wherein the adhesion promoter composition comprises from 20 to 50 percent by weight of water, based on the total weight of the adhesion promoter composition.

5 . The multilayer structure of claim 1 , wherein the plating metal is selected from the group consisting of Zn, Al, Cr, Cu, Ti, and Ni.

6 . The multilayer structure of claim 1 , wherein the polymeric material is a fiberglass reinforced nylon.

7 . The multilayer structure of claim 1 , wherein the at least one surface layer comprising a plating metal has a thickness in the range of from 5 to 20 μm.

8 . A method for making a multilayer structure comprising the steps of:

providing at least one substrate layer comprising a polymeric material;

providing an adhesion promoter composition comprising:

at least one aqueous epoxy dispersion;

at least one hardening agent;

at least one toughening agent;

optionally at least one filler; and

optionally at least one leveling agent;

applying said adhesion promoter composition to said at least one substrate layer:

thereby forming a coated substrate layer comprising at least one adhesion layer associated with said at least one substrate layer;

vacuum plating at least one surface layer comprising a plating metal onto said coated substrate layer;

thereby forming said multilayer structure, wherein said adhesion layer is disposed therebetween said at least one substrate layer and said at least one surface layer.

9 . An article comprising the multilayer structure of claim 1 .