Chemical-resistant films in high optical quality

1. A process for producing a polyamide film or a polyamide moulding, by extruding a polyamide moulding composition through an extrusion film die comprising a die body and a die lip,

the process comprising:

melting the polyamide moulding composition at a temperature of between 250 and 330° C. in a multi-screw extruder comprising a first extruder zone, a second extruder zone, and a transition region, where the temperature of the second extruder zone and the transition region is 10° C. higher than the first extruder zone;

extruding the melted polyamide moulding composition through a die lip having a temperature of between 290 and 370° C.;

removing an extruded composition having a thickness between 10 μm and 10 mm with at least one roll or at least one belt; and

conveying and at the same time cooling the extruded composition,

wherein:

the composition comprises, in polymerized form, an aromatic, aliphatic or cycloaliphatic dicarboxylic acid and a cycloaliphatic diamine,

the polyamide moulding composition has a carboxyl endgroup fraction, an amino endgroup fraction, or both, of less than 35 mmol/kg, and

a temperature of the die lip, which is an exit region, is higher than a temperature of the die body by 10° C. to 100° C.

2. The process according to claim 1 , wherein the polyamide moulding composition comprises in polymerized form an aliphatic or cycloaliphatic dicarboxylic acid and a cycloaliphatic diamine.

3. The process according to claim 1 , wherein the polyamide moulding composition comprises in polymerized form an aromatic dicarboxylic acid and a cycloaliphatic diamine.

4. The process according to claim 2 , wherein:

the polyamide moulding composition comprises in polymerized form an aliphatic or cycloaliphatic dicarboxylic acid and a cycloaliphatic diamine; and

the polyamide moulding composition has an amino endgroup fraction of less than 35 mmol/kg.

5. The process according to claim 3 , wherein:

the polyamide moulding composition comprises in polymerized form an aromatic dicarboxylic acid and a cycloaliphatic diamine; and

the polyamide moulding composition has an amino endgroup fraction of less than 35 mmol/kg.

6. The process according to claim 1 , wherein a pressure at a die outlet is such that all volatile constituents are fully dissolved.

7. The process according to claim 1 , wherein the die body has a temperature of between 250° C. and 330° C., and the die lip has a temperature of between 290° C. and 370° C.

8. The process according to claim 1 , wherein the polyamide moulding composition has a maximum water content of 0.1% by weight.

9. The process according to claim 1 , wherein the die lip comprises a heating system, which is inserted within the die lip.

10. The process according to claim 9 , wherein the insert heating system is at least one selected from the group consisting of heating cartridges and flat radiators.